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  • ISO 9454-2:1998

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    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
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    Soft soldering fluxes Classification and requirements Part 2: Performance requirements

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Withdrawn date:  16-11-2020

    Language(s):  English, French

    Published date:  20-08-1998

    Publisher:  International Organization for Standardization

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    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher International Organization for Standardization
    Status Withdrawn
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    DIN EN 16125:2016-03 LPG EQUIPMENT AND ACCESSORIES - PIPEWORK SYSTEMS AND SUPPORTS - LPG LIQUID PHASE AND VAPOUR PRESSURE PHASE
    BS EN 60068-2-58 : 2015 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
    BS EN 61190-1-1:2002 Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    I.S. 820:2010 NON-DOMESTIC GAS INSTALLATIONS
    EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    CEI EN 60068-2-58 : 2016 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
    EN IEC 61190-1-3:2018 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
    I.S. EN IEC 61190-1-3:2018 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
    I.S. EN 61190-1-3:2007 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
    DIN EN 1775:2007-10 Gas supply - Gas pipework for buildings - Maximum operating pressure less than or equal to 5 bar - Functional recommendations
    I.S. EN 1775:2007 GAS SUPPLY - GAS PIPEWORK FOR BUILDINGS - MAXIMUM OPERATING PRESSURE LESS THAN OR EQUAL TO 5 BAR - FUNCTIONAL RECOMMENDATIONS
    15/30318681 DC : 0 BS EN 61190-1-3 ED 3.0 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
    NF ISO 26842-1 : 2009 ADHESIVES - TEST METHODS FOR THE EVALUATION AND SELECTION OF ADHESIVES FOR INDOOR WOOD PRODUCTS - PART 1: RESISTANCE TO DELAMINATION IN NON-SEVERE ENVIRONMENTS
    BS EN 61190-1-2:2014 Attachment materials for electronic assembly Requirements for soldering pastes for high-quality interconnects in electronics assembly
    05/30133283 DC : DRAFT MAY 2005 IEC 61190-1-2 ED 2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTE FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
    BS EN 61190-1-3 : 2007 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
    I.S. EN 61190-1-2:2014 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
    BS EN 16125:2015 LPG Equipment and Accessories. Pipework systems and supports. LPG in liquid phase and vapour pressure phase
    NF EN 61190-1-3 : 2008 AMD 1 2010 Fastening materials for electronic assemblies - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solders for electronic soldering applications
    UNE-EN 16125:2016 LPG Equipment and Accessories - Pipework systems and supports - LPG in liquid phase and vapour pressure phase
    UNI EN 1775 : 2007 GAS SUPPLY - GAS PIPEWORK FOR BUILDINGS - MAXIMUM OPERATING PRESSURE LESS THAN OR EQUAL TO 5 BAR - FUNCTIONAL RECOMMENDATIONS
    05/30133287 DC : DRAFT MAY 2005 IEC 61190-1-3 ED 2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
    I.S. EN 16125:2015 LPG EQUIPMENT AND ACCESSORIES - PIPEWORK SYSTEMS AND SUPPORTS - LPG IN LIQUID PHASE AND VAPOUR PRESSURE PHASE
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    IEC 61190-1-3:2017 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
    IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    EN 1775:2007 Gas supply - Gas pipework for buildings - Maximum operating pressure less than or equal to 5 bar - Functional recommendations
    EN 16125:2015 LPG Equipment and Accessories - Pipework systems and supports - LPG in liquid phase and vapour pressure phase
    10/30227098 DC : 0 BS EN 16125 - LPG EQUIPMENT AND ACCESSORIES - PIPEWORK SYSTEMS AND SUPPORTS - LPG LIQUID PHASE AND VAPOUR PRESSURE PHASE
    12/30258438 DC : 0 BS EN 61190-1-2 AMD 1ED.2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
    I.S. EN 60068-2-58:2015 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
    I.S. EN 61190-1-1:2002 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY
    BS EN 1775:2007 Gas supply. Gas pipework for buildings. Maximum operating pressure less than or equal to 5 bar. Functional recommendations
    IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    EN 60068-2-58:2015/A1:2018 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) (IEC 60068-2-58:2015/A1:2017)
    EN 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    UNE-EN 16125:2020 LPG Equipment and Accessories - Pipework systems and supports - LPG in liquid phase and vapour pressure phase

    Standards Referencing This Book - (Show below) - (Hide below)

    ISO 9455-10:2012 Soft soldering fluxes — Test methods — Part 10: Flux efficacy test, solder spread method
    ISO 9455-11:2017 Soft soldering fluxes — Test methods — Part 11: Solubility of flux residues
    ISO 9455-15:2017 Soft soldering fluxes — Test methods — Part 15: Copper corrosion test
    ISO 9455-2:1993 Soft soldering fluxes Test methods Part 2: Determination of non-volatile matter, ebulliometric method
    ISO 9454-1:2016 Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
    ISO 9455-12:1992 Soft soldering fluxes Test methods Part 12: Steel tube corrosion test
    ISO 9455-9:1993 Soft soldering fluxes Test methods Part 9: Determination of ammonia content
    ISO 9455-1:1990 Soft soldering fluxes — Test methods — Part 1: Determination of non-volatile matter, gravimetric method
    ISO 9455-3:1992 Soft soldering fluxes — Test methods — Part 3: Determination of acid value, potentiometric and visual titration methods
    ISO 9455-8:1991 Soft soldering fluxes — Test methods — Part 8: Determination of zinc content
    ISO 9455-14:2017 Soft soldering fluxes — Test methods — Part 14: Assessment of tackiness of flux residues
    ISO 9455-13:2017 Soft soldering fluxes — Test methods — Part 13: Determination of flux spattering
    ISO 9455-5:2014 Soft soldering fluxes Test methods Part 5: Copper mirror test
    ISO 9455-6:1995 Soft soldering fluxes — Test methods — Part 6: Determination and detection of halide (excluding fluoride) content
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