• IPC TR 464 : 0

    Current The latest, up-to-date edition.

    ACCELERATED AGING FOR SOLDERABILITY EVALUATIONS

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    Published date:  01-04-1984

    Publisher:  Institute of Printed Circuits

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    Abstract - (Show below) - (Hide below)

    Developed to meet the growing need for a standard method of evaluating the solderability retention capability of printed boards during inventory storage.

    General Product Information - (Show below) - (Hide below)

    Development Note Also available in CD-ROM format. (09/2005) A1987 incorporates addendum. (04/2014)
    Document Type Technical Report
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC TR 461 : 1979 SOLDERABILITY EVALUATION OF THICK AND THIN FUSED COATINGS
    IPC TR 465 1 : 1993 ROUND ROBIN TEST ON STEAM AGER TEMPERATURE CONTROL STABILITY
    IPC TR 462 : 0 SOLDERABILITY EVALUATION OF PRINTED BOARDS WITH PROTECTIVE COATINGS OVER LONG-TERM STORAGE
    IPC TR 466 : 1995 TECHNICAL REPORT: WETTING BALANCE STANDARD WEIGHT COMPARISON TEST
    IPC TR 465 2 : 1993 THE EFFECT OF STEAM AGING TIME AND TEMPERATURE ON SOLDERABILITY TEST RESULTS

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC TR 465 1 : 1993 ROUND ROBIN TEST ON STEAM AGER TEMPERATURE CONTROL STABILITY
    IPC TR 465 3 : - EVALUATION OF STEAM AGING ON ALTERNATIVE FINISHES, PHASE 2A
    IPC TR 462 : 0 SOLDERABILITY EVALUATION OF PRINTED BOARDS WITH PROTECTIVE COATINGS OVER LONG-TERM STORAGE
    IPC TR 461 : 1979 SOLDERABILITY EVALUATION OF THICK AND THIN FUSED COATINGS
    IPC TR 465 2 : 1993 THE EFFECT OF STEAM AGING TIME AND TEMPERATURE ON SOLDERABILITY TEST RESULTS
    IPC J STD 003 : C SOLDERABILITY TESTS FOR PRINTED BOARDS
    IPC TR 466 : 1995 TECHNICAL REPORT: WETTING BALANCE STANDARD WEIGHT COMPARISON TEST
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