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  • IPC TR 582 : 0

    Current The latest, up-to-date edition.

    CLEANING AND CLEANLINESS TESTING PROGRAM FOR PHASE 3 - LOW SOLIDS, FLUXES AND PASTES PROCESSED IN AMBIENT AIR

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    Publisher:  Institute of Printed Circuits

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    Abstract - (Show below) - (Hide below)

    Gives test procedures, test results and team conclusions for the IPC Cleaning and Cleanliness Testing Program, Phase 3, Low Solids Flux in Ambient Air. This effort has been part of a multi-stage program to investigate material and process alternatives to the use of chlorofluorocarbons (CFCs) in electronics manufacturing.

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    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC TR 580 : 1989 CLEANING AND CLEANLINESS TEST PROGRAM, PHASE 1 TEST RESULTS
    IPC TR 581 : 1994 IPC PHASE 3 CONTROLLED ATMOSPHERE SOLDERING STUDY

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC SA 61 : A POST SOLDER SEMI-AQUEOUS CLEANING HANDBOOK
    IPC TP 1044 : 1992 CLEANING AND CLEANLINESS TEST PROGRAM PHASE 3 WATER SOLUBLE FLUXES PART 2
    IPC TP 1115 : 1998 SELECTION AND IMPLEMENTATION STRATEGY FOR A LOW-RESIDUE, NO-CLEAN PROCESS
    IPC SC 60 : A POST SOLDER SOLVENT CLEANING HANDBOOK
    IPC J STD 006 : C REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
    IPC TP 1043 : 1992 CLEANING AND CLEANLINESS TEST PROGRAM PHASE 3 WATER SOLUBLE FLUXES PART 1
    IPC CH 65 : B GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
    IPC TR 581 : 1994 IPC PHASE 3 CONTROLLED ATMOSPHERE SOLDERING STUDY
    IPC 9201 : A SURFACE INSULATION RESISTANCE HANDBOOK
    IPC AC 62 : A AQUEOUS POST SOLDER CLEANING HANDBOOK
    IPC TP 1090 : 1996 THE LAYMAN'S GUIDE TO QUALIFYING NEW FLUXES FOR MIL-STD-2000A OR MT-0002
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