DSCC 11001 : 0
|
PRINTED WIRING BOARD, FLEXIBLE, TYPE 1 (SINGLE-SIDED ) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER |
BS EN 61182-2-2:2012
|
Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description |
DOD-STD-2000-1 Revision B:1986
|
SOLDERING TECHNOLOGY, HIGH QUALITY/HIGH RELIABILITY |
MIL-PRF-31032 Revision C:2016
|
Printed Circuit Board/Printed Wiring Board, General Specification for |
IPC 9704 CHINESE : -
|
PRINTED WIRING BOARD STRAIN GAGE TEST GUIDELINE |
DOD-STD-2000-4 Revision A:1987
|
GENERAL PURPOSE SOLDERING REQUIREMENT FOR ELECTRICAL AND ELECTRONIC EQUIPMENT |
MIL-STD-2166 Base Document:1984
|
CONNECTION, ELECTRICAL COMPLAINT PIN |
DOD STD 2000/3 : A NOTICE 1
|
CRITERIA FOR HIGH QUALITY/HIGH RELIABILITY SOLDERING TECHNOLOGY |
IPC 9151 : D
|
PRINTED BOARD PROCESS CAPABILITY, QUALITY, AND RELATIVE RELIABILITY (PCQR[2]) BENCHMARK TEST STANDARD AND DATABASE |
DSCC 11004 : 0
|
PRINTED WIRING BOARD, RIGID FLEX, TYPE 4 (MULTILAYERED) WITH SUPPORTED HOLES, WITH STIFFENER |
MIL P 28809 : A
|
PRINTED WIRING ASSEMBLIES |
MIL-HDBK-1861 Revision B:2013
|
Selection and Use1 of Electrical and Electronic Assemblies, Boards, Cards, and Associated Hardware |
IPC 6017 : 0
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR PRINTED BOARDS CONTAINING EMBEDDED PASSIVE DEVICES |
MIL-STD-1662 Revision C:1992
|
ORDNANCE ALTERATION (ORDALT) INSTRUCTIONS, PREPARATION OF |
MIL P 13949 : G (1) SUPP 1
|
SHEET, PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR |
IPC 7801 : 0
|
REFLOW OVEN PROCESS CONTROL STANDARD |
DSCC 11005 : 0
|
PRINTED WIRING BOARD, RIGID FLEX, TYPE 5 (MULTILAYER) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER |
IEC PAS 63015:2016
|
Definition of "Low-Halogen" for electronic products |
MIL-STD-883 Revision K:2016
|
TEST METHOD STANDARD - MICROCIRCUITS |
PD IEC/PAS 61182-12:2014
|
Generic requirements for printed board assembly products manufacturing description data and transfer methodology |
IEC PAS 62250:2001
|
Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1) |
PD IEC/PAS 61249-8-1:2014
|
Qualification and performance of electrical insulating compound for printed wiring assemblies |
EN 61182-2-2:2012
|
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
IPC 2222 GERMAN : A
|
SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
IPC 2222 FRENCH : A2010
|
SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
MIL-PRF-50884 Revision F:2014
|
Printed Wiring Board, Flexible or Rigid-Flex, General Specification for |
IPC D 326 : A
|
INFORMATION REQUIREMENTS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND OTHER ELECTRONIC ASSEMBLIES |
IPC FC 250 : A1986
|
SPECIFICATION FOR SINGLE AND DOUBLE-SIDED FLEXIBLE PRINTED WIRING |
IPC P-MICRO : 2010
|
PCB MULTI-ISSUE MICROSECTION WALL POSTER |
MIL-C-28809 Revision B:1988
|
CIRCUIT CARD ASSEMBLIES, RIGID, FLEXIBLE & RIGID FLEX |
IPC AJ 820 : A
|
ASSEMBLY AND JOINING HANDBOOK |
IPC 6012 RUSSIAN : C
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
IPC J STD 001 SWEDISH : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC A 610 DANISH : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC 7527 : 0
|
REQUIREMENTS FOR SOLDER PASTE PRINTING |
IPC 9262 : 2016
|
SPECIFICATION FOR CHARACTERIZATION AND VERIFICATION OF ASSEMBLY LEVEL AUTOMATIC OPTICAL INSPECTION EQUIPMENT |
IPC J STD 003 CHINESE : B
|
SOLDERABILITY TESTS FOR PRINTED BOARDS |
MIL P 50884 : E
|
PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX, GENERAL SPECIFICATION FOR |
IPC J STD 001 RUSSIAN : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC A 610 SPANISH : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC S 815 : B1987
|
GENERAL REQUIREMENTS FOR SOLDERING OF ELECTRONIC INTERCONNECTIONS |
IPC SPVC-LAT1 : 2010
|
ANALYTICAL PROCEDURES FOR PORTABLE LEAD-FREE ALLOY TEST DATA |
IPC J STD 005 RUSSIAN : A
|
REQUIREMENTS FOR SOLDERING FLUXES |
IPC WHMA A 620 HUNGARIAN : B
|
REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
IPC J STD 001 TURKISH : E2010
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 004 RUSSIAN : B
|
REQUIREMENTS FOR SOLDERING FLUXES |
IPC J STD 001 POLISH : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC A 610 ROMANIAN : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 600 SWEDISH : H
|
ACCEPTABILITY OF PRINTED BOARDS |
IPC A 600 JAPANESE : H
|
ACCEPTABILITY OF PRINTED BOARDS |
IPC A 600 CHINESE : G
|
ACCEPTABILITY OF PRINTED BOARDS |
IPC 2221 GERMAN : B
|
GENERIC STANDARD ON PRINTED BOARD DESIGN |
IPC WHMA A 620 TURKISH : B2012 AMD 1 2013
|
REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
IPC 1601 GERMAN : -
|
PRINTED BOARD HANDLING AND STORAGE GUIDELINES |
IPC 6012 POLISH : C
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
IPC QL 653 : A
|
Certification of Facilities that Inspect/Test Printed Boards, Components & Materials |
QQ-S-571 Revision F:1994
|
SOLDER, ELECTRONIC (96 TO 485 DEGREES C) |
IPC WHMA A 620 HEBREW : B2012 AMD 1 2013
|
REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
MIL-PRF-55110 Revision H:2014
|
Printed Wiring Board, Rigid, General Specification for |
IPC 9241 : 2016
|
GUIDELINES FOR MICROSECTION PREPARATION |
IPC A 600 GERMAN : H
|
ACCEPTABILITY OF PRINTED BOARDS |
IPC 7092 : 0
|
DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS |
IPC A 610 CZECH : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC 7093 CHINESE : -
|
DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS |
IPC A 610 GERMAN : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 600 POLISH : H
|
ACCEPTABILITY OF PRINTED BOARDS |
IPC A 600 RUSSIAN : H
|
ACCEPTABILITY OF PRINTED BOARDS |
IPC A 610 HINDI : E2010
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC 5704 : 0
|
CLEANLINESS REQUIREMENTS FOR UNPOPULATED PRINTED BOARDS |
IPC 9592 : B
|
REQUIREMENTS FOR POWER CONVERSION DEVICES FOR THE COMPUTER AND TELECOMMUNICATIONS INDUSTRIES |
IPC 2222 CHINESE : A
|
SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
MIL-STD-2000 Revision A:1991
|
STANDARD REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC S 804 : A1987
|
PRINTED WIRING BOARDS, SOLDERABILITY TEST METHODS FOR, |
IPC A 610 ESTONIAN : E2010
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 POLISH : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC WHMA A 620 SPANISH : B
|
REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
IPC WHMA A 620 CHINESE : B
|
REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
IPC A 610 DUTCH : F2014
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC WHMA A 620 VIETNAMESE : B2012
|
REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
IPC A 610 KOREAN : F2014
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC 4761 : 0
|
DESIGN GUIDE FOR PROTECTION OF PRINTED BOARD VIA STRUCTURES |
IPC 4411 : A
|
SPECIFICATION AND CHARACTERIZATION METHODS FOR NONWOVEN PARA-ARAMID REINFORCEMENT |
IPC CH 65 : B
|
GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
IPC 4204 CHINESE : A2011 AMD 1 2013
|
FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY |
IPC L 115 : B
|
SPECIFICATION FOR RIGID METAL-CLAD BASE MATERIALS FOR PRINTED BOARDS |
IPC 2588 : 2007
|
SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PART LIST PRODUCT DATA DESCRIPTION |
MIL-F-14256 Revision F:1993
|
FLUX, SOLDERING, LIQUID (ROSIN BASE) |
IPC 2583 : 2007
|
SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF DESIGN CHARACTERISTICS FOR MANUFACTURING DATA DESCRIPTION |
IPC 4412 : B
|
SPECIFICATION FOR FINISHED FABRIC WOVEN FROM 'E' GLASS FOR PRINTED BOARDS |
MIL-P-46843 Revision C:1989
|
PRINTED WIRING ASSEMBLIES PRODUCTION OF |
IPC CH 65 CHINESE : B
|
GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
IPC A 610 ITALIAN : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 FRENCH : F
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
MIL-PRF-31032-6 Revision B:2017
|
PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE SIDED, THERMOPLASTIC RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS |
IPC 2152 : 0
|
STANDARD FOR DETERMINING CURRENT CARRYING CAPACITY IN PRINTED BOARD DESIGN |
IPC SM 840 : E
|
QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
IPC 7527 GERMAN : -
|
REQUIREMENTS FOR SOLDER PASTE PRINTING |
IPC HDBK 830 : A
|
GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS |
IPC CC 830 : B
|
QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES |
IPC J STD 001 HUNGARIAN : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC 4412 CHINESE : B
|
SPECIFICATION FOR FINISHED FABRIC WOVEN FROM 'E' GLASS FOR PRINTED BOARDS |
MIL-PRF-31032-5 Revision B:2017
|
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOPLASTIC, THERMOSETTING, OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL, WITH PLATED THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS |
IPC J STD 004 CHINESE : B
|
REQUIREMENTS FOR SOLDERING FLUXES |
IPC A 610 SWEDISH : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC J STD 609 CHINESE : A
|
IPC/JEDEC MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
IPC J STD 001 GERMAN : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC ML 950 : C1980
|
RIGID MULTILAYER PRINTED BOARDS, PERFORMANCE SPECIFICATION FOR, |
IPC J STD 003 : C
|
SOLDERABILITY TESTS FOR PRINTED BOARDS |
IPC SM 840 CHINESE : E
|
QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
IPC A 610 HUNGARIAN : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC WHMA A 620 POLISH : B
|
REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
IPC 6013 GERMAN : B
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
IPC HDBK 840 : 0
|
SOLDER MASK HANDBOOK |
IPC 6012 FRENCH : C
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
IPC 2582 : 2007
|
SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ADMINISTRATIVE METHODS FOR MANUFACTURING DATA DESCRIPTION |
IPC 4204 : A
|
FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY |
IPC D 949 : 1987
|
RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR, |
IPC PWB-CRT-SG : A2007
|
PCB DESIGNERS CERTIFICATION STUDY GUIDE |
IPC 7351 GERMAN : B
|
Basic requirements for SMT design and SMD patch guideline |
IPC A 610 CHINESE : F
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC 2141 : A
|
DESIGN GUIDE FOR HIGH-SPEED CONTROLLED IMPEDANCE CIRCUIT BOARDS |
IPC 4202 CHINESE : A
|
FLEXIBLE BASE DIELECTRICS FOR USE IN FLEXIBLE PRINTED CIRCUITRY |
IPC A 610 TURKISH : E2010
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC J STD 006 CHINESE : B-2
|
REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
IPC J STD 001 ROMANIAN : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 005 : A
|
REQUIREMENTS FOR SOLDERING PASTES |
IPC A 610 JAPANESE : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC J STD 005 CHINESE : A
|
REQUIREMENTS FOR SOLDERING PASTES |
IPC A 600 FRENCH : H
|
ACCEPTABILITY OF PRINTED BOARDS |
IPC J STD 001 DANISH : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC 4101 CHINESE : C2009
|
SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
IPC FC 221 : A1984
|
SPECIFICATION FOR FLAT COPPER CONDUCTORS FOR FLAT CABLES |
IPC A 610 RUSSIAN : D
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC 6018 CHINESE : B
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD |
IPC A 610 VIETNAMESE : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC 4101 GERMAN : C
|
SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
IPC 9199 : 0
|
STATISTICAL PROCESS CONTROL (SPC) QUALITY RATING |
IPC WHMA A 620 ESTONIAN : B2012 AMD 1 2013
|
REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
IPC FC 213 : 1984
|
PERFORMANCE SPECIFICATION FOR FLAT UNDERCARPET TELEPHONE CABLE |
IPC WHMA A 620 KOREAN : B2012 AMD 1 2013
|
REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
MIL-STD-100 Revision G:1997
|
ENGINEERING DRAWINGS |
DOD-STD-2000-2 Revision A:1986
|
PART AND COMPONENT MOUNTING FOR HIGH QUALITY/HIGH RELIABILITY SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC 7095 : C
|
DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
DSCC 11002 : 0
|
PRINTED WIRING BOARD, FLEXIBLE, TYPE 2 (DOUBLE-SIDED) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER |
DD IEC/PAS 61249-6-3:2011
|
Specification for finished fabric woven from “E?? glass for printed boards |
IPC HDBK 4691 : 2015
|
HANDBOOK ON ADHESIVE BONDING IN ELECTRONIC ASSEMBLY OPERATIONS |
IPC 9194 : 0
|
IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC) APPLIED TO PRINTED BOARD ASSEMBLY MANUFACTURE GUIDELINE |
IPC QS 95 : 1993
|
GENERAL REQUIREMENTS FOR IMPLEMENTATION OF ISO 9000 QUALITY SYSTEMS |
IEC PAS 62214:2001
|
Generic performance specification for printed boards |
IPC 1072 : 2015 AMD 1 2017
|
INTELLECTUAL PROPERTY PROTECTION IN ELECTRONIC ASSEMBLY MANUFACTURING |
IPC 7525 GERMAN : B
|
STENCIL DESIGN GUIDELINE |
IPC 1756 : 2010
|
MANUFACTURING PROCESS DATA MANAGEMENT |
IEC PAS 61249-6-3:2011
|
Specification for finished fabric woven from "E" glass for printed boards |
IEC PAS 62213:2001
|
Specification and characterization methods for nonwoven para-aramid reinforcement |
IPC 7351 : B
|
GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
13/30295427 DC : 0
|
BS IEC/PAS 61249-8-5 ED.1 - QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
IPC J STD 001 CHINESE : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC 2222 : A
|
SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
IPC 2581 : B
|
GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY |
IPC J STD 001 SPANISH : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 FRENCH : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC WHMA A 620 DANISH : B
|
REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
IPC 7093 : 0
|
DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS |
MIL-S-13949 Revision H:1993
|
SHEET, PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR |
IEC 61760-4:2015
|
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices |
IEC PAS 62212:2001
|
Specification and characterization methods for nonwoven "E" glass mat |
IPC 6011 GERMAN : 0
|
GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS |
IPC 6903 : A2018
|
TERMS AND DEFINITIONS FOR THE DESIGN AND MANUFACTURE OF PRINTED ELECTRONICS |
ARINC 669 : 2004
|
GUIDANCE FOR LEAD-BASED SOLDERING, REPAIR AND REWORK |
IPC 7525 CHINESE : B
|
STENCIL DESIGN GUIDELINES |
EN 61760-4:2015/A1:2018
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES (IEC 61760-4:2015/A1:2018) |
IEC PAS 61182-12:2014
|
Generic requirements for printed board assembly products manufacturing description data and transfer methodology |
IPC J STD 609 : A
|
MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
NASA MSFC STD 2907 : 2006
|
WORKMANSHIP STANDARD FOR PRINTED WIRING BOARDS |
IPC 4562 : A
|
METAL FOIL FOR PRINTED BOARD APPLICATIONS |
IPC HDBK 630 : 0
|
GUIDELINES FOR DESIGN, MANUFACTURE, INSPECTION AND TESTING OF ELECTRONIC ENCLOSURES ASSEMBLY |
IPC SM 817 : A
|
GENERAL REQUIREMENTS FOR DIELECTRIC SURFACE MOUNTING ADHESIVES |
IPC 9707 : 0
|
SPHERICAL BEND TEST METHOD FOR CHARACTERIZATION OF BOARD LEVEL INTERCONNECTS |
IPC J STD 030 : A
|
SELECTION AND APPLICATION OF BOARD LEVEL UNDERFILL MATERIALS |
IPC 1751 : A2010 + A1 2012
|
GENERIC REQUIREMENTS FOR DECLARATION PROCESS MANAGEMENT |
IPC 9709 : 0
|
TEST GUIDELINES FOR ACOUSTIC EMISSION MEASUREMENT DURING MECHANICAL TESTING |
MIL-STD-2118 Base Document:1984
|
FLEXIBLE AND RIGID FLEX PRINTED WIRING FOR ELECTRONIC EQUIPMENT DESIGN REQUIREMENTS FOR |
BS EN 61760-4 : 2015
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
DSCC 11003 : 0
|
PRINTED WIRING BOARD, FLEXIBLE, TYPE 3 (MULTILAYER) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER |
IPC 2584 : 2007
|
SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION |
IPC AM 372 : 1978
|
ELECTROLESS COPPER FILM FOR ADDITIVE PRINTED BOARDS, |
ARINC 671 : 2006
|
GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR |
IEC PAS 62588:2008
|
Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes |
DD IEC/PAS 62588:2008
|
Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes |
IEC PAS 61249-8-5:2014
|
Qualification and performance specification of permanent solder mask and flexible cover materials |
IEC 61182-2-2:2012
|
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
IEC PAS 62293:2001
|
Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016) |
IEC PAS 62249:2001
|
Qualification and performance specification for flexible printed boards |
PD IEC/PAS 63015:2016
|
Definition of “Low-Halogen?? for electronic products |
12/30262664 DC : DRAFT APR 2012
|
BS EN 62588 - MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
BS EN 16602-70-12:2016
|
Space product assurance. Design rules for printed circuit boards |
PD IEC/PAS 61249-8-5:2014
|
Qualification and performance specification of permanent solder mask and flexible cover materials |
EN 16602-70-12:2016
|
Space product assurance - Design rules for printed circuit boards |
IPC J STD 004 : B
|
REQUIREMENTS FOR SOLDERING FLUXES |
IPC 6011 : 0
|
GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS |
IPC 9708 : 0
|
TEST METHODS FOR CHARACTERIZATION OF PRINTED BOARD ASSEMBLY PAD CRATERING |
IPC 9708 CHINESE : -
|
TEST METHODS FOR CHARACTERIZATION OF PRINTED BOARD ASSEMBLY PAD CRATERING |
MIL-STD-2119 Revision A:1990
|
DESIGN REQUIREMENTS FOR PRINTED WIRING ELECTRICAL BACKPLANE ASSEMBLIES |
12/30261600 DC : DRAFT MAR 2012
|
BS EN 61760-4 - CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
NASA STD 8739.1 : 2016
|
WORKMANSHIP STANDARD FOR POLYMERIC APPLICATION ON ELECTRONIC ASSEMBLIES |
IPC 9204 : 2017
|
GUIDELINE ON FLEXIBILITY AND STRETCHABILITY TESTING FOR PRINTED ELECTRONICS |
IPC 7525 : B
|
STENCIL DESIGN GUIDELINES |
IPC 1755 : 0
|
CONFLICT MINERALS DATA EXCHANGE STANDARD |
IPC 9704 : A
|
PRINTED CIRCUIT ASSEMBLY STRAIN GAGE TEST GUIDELINE |
I.S. EN 61182-2-2:2012
|
PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV)) |
IPC 6801 : 0
|
IPC/JPCA TERMS & DEFINITIONS, TEST METHODS, AND DESIGN EXAMPLES FOR BUILD-UP/HIGH DENSITY INTERCONNECT (HDI) PRINTED WIRING BOARDS |
IPC 1902 : 1998
|
GRID SYSTEMS FOR PRINTED CIRCUITS |
IPC 9850 : 0
|
SURFACE MOUNT PLACEMENT EQUIPMENT CHARACTERIZATION |
IPC 2547 : 0
|
SECTIONAL REQUIREMENTS FOR SHOP-FLOOR EQUIPMENT COMMUNICATION MESSAGES (CAMX) FOR PRINTED CIRCUIT BOARD TEST, INSPECTION AND REWORK |
IPC 7094 : 0
|
DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR FLIP CHIP AND DIE SIZE COMPONENTS |
IPC 4562 CHINESE : A
|
METAL FOIL FOR PRINTED BOARD APPLICATIONS |
I.S. EN 61760-4:2015
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
IEC PAS 61249-8-1:2014
|
Qualification and performance of electrical insulating compound for printed wiring assemblies |
13/30295424 DC : 0
|
BS IEC/PAS 61249-8-1 ED.1 - QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES |
IPC 2221B:2012
|
GENERIC STANDARD ON PRINTED BOARD DESIGN |
IPC J STD 006 : C
|
REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
IPC 2221 FRENCH : B2012
|
GENERIC STANDARD ON PRINTED BOARD DESIGN |
ASME Y14.24 : 2012
|
TYPES AND APPLICATIONS OF ENGINEERING DRAWINGS - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES |
ASME Y14.100 : 2017
|
ENGINEERING DRAWING PRACTICES - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES |
ASME Y14.31 : 2014
|
UNDIMENSIONED DRAWINGS - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES |