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  • IPC WP 006 : 2003

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    ROUND ROBIN TESTING AND ANALYSIS - LEAD-FREE ALLOYS - TIN, SILVER AND COPPER

    Available format(s): 

    Withdrawn date:  13-09-2023

    Language(s): 

    Published date:  23-11-2012

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    MISSION STATEMENT
    SOLDER PRODUCTS VALUE COUNCIL MEMBERS
    Introduction and Statement of Problem
    Methodology
    Alloy Choice
    Test Regimen for Alloy Comparison
    Assembly Performance Comparison
    Assembly Performance Testing: Statistical Procedures Used
    Examples of Statistical Analysis
    Conclusions Based on Assembly Performance Testing
    LONG TERM RELIABILITY COMPARISON
    Third Party Solder Paste Testing
    Test Vehicle Assembly
    Inspection, Test, Repair, and Data Logging
    Long Term Thermal Cycling
    Periodic Metallographic Analysis
    Data Analysis
    Appendix 1 - Data Tables of Testing Participants
    Appendix 2 - IPC-TM-650, 2.4.14.2 Liquid Flux Activity
                 Wetting Balance Method, Using Flux Defined
                 in J-STD-003A, 3.2.2
    Appendix 3 - IPC-TM-650, 2.4.46, Spread Test, Liquid or
                 Extracted Solder Flux, Solder Paste and
                 Extracted Cored Wires or Preforms

    Abstract - (Show below) - (Hide below)

    Describes round robin test program on the assembly properties of three lead free solder alloys.

    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Withdrawn

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC SPVC2005-CD : 2005 ROUND ROBIN TESTING AND ANALYSIS OF LEAD FREE SOLDER PASTES WITH ALLOYS OF TIN, SILVER AND COPPER
    PD IEC/TS 62647-1:2012 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan
    GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
    IEC TS 62647-1:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
    IEC PAS 62647-1:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
    PD IEC/PAS 62647-1:2011 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC SPVC2005-CD : 2005 ROUND ROBIN TESTING AND ANALYSIS OF LEAD FREE SOLDER PASTES WITH ALLOYS OF TIN, SILVER AND COPPER
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