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  • IPC WP 003 : 1993

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    CHIP MOUNTING TECHNOLOGY (CMT)

    Available format(s): 

    Superseded date:  01-08-1993

    Language(s): 

    Published date:  12-01-2013

    Publisher:  Institute of Printed Circuits

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    Abstract - (Show below) - (Hide below)

    Summarizes status of the technology discussion on various methodologies for mounting and interconnecting active devices to a variety of substrate materials. Reviews current mounting techniques of tape automated bonding, chip on board and flip chip, together with examinations of the most commonly used substrate options of laminate, ceramic and silicon.

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    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC J STD 013 : 0 IMPLEMENTATION OF BALL GRID ARRAY AND OTHER HIGH DENSITY TECHNOLOGY
    IPC J STD 012 : 0 IMPLEMENTATION OF FLIP CHIP AND CHIP SCALE TECHNOLOGY
    IPC J STD 026 : 0 SEMICONDUCTOR DESIGN STANDARD FOR FLIP CHIP APPLICATIONS
    IPC J STD 028 : 0 PERFORMANCE STANDARD FOR CONSTRUCTION OF FLIP CHIP AND CHIP SCALE BUMPS
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