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THE EFFECT OF STEAM AGING TIME AND TEMPERATURE ON SOLDERABILITY TEST RESULTS
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Withdrawn date: 14-09-2023
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Published date: 23-11-2012
Publisher: Institute of Printed Circuits
Details the results of a two-year study to determine the effect of steam aging exposure on components. It concludes that 98 Degree C for 8 hours is the optimal condition for industry specifications for both component leads and printed boards.
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