DOD-STD-2000-1 Revision B:1986
|
SOLDERING TECHNOLOGY, HIGH QUALITY/HIGH RELIABILITY |
IPC A 25 : A1996
|
MULTIPURPOSE 1 AND 2 SIDED TEST PATTERN |
IEC PAS 62250:2001
|
Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1) |
EN 61189-5-1:2016
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
IPC AJ 820 : A
|
ASSEMBLY AND JOINING HANDBOOK |
IPC 6012 RUSSIAN : C
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
IPC A 610 DANISH : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 SPANISH : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 ROMANIAN : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC 2223 CHINESE : C
|
SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS |
IPC A 600 SWEDISH : H
|
ACCEPTABILITY OF PRINTED BOARDS |
IPC A 600 JAPANESE : H
|
ACCEPTABILITY OF PRINTED BOARDS |
IPC A 600 CHINESE : G
|
ACCEPTABILITY OF PRINTED BOARDS |
IPC 6012 POLISH : C
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
IPC A 600 GERMAN : H
|
ACCEPTABILITY OF PRINTED BOARDS |
IPC D 279 : 0
|
DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES |
IPC A 610 CZECH : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 GERMAN : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 600 POLISH : H
|
ACCEPTABILITY OF PRINTED BOARDS |
IPC A 610 HINDI : E2010
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 600 RUSSIAN : H
|
ACCEPTABILITY OF PRINTED BOARDS |
MIL-STD-2000 Revision A:1991
|
STANDARD REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC A 610 ESTONIAN : E2010
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 POLISH : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 DUTCH : F2014
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 KOREAN : F2014
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC 6010 SERIES : LATEST
|
IPC-6010 QUALIFICATION AND PERFORMANCE SERIES |
IPC 4761 : 0
|
DESIGN GUIDE FOR PROTECTION OF PRINTED BOARD VIA STRUCTURES |
IPC A 610 ITALIAN : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 FRENCH : F
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC 2223 GERMAN : C
|
SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS |
IPC HDBK 830 : A
|
GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS |
IPC A 610 SWEDISH : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 HUNGARIAN : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC 6013 GERMAN : B
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
IPC HDBK 840 : 0
|
SOLDER MASK HANDBOOK |
IPC 6012 FRENCH : C
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
IPC D 949 : 1987
|
RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR, |
IPC MI 660 : 1984
|
INCOMING INSPECTION OF RAW MATERIALS MANUAL |
IPC A 610 CHINESE : F
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 TURKISH : E2010
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 JAPANESE : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 600 FRENCH : H
|
ACCEPTABILITY OF PRINTED BOARDS |
IPC A 610 RUSSIAN : D
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC QE 605 : A
|
PRINTED BOARD QUALITY EVALUATION HANDBOOK |
IPC 6018 CHINESE : B
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD |
IPC A 610 VIETNAMESE : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
MIL-A-28870 Revision A:1990
|
ASSEMBLIES, ELECTRICAL BACKPLANE, PRINTED WIRING, GENERAL SPECIFICATION FOR |
IPC SM 784 : 0
|
GUIDELINES FOR CHIP-ON-BOARD TECHNOLOGY IMPLEMENTATION |
BS EN 61189-5-1:2016
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
IPC 6015 : 0
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR ORGANIC MULTICHIP MODULE MOUNTING AND INTERCONNECTING STRUCTURES |
IEC TR 62866:2014
|
Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing |
NASA MSFC STD 2907 : 2006
|
WORKMANSHIP STANDARD FOR PRINTED WIRING BOARDS |
MIL-STD-2118 Base Document:1984
|
FLEXIBLE AND RIGID FLEX PRINTED WIRING FOR ELECTRONIC EQUIPMENT DESIGN REQUIREMENTS FOR |
IEC 61189-5-1:2016
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
PD IEC/TR 62866:2014
|
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing |
IEC PAS 62249:2001
|
Qualification and performance specification for flexible printed boards |
MIL-STD-2119 Revision A:1990
|
DESIGN REQUIREMENTS FOR PRINTED WIRING ELECTRICAL BACKPLANE ASSEMBLIES |
MIL-C-28859 Revision B:1990
|
CONNECTOR COMPONENT PART, ELECTRICAL BACK PLANE, PRINTED WIRING, GENERAL SPECIFICATION FOR |