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  • ISO 9453:2014

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    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
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    Soft solder alloys Chemical compositions and forms

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Withdrawn date:  22-10-2020

    Language(s):  French, English, Russian

    Published date:  18-08-2014

    Publisher:  International Organization for Standardization

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    Abstract - (Show below) - (Hide below)

    ISO 9453:2014 specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.

    General Product Information - (Show below) - (Hide below)

    Development Note Supersedes ISO/DIS 9453. (08/2014)
    Document Type Standard
    Publisher International Organization for Standardization
    Status Withdrawn
    Superseded By
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    05/30133283 DC : DRAFT MAY 2005 IEC 61190-1-2 ED 2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTE FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
    10/30227098 DC : 0 BS EN 16125 - LPG EQUIPMENT AND ACCESSORIES - PIPEWORK SYSTEMS AND SUPPORTS - LPG LIQUID PHASE AND VAPOUR PRESSURE PHASE
    PREN ISO 9455-16 : DRAFT 2011 SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD
    BS EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies General
    BS PD ISO/IEC PAS 60127-8 : 2014 MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION
    16/30334455 DC : 0 BS EN ISO 9455-13 - SOFT SOLDERING FLUXES - TEST METHODS - PART 13: DETERMINATION OF FLUX SPATTERING
    BS EN 61190-1-1:2002 Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    CEI EN 60068-2-21 : 2006 ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES
    I.S. 820:2010 NON-DOMESTIC GAS INSTALLATIONS
    I.S. EN ISO 9455-14:2017 SOFT SOLDERING FLUXES - TEST METHODS - PART 14: ASSESSMENT OF TACKINESS OF FLUX RESIDUES (ISO 9455-14:2017)
    I.S. EN 60068-2-69:2017 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
    I.S. EN 61192-1:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL
    BS EN 60068-2-21:2006 Environmental testing Tests. Test U: Robustness of terminations and integral mounting devices
    UNE-EN ISO 9455-14:2018 Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues (ISO 9455-14:2017)
    UNE-EN ISO 9455-13:2018 Soft soldering fluxes - Test methods - Part 13: Determination of flux spattering (ISO 9455-13:2017)
    EN ISO 9455-13:2017 Soft soldering fluxes - Test methods - Part 13: Determination of flux spattering (ISO 9455-13:2017)
    EN 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
    I.S. EN ISO 9455-16:2013 SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD (ISO 9455-16:2013)
    I.S. EN ISO 9455-10:2012 SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD (ISO 9455-10:2012)
    BS EN ISO 12224-1:1998 Solder wire, solid and flux cored. Specification and test methods Classification and performance requirements
    UNI EN ISO 9455-16 : 2013 SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD
    IEC 62326-20:2016 Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
    BS EN ISO 12224-2:1999 Solder wire, solid and flux cored. Specification and test methods Determination of flux content
    14/30309696 DC : 0 BS EN 60068-2-69 ED 3.0 - ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
    BS EN ISO 9455-16:2013 Soft soldering fluxes. Test methods Flux efficacy test, wetting balance method
    I.S. EN 13148:2010 COPPER AND COPPER ALLOYS - HOT-DIP TINNED STRIP
    EN 61189-11 : 2013 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS
    BS 6915(2001) : 2001 DESIGN AND CONSTRUCTION OF FULLY SUPPORTED LEAD SHEET ROOF AND WALL COVERINGS - CODE OF PRACTICE
    EN 60851-4:2016 Winding wires - Test methods - Part 4: Chemical properties
    EN 60127-4:2005/A2:2013 Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types
    EN 62878-1-1:2015 Device embedded substrate - Part 1-1: Generic specification - Test methods
    IPC J STD 006 CHINESE : B-2 REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
    BS EN 62326-20:2016 Printed boards Printed circuit boards for high-brightness LEDs
    BS EN 61189-11:2013 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Measurement of melting temperature or melting temperature ranges of solder alloys
    ISO 9455-13:2017 Soft soldering fluxes — Test methods — Part 13: Determination of flux spattering
    14/30302429 DC : 0 BS EN 60851-4 - WINDING WIRES - METHODS OF TEST FOR WINDING WIRES - PART 4: CHEMICAL PROPERTIES
    BS EN 16602-70-08:2015 Space product assurance. Manual soldering of high-reliability electrical connections
    BS EN ISO 9455-15:2017 Soft soldering fluxes. Test methods Copper corrosion test
    BS EN 62024-1:2008 High frequency inductive components. Electrical characteristics and measuring methods Nanohenry range chip inductor
    07/30160659 DC : 0 BS EN 62024-1 - HIGH FREQUENCY INDUCTIVE COMPONENTS - ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 1: NANOHENRY RANGE CHIP INDUCTOR
    AWS WHC2.13 : 0 WELDING PROCESSES - PART 1, WELDING HANDBOOK, 9TH EDITION, VOL. 2 - CHAPTER 13: SOLDERING
    EN ISO 9455-14:2017 Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues (ISO 9455-14:2017)
    IEC 62024-1:2017 High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor
    IEC 61190-1-3:2017 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
    BS EN 60127-4 : 2005 MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES
    I.S. EN 61192-5:2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
    VDE 0468-2-69 : 2018 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)
    I.S. EN IEC 61190-1-3:2018 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
    I.S. EN 61190-1-3:2007 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
    DIN EN ISO 9455-10:2013-01 Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012)
    DIN EN ISO 9455-16:2013-08 SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD (ISO 9455-16:2013)
    UNE-EN ISO 9455-16:2013 Soft soldering fluxes - Test methods - Part 16: Flux efficacy test, wetting balance method (ISO 9455-16:2013)
    IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
    BS 9251:2005 Sprinkler systems for residential and domestic occupancies. Code of practice
    BS EN 13148:2010 Copper and copper alloys. Hot-dip tinned strip
    DIN EN 1775:2007-10 Gas supply - Gas pipework for buildings - Maximum operating pressure less than or equal to 5 bar - Functional recommendations
    DIN EN 13148:2010-12 Copper and copper alloys - Hot-dip tinned strip
    I.S. EN 1775:2007 GAS SUPPLY - GAS PIPEWORK FOR BUILDINGS - MAXIMUM OPERATING PRESSURE LESS THAN OR EQUAL TO 5 BAR - FUNCTIONAL RECOMMENDATIONS
    BS 6400:1997 Specification for installation of domestic sized gas meters (2nd and 3rd family gases)
    BS 6700(2006) : 2006 DESIGN, INSTALLATION, TESTING AND MAINTENANCE OF SERVICES SUPPLYING WATER FOR DOMESTIC USE WITHIN BUILDINGS AND THEIR CURTILAGES - SPECIFICATION
    BS EN ISO 9455-13:2017 Soft soldering fluxes. Test methods Determination of flux spattering
    15/30318681 DC : 0 BS EN 61190-1-3 ED 3.0 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
    14/30312344 DC : 0 PD IEC/PAS 60127-8 - MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION
    16/30337155 DC : 0 BS EN ISO 9455-14 - SOFT SOLDERING FLUXES - TEST METHODS - PART 14: ASSESSMENT OF TACKINESS OF FLUX RESIDUES
    09/30208696 DC : 0 BS EN 61189-11 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE AND MELTING TEMPERATURE RANGES OF SOLDER ALLOYS
    02/709371 DC : DRAFT JULY 2002 EN 50390 - SPACE PRODUCT ASSURANCE - THE MANUAL SOLDERING OF HIGH-RELIABILITY ELECTRICAL CONNECTIONS
    07/19990369 DC : 0 BS EN 806-4 - SPECIFICATIONS FOR INSTALLATIONS INSIDE BUILDINGS CONVEYING WATER FOR HUMAN CONSUMPTION - PART 4 - INSTALLATION
    UNI EN 806-4 : 2010 SPECIFICATIONS FOR INSTALLATIONS INSIDE BUILDINGS CONVEYING WATER FOR HUMAN CONSUMPTION - PART 4: INSTALLATION
    BS EN 806-4:2010 Specifications for installations inside buildings conveying water for human consumption Installation
    16/30338234 DC : 0 BS EN 60127-8 - MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION
    EN IEC 62024-1:2018 High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor
    EN 60068-2-69:2017/AC:2018-03 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017/COR1:2018)
    BS EN 61190-1-3 : 2007 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
    PREN ISO 9455-10 : DRAFT 2011 SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD
    I.S. EN 61189-3:2008 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS)
    ISO 7195:2005 Nuclear energy Packaging of uranium hexafluoride (UF6) for transport
    IEC 60127-4:2005+AMD1:2008+AMD2:2012 CSV Miniature fuses - Part 4: Universal modular fuse-links (UMF) -Through-hole and surface mount types
    UNE-EN 60851-4:2017 Winding wires - Test methods - Part 4: Chemical properties
    UNE-EN ISO 9455-10:2012 Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012)
    BS EN ISO 9455-17:2006 Soft soldering fluxes. Test methods Surface insulation resistance comb test and electrochemical migration test of flux residues
    UNI EN ISO 9455-10 : 2012 SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD
    UNI EN 1775 : 2007 GAS SUPPLY - GAS PIPEWORK FOR BUILDINGS - MAXIMUM OPERATING PRESSURE LESS THAN OR EQUAL TO 5 BAR - FUNCTIONAL RECOMMENDATIONS
    UNI EN 13148 : 2010 COPPER AND COPPER ALLOYS - HOT-DIP TINNED STRIP
    BS EN 60851-4:1998 Winding Wires. Test methods Chemical properties
    DIN EN 806-4:2010-06 Specifications for installations inside buildings conveying water for human consumption - Part 4: Installation
    09/30190431 DC : 0 BS EN 61190-1-3 ED.2 A1 - AMENDMENT 1 TO IEC 61190-1-3, ED.2: ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
    BS EN ISO 9455-14:2017 Soft soldering fluxes. Test methods Assessment of tackiness of flux residues
    I.S. EN 60851-4:2016 WINDING WIRES - TEST METHODS - PART 4: CHEMICAL PROPERTIES
    05/30133287 DC : DRAFT MAY 2005 IEC 61190-1-3 ED 2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
    I.S. EN ISO 9455-15:2017 SOFT SOLDERING FLUXES - TEST METHODS - PART 15: COPPER CORROSION TEST (ISO 9455-15:2017)
    I.S. EN ISO 9455-13:2017 SOFT SOLDERING FLUXES - TEST METHODS - PART 13: DETERMINATION OF FLUX SPATTERING (ISO 9455-13:2017)
    EN IEC 61190-1-3:2018 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
    NF EN 61190-1-3 : 2008 AMD 1 2010 Fastening materials for electronic assemblies - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solders for electronic soldering applications
    DIN EN 60068-2-69 : 2007 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)
    I.S. EN 806-4:2010 SPECIFICATIONS FOR INSTALLATIONS INSIDE BUILDINGS CONVEYING WATER FOR HUMAN CONSUMPTION - PART 4: INSTALLATION
    ISO 9455-14:2017 Soft soldering fluxes — Test methods — Part 14: Assessment of tackiness of flux residues
    I.S. EN 62878-1-1:2015 DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS
    BS EN 29455-14:1993 Soft soldering fluxes. Test methods Assessment of tackiness of flux residues
    BS EN 50390:2004 Space product assurance. The manual soldering of high-reliability electrical connections
    IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    ONORM EN ISO 9455-16 : 2013 SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TESTS, WETTING BALANCE METHOD (ISO 9455-16:2013)
    IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
    ISO 9455-17:2002 Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
    IEC 61192-5:2007 Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
    ISO 9455-10:2012 Soft soldering fluxes — Test methods — Part 10: Flux efficacy test, solder spread method
    IEC 61189-11:2013 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
    BS EN ISO 9455-10:2012 Soft soldering fluxes. Test methods Flux efficacy test, solder spread method
    IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
    EN 1775:2007 Gas supply - Gas pipework for buildings - Maximum operating pressure less than or equal to 5 bar - Functional recommendations
    EN ISO 12224-1:1998 Solder wire, solid and flux cored - Specification and test methods - Part 1: Classification and performance requirements (ISO 12224-1:1997)
    EN 29455-14:1993 Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues (ISO 9455-14:1991)
    EN ISO 9455-10:2012 Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012)
    EN 806-4:2010 Specifications for installations inside buildings conveying water for human consumption - Part 4: Installation
    EN 611-2:1996 Tin and tin alloys - Pewter and pewterware - Part 2: Pewterware
    EN ISO 9455-17:2006 Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO 9455-17:2002)
    EN ISO 9455-16:2013 Soft soldering fluxes - Test methods - Part 16: Flux efficacy test, wetting balance method (ISO 9455-16:2013)
    EN 16602-70-08:2015 Space product assurance - Manual soldering of high-reliability electrical connections
    BS EN 61189-3:2008 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards)
    BS EN 61192-5:2007 Workmanship requirements for soldered electric assemblies Rework, modification and repair of soldered electronic assemblies
    16/30337159 DC : 0 BS EN ISO 9455-15 - SOFT SOLDERING FLUXES - TEST METHODS - PART 15: COPPER CORROSION TEST
    BS ISO 9455-17 : 2002 AMD 16425 SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES
    IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
    I.S. EN 61189-11:2013 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS (IEC 61189-11:2013 (EQV))
    02/703607 DC : DRAFT FEB 2002 ISO/DIS 7195 - NUCLEAR ENERGY - PACKAGING OF URANIUM HEXAFLUORIDE (UF6) FOR TRANSPORT
    12/30258438 DC : 0 BS EN 61190-1-2 AMD 1ED.2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
    BS EN 60068-2-69:2017 Environmental testing Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
    11/30213136 DC : 0 BS EN ISO 9455-16 - SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD
    11/30234673 DC : 0 BS EN ISO 9455-10 - SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD
    BS EN 62878-1-1:2015 Device embedded substrate Generic specification. Test methods
    UNI EN 806-2 : 2008 SPECIFICATION FOR INSTALLATIONS INSIDE BUILDINGS CONVEYING WATER FOR HUMAN CONSUMPTION - PART 2: DESIGN
    I.S. EN 16602-70-08:2015 SPACE PRODUCT ASSURANCE - MANUAL SOLDERING OF HIGH-RELIABILITY ELECTRICAL CONNECTIONS
    I.S. EN IEC 62024-1:2018 HIGH FREQUENCY INDUCTIVE COMPONENTS - ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 1: NANOHENRY RANGE CHIP INDUCTOR
    I.S. EN 60127-4:2005 MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES (IEC 60127-4:2005 (EQV))
    I.S. EN 62024-1:2008 HIGH FREQUENCY INDUCTIVE COMPONENTS - ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 1: NANOHENRY RANGE CHIP INDUCTOR
    I.S. EN 62326-20:2016 PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS
    I.S. EN 60068-2-21:2006 ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES
    EN ISO 9455-15:2017 Soft soldering fluxes - Test methods - Part 15: Copper corrosion test (ISO 9455-15:2017)
    IEC 60851-4:2016 Winding wires - Test methods - Part 4: Chemical properties
    ISO 9455-15:2017 Soft soldering fluxes — Test methods — Part 15: Copper corrosion test
    I.S. EN 61190-1-1:2002 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY
    DIN EN ISO 12224-1:1998-10 SOLDER WIRE, SOLID AND FLUX CORED - SPECIFICATION AND TEST METHODS - PART 1: CLASSIFICATION AND PERFORMANCE REQUIREMENTS
    BS EN 1775:2007 Gas supply. Gas pipework for buildings. Maximum operating pressure less than or equal to 5 bar. Functional recommendations
    ISO 9455-16:2013 Soft soldering fluxes Test methods Part 16: Flux efficacy test, wetting balance method
    EN 61192-5 : 2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
    EN 13148 : 2010 COPPER AND COPPER ALLOYS - HOT-DIP TINNED STRIP
    IPC J STD 006 : C REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
    EN 62326-20:2016 Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
    EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
    EN 61189-3:2008 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
    EN 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    I.S. EN ISO 9455-17:2006 SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES

    Standards Referencing This Book - (Show below) - (Hide below)

    ISO 3677:2016 Filler metal for soldering and brazing — Designation
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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