BS IEC 61189-5-4 : 2015
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES |
BS EN ISO 9454-1:2016
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Soft soldering fluxes. Classification and requirements Classification, labelling and packaging |
12/30270787 DC : 0
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BS EN ISO 9455-5 - SOFT SOLDERING FLUXES - TEST METHODS - PART 5: COPPER MIRROR TEST |
12/30274796 DC : 0
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BS IEC 61189-5-2 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING FLUX |
14/30309692 DC : 0
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BS EN 61189-5-1 ED 1.0 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: TEST METHODS FOR PRINTED BOARD ASSEMBLIES AND MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES - GUIDANCE DOCUMENTS AND HANDBOOKS |
CEI EN 61189-5-2 : 2016
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
I.S. EN ISO 9455-14:2017
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SOFT SOLDERING FLUXES - TEST METHODS - PART 14: ASSESSMENT OF TACKINESS OF FLUX RESIDUES (ISO 9455-14:2017) |
UNE-EN ISO 9455-14:2018
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Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues (ISO 9455-14:2017) |
IEC 61189-5-2:2015
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies |
ISO 9454-1:2016
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Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging |
BS EN ISO 9454-2:2001
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Soft soldering fluxes. Classification and requirements Performance requirements |
EN 61189-5-1:2016
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
ONORM EN ISO 9455-5 : 2014
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SOFT SOLDERING FLUXES - TEST METHODS - PART 5: COPPER MIRROR TEST (ISO 9455-5:2014) |
EN 61189-5-4:2015
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
EN 61189-5-3:2015
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies |
I.S. EN ISO 9455-6:1997
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SOFT SOLDERING FLUXES - TEST METHODS - PART 6: DETERMINATION AND DETECTION OF HALIDE (EXCLUDING FLUORIDE) CONTENT |
BS IEC 61189-5-3 : 2015
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES |
BS EN 61189-5:2006
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Test methods for electrical materials, interconnection structures and assemblies Test methods for printed board assemblies |
BS EN 61189-5-2:2015
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering flux for printed board assemblies |
BS EN ISO 9455-15:2017
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Soft soldering fluxes. Test methods Copper corrosion test |
12/30274800 DC : 0
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BS IEC 61189-5-3 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING PASTE |
NF EN 61189-5 : 2008
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TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
DIN EN ISO 9455-3:1994-11
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SOFT SOLDERING FLUXES - TEST METHODS - PART 3: DETERMINATION OF ACID VALUE, POTENTIOMETRIC AND VISUAL TITRATION METHODS |
BS EN 61189-5-1:2016
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
IEC 61189-5-4:2015
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
BS EN ISO 9455-6:1997
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Soft soldering fluxes. Test methods Determination and detection of halide (excluding fluoride) content |
I.S. EN ISO 9454-2:2000
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SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 2: PERFORMANCE REQUIREMENTS |
BS EN 61189-5-4:2015
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
16/30337155 DC : 0
|
BS EN ISO 9455-14 - SOFT SOLDERING FLUXES - TEST METHODS - PART 14: ASSESSMENT OF TACKINESS OF FLUX RESIDUES |
14/30285529 DC : 0
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BS EN ISO 9454-1 - SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 1: CLASSIFICATION, LABELLING AND PACKAGING |
BS EN 61189-5-3:2015
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering paste for printed board assemblies |
BS EN ISO 9455-5:2014
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Soft soldering fluxes. Test methods Copper mirror test |
DIN EN ISO 9454-1:2016-07
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SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 1: CLASSIFICATION, LABELLING AND PACKAGING (ISO 9454-1:2016) |
UNE-EN ISO 9454-1:2016
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Soft soldering fluxes - Classification and requirements - Part 1: Classification, labelling and packaging (ISO 9454-1:2016) |
I.S. EN ISO 9454-1:2016
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SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 1: CLASSIFICATION, LABELLING AND PACKAGING (ISO 9454-1:2016) |
I.S. EN 61189-5:2006
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TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
EN ISO 9455-14:2017
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Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues (ISO 9455-14:2017) |
IEC 61189-5:2006
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Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies |
EN ISO 9454-2:2000
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Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements (ISO 9454-2:1998) |
EN ISO 9455-5:2014
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Soft soldering fluxes - Test methods - Part 5: Copper mirror test (ISO 9455-5:2014) |
DIN EN ISO 9455-5 E : 2014
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SOFT SOLDERING FLUXES - TEST METHODS - PART 5: COPPER MIRROR TEST (ISO 9455-5:2014) |
12/30274804 DC : 0
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BS IEC 61189-5-4 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE |
BS EN ISO 9455-14:2017
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Soft soldering fluxes. Test methods Assessment of tackiness of flux residues |
UNI EN ISO 9455-5 : 2014
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SOFT SOLDERING FLUXES - TEST METHODS - PART 5: COPPER MIRROR TEST |
DIN EN ISO 9454-1 E : 2016
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SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 1: CLASSIFICATION, LABELLING AND PACKAGING (ISO 9454-1:2016) |
I.S. EN ISO 9455-5:2014
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SOFT SOLDERING FLUXES - TEST METHODS - PART 5: COPPER MIRROR TEST (ISO 9455-5:2014) |
I.S. EN ISO 9455-15:2017
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SOFT SOLDERING FLUXES - TEST METHODS - PART 15: COPPER CORROSION TEST (ISO 9455-15:2017) |
I.S. EN 61189-5-4:2015
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES |
ISO 9455-14:2017
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Soft soldering fluxes — Test methods — Part 14: Assessment of tackiness of flux residues |
DIN EN ISO 9455-9:1995-11
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Soft soldering fluxes - Test methods - Part 9: Determination of ammonia content (ISO 9455-9:1993); German version EN ISO 9455-9:1995 |
DIN EN ISO 9455-2:1995-11
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SOFT SOLDERING FLUXES - TEST METHODS - PART 2: DETERMINATION OF NON-VOLATILE MATTER, EBULLIOMETRIC METHOD |
DIN EN ISO 9455-6:1997-03
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Soft soldering fluxes - Test methods - Part 6: Determination and detection of halide (excluding fluoride) content (ISO 9455-6:1995); German version EN ISO 9455-6:1997 |
ISO 9455-3:1992
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Soft soldering fluxes — Test methods — Part 3: Determination of acid value, potentiometric and visual titration methods |
IEC 61189-5-1:2016
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
IEC 61189-5-3:2015
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies |
ISO 9454-2:1998
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Soft soldering fluxes Classification and requirements Part 2: Performance requirements |
ISO 9455-5:2014
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Soft soldering fluxes Test methods Part 5: Copper mirror test |
ISO 9455-6:1995
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Soft soldering fluxes — Test methods — Part 6: Determination and detection of halide (excluding fluoride) content |
BS EN 29455-5:1993
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Soft soldering fluxes. Test methods Copper mirror test |
EN 29455-5:1993
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Soft soldering fluxes - Test methods - Part 5: Copper mirror test (ISO 9455-5:1992) |
EN ISO 9455-6:1997
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Soft soldering fluxes - Test methods - Part 6: Determination and detection of halide (excluding fluoride) content (ISO 9455-6:1995) |
EN ISO 9454-1:2016
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Soft soldering fluxes - Classification and requirements - Part 1: Classification, labelling and packaging (ISO 9454-1:2016) |
16/30337159 DC : 0
|
BS EN ISO 9455-15 - SOFT SOLDERING FLUXES - TEST METHODS - PART 15: COPPER CORROSION TEST |
BS IEC 61189-5-2 : 2015
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
UNE-EN ISO 9455-5:2015
|
Soft soldering fluxes - Test methods - Part 5: Copper mirror test (ISO 9455-5:2014) |
DIN EN ISO 9455-5:2014-10
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Soft soldering fluxes - Test methods - Part 5: Copper mirror test (ISO 9455-5:2014) |
I.S. EN 61189-5-3:2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES |
I.S. EN 61189-5-2:2015
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
EN ISO 9455-15:2017
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Soft soldering fluxes - Test methods - Part 15: Copper corrosion test (ISO 9455-15:2017) |
ISO 9455-15:2017
|
Soft soldering fluxes — Test methods — Part 15: Copper corrosion test |
BS EN 29454-1:1994
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Soft soldering fluxes. Classification and requirements Classification, labelling and packaging |
BS EN ISO 9455-3:1995
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Soft soldering fluxes. Test methods Determination of acid value, potentiometric and visual titration methods |
EN 61189-5-2:2015
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies |
DIN EN ISO 9455-12:1994-11
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SOFT SOLDERING FLUXES - TEST METHODS - PART 12: STEEL TUBE CORROSION TEST |
EN 61189-5 : 2006
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TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |