IPC J STD 001 : F

Superseded

Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES

Available format(s): Hardcopy

Superseded date: 21-02-2019

Language(s):

Published date: 28-08-2014

Publisher: Institute of Printed Circuits

Table of Contents - (Show below) - (Hide below)

1 GENERAL
2 APPLICABLE DOCUMENTS
3 MATERIALS, COMPONENTS AND EQUIPMENT REQUIREMENTS
4 GENERAL SOLDERING AND ASSEMBLY REQUIREMENTS
5 WIRES AND TERMINAL CONNECTIONS
6 THROUGH-HOLE MOUNTING AND TERMINATIONS
7 SURFACE MOUNTING OF COMPONENTS
8 CLEANING PROCESS REQUIREMENTS
9 PCB REQUIREMENTS
10 COATING, ENCAPSULATION AND STAKING (ADHESIVE)
11 WITNESS (TORQUE/ANTI-TAMPERING) STRIPE
12 PRODUCT ASSURANCE
13 REWORK AND REPAIR
Appendix A - Guidelines for Soldering Tools and Equipment
Appendix B - Minimum Electrical Clearance - Electrical
Conductor Spacing
APPENDIX C - J-STD-001 Guidance on Objective Evidence of
Material Compatibility

Abstract - (Show below) - (Hide below)

Specifies materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies.

General Product Information - (Show below) - (Hide below)

Committee	5-20
Development Note	Supersedes IPC S 815. Included in IPC C 103 & IPC C 1000. E2010 edition is still available in Swedish, Hungarian, Polish & Turkish Languages, See separate records. F2014 edition is still available in Chinese, German, French, Danish, Italian, Japanese, Romanian, Russian & Spanish Languages, See separate records. (05/2016) Also available in Hardcopy format. (01/2018)
Document Type	Standard
ISBN
Pages
Published
Publisher	Institute of Printed Circuits
Status	Superseded
Superseded By	IPC J STD 001 : G
Supersedes	IPC J STD 001FS : F IPC J STD 001 : E IPC J STD 001 : E IPC J STD 001 GERMAN : F

Standards Referenced By This Book - (Show below) - (Hide below)

MIL-DTL-15514 Revision G:2016	TELEPHONE EQUIPMENT, SOUND POWERED TELEPHONE HANDSET, HEADSET - CHEST SET, AND HEADSET - CHEST SET, NOISE ATTENUATING
I.S. EN 61188-5-2:2003	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
AWS SHB : 3	SOLDERING HANDBOOK
SAE AS 12500 : 2018	CORROSION PREVENTION AND DETERIORATION CONTROL IN ELECTRONIC COMPONENTS AND ASSEMBLIES
I.S. EN 61191-2:2017	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
BS EN 61191-3:2017	Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
SAE AS 95234A : 2020	CONNECTORS, ELECTRICAL, REVERSE BAYONET, GENERAL SPECIFICATION FOR
IEC 61191-4:2017	Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
BS EN 61191-1:2013	Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
EN 61189-5-1:2016	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
EN 61188-5-6:2003	Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
EN 61188-5-2:2003	Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
I.S. EN 61191-1:2013	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
EN 61191-3:2017	Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
MIL-STD-2088 Revision B:2007	BOMB RACK UNIT (BRU), SINGLE STORE, AIRCRAFT
IPC J STD 002 CHINESE : C	SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
IPC CM 770 : E	COMPONENT MOUNTING GUIDELINES FOR PRINTED BOARDS
IPC CA 821 : 0	GENERAL REQUIREMENTS FOR THERMALLY CONDUCTIVE ADHESIVES
IPC D 326 : A	INFORMATION REQUIREMENTS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND OTHER ELECTRONIC ASSEMBLIES
IPC AJ 820 : A	ASSEMBLY AND JOINING HANDBOOK
MIL-DTL-29563 Revision B:2014	ANTENNA SYSTEM, AIMS SHIPBOARD, ELECTRONICALLY STEERED OE-120/UPX
IPC 6012 RUSSIAN : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
MIL-DTL-32291 Base Document:2008	CARTRIDGE, IMPULSE, CCU-165/B
IPC A 610 DANISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 9501 : 0	PWB ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF ELECTRONIC COMPONENTS (PRECONDITIONING IC COMPONENTS)
IPC A 610 SPANISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC LDFR0805-CD : 2005	IPC/JEDEC 9TH INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES AUGUST 2005
IPC SPVC-LAT1 : 2010	ANALYTICAL PROCEDURES FOR PORTABLE LEAD-FREE ALLOY TEST DATA
MIL-PRF-71226 Base Document:1996	ARMAMENTS AND MUNITIONS, STANDARD PROVISIONS, GENERAL SPECIFICATION FOR
IPC J STD 005 RUSSIAN : A	REQUIREMENTS FOR SOLDERING FLUXES
IPC WHMA A 620 HUNGARIAN : B	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC J STD 004 RUSSIAN : B	REQUIREMENTS FOR SOLDERING FLUXES
IPC A 610 ROMANIAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 9191 : 0	GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC)
IPC 2223 CHINESE : C	SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS
IPC LDFR1006-CD : 2006	IPC/JEDEC INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES "ROHS COMPLIANCE AND BEYOND"
IPC WHMA A 620 TURKISH : B2012 AMD 1 2013	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC 2221 GERMAN : B	GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC TA 722 : 1990	TECHNOLOGY ASSESSMENT HANDBOOK ON SOLDERING
IPC 1601 GERMAN : -	PRINTED BOARD HANDLING AND STORAGE GUIDELINES
IPC 6012 POLISH : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC WHMA A 620 HEBREW : B2012 AMD 1 2013	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
MIL-DTL-13735 Revision H:2017	Switches, Toggle: 28 Volt DC
IPC D 279 : 0	DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES
IPC 7092 : 0	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS
IPC A 610 CZECH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC TP 1090 : 1996	THE LAYMAN'S GUIDE TO QUALIFYING NEW FLUXES FOR MIL-STD-2000A OR MT-0002
IPC SM 780 : 0	COMPONENT PACKAGING AND INTERCONNECTING WITH EMPHASIS ON SURFACE MOUNTING
IPC QE 615 : 1993	ELECTRONIC ASSEMBLY EVALUATION HANDBOOK
IPC 7093 CHINESE : -	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
MIL-PRF-32565 Revision A:2017	BATTERY, RECHARGEABLE, SEALED, 6T LITHIUM-ION
IPC LDFR0806-CD : 2006	IPC/JEDEC INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES "ROHS COMPLIANCE AND BEYOND"
IPC TA 723 : 1991	TECHNOLOGY ASSESSMENT HANDBOOK ON SURFACE MOUNTING
IPC LDFR0605-CD : 2005	IPC/SOLDERTEC 3RD INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONICS "TOWARDS IMPLEMENTATION OF THE ROHS DIRECTIVE"
IPC A 610 GERMAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC LDFR1005-CD : 2005	IPC/JEDEC 11TH INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES
IPC A 610 HINDI : E2010	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 9592 : B	REQUIREMENTS FOR POWER CONVERSION DEVICES FOR THE COMPUTER AND TELECOMMUNICATIONS INDUSTRIES
IPC 7912 : A	END-ITEM DPMO FOR PRINTED CIRCUIT BOARD ASSEMBLIES
IPC 9500 : 2003	ASSEMBLY PROCESS COMPONENT SIMULATIONS, GUIDELINES & CLASSIFICATIONS PACKAGE
IPC 7526 : 2007	STENCIL AND MISPRINTED BOARD CLEANING HANDBOOK
IPC 9504 : 0	ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF NON-IC COMPONENTS (PRECONDITIONING NON-IC COMPONENTS)
IPC 7530 HUNGARIAN : -	GUIDELINES FOR TEMPERATURE PROFILING FOR MASS SOLDERING (REFLOW AND WAVE) PROCESSES
IPC LDFR1106-CD : 2006	IPC/JEDEC INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES "ROHS COMPLIANCE AND BEYOND"
IPC A 610 ESTONIAN : E2010	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 POLISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC WHMA A 620 SPANISH : B	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC WHMA A 620 CHINESE : B	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC A 610 DUTCH : F2014	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC WHMA A 620 VIETNAMESE : B2012	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
MIL-DTL-32106 Base Document:2003	INITIATORS, ELECTRICAL, FOR ROCKET MOTOR IGNITERS
IPC 9502 : 0	PWB ASSEMBLY SOLDERING PROCESS GUIDELINE FOR ELECTRONIC COMPONENTS
IPC A 610 KOREAN : F2014	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
MIL-DTL-87104 Revision C:2014	COAXIAL ASSEMBLIES, GENERAL SPECIFICATION FOR
MIL-DTL-7788 Revision H:2011	PANELS, INFORMATION, INTEGRALLY ILLUMINATED
IPC CH 65 : B	GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
IPC DVD PTH : LATEST	THROUGH-HOLE SOLDER JOINT WORKMANSHIP STANDARDS WITH TRAINING CERTIFICATION
IPC LDFR0306-CD : 2006	IPC/JEDEC INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES
IPC SPVC2005-CD : 2005	ROUND ROBIN TESTING AND ANALYSIS OF LEAD FREE SOLDER PASTES WITH ALLOYS OF TIN, SILVER AND COPPER
MIL-DTL-29183 Revision C:2003	PANELBOARDS, POWER DISTRIBUTION, PORTABLE, WEATHERPROOF, GENERAL SPECIFICATION FOR
IPC FA 251 : 0	GUIDELINES FOR ASSEMBLY OF SINGLE- AND DOUBLE-SIDED FLEX CIRCUITS
IPC DPMO 202 : 2002	IPC 7912/9261 END ITEM AND IN-PROCESS DPMO SET
IPC CH 65 CHINESE : B	GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
MIL-DTL-917 Revision F:2014	ELECTRIC POWER EQUIPMENT, BASIC REQUIREMENTS FOR
IPC LDFR1205-CD : 2006	IPC/JEDEC 12TH INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES - DECEMBER 2005
IPC A 610 ITALIAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 FRENCH : F	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 5701 : 0	USERS GUIDE FOR CLEANLINESS OF UNPOPULATED PRINTED BOARDS
IPC TR 583 : 0	AN IN-DEPTH LOOK AT IONIC CLEANLINESS TESTING
IPC HDBK 850 : 0	GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF POTTING MATERIALS AND ENCAPSULATION PROCESSES USED FOR ELECTRONICS PRINTED CIRCUIT BOARD ASSEMBLY
IPC 2223 GERMAN : C	SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS
IPC EM 782 : 1996	SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD SPREADSHEET
IPC TR 467 : 0	SUPPORTING DATA AND NUMERICAL EXAMPLES FOR J-STD-001 (CONTROL OF FLUXES)
IPC HDBK 830 : A	GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS
MIL-DTL-32360 Base Document:2010	STOP LIGHT - TAILLIGHT, VEHICULAR-24 VOLT, SERVICE STOP, SERVICE TAIL, BLACKOUT TAIL
IPC TA 724 : 1998	TECHNOLOGY ASSESSMENT ON CLEANROOMS
IPC J STD 004 CHINESE : B	REQUIREMENTS FOR SOLDERING FLUXES
IPC 9203 : 0	USERS GUIDE TO IPC-9202 AND THE IPC-B-52 STANDARD TEST VEHICLE
IPC A 610 SWEDISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC HDBK 005 : 0	GUIDE TO SOLDER PASTE ASSESSMENT
IPC HDBK 610 : 0	HANDBOOK AND GUIDE TO SUPPLEMENT IPC-A-610 (INCLUDES IPC-A-610 B-C-D COMPARISONS
IPC 7530 CHINESE : 2001	GUIDELINES FOR TEMPERATURE PROFILING FOR MASS SOLDERING PROCESSES (REFLOW AND WAVE)
IPC A 610 HUNGARIAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC OI 645 : 0	STANDARD FOR VISUAL OPTICAL INSPECTION AIDS
IPC WHMA A 620 POLISH : B	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC TR 460 : A1984	TROUBLE-SHOOTING CHECKLIST FOR WAVE SOLDERING PRINTED WIRING BOARDS
IPC 6012 FRENCH : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC MI 660 : 1984	INCOMING INSPECTION OF RAW MATERIALS MANUAL
IPC 7351 GERMAN : B	Basic requirements for SMT design and SMD patch guideline
IPC A 610 CHINESE : F	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC TP 1114 : 1998	THE LAYMAN'S GUIDE TO QUALIFYING A PROCESS TO J-STD-001B
IPC 9261 : A	IN-PROCESS DPMO AND ESTIMATED YIELD FOR PCAS
IPC A 610 TURKISH : E2010	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
MIL STD 11991 : A	GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES
IPC DVD SMT : LATEST	SURFACE MOUNT SOLDER JOINT WORKMANSHIP STANDARDS WITH TRAINING CERTIFICATION
IPC DW 426 : 0	SPECIFICATIONS FOR ASSEMBLY OF DISCRETE WIRING
IPC LDFR0406-CD : 2006	IPC/SOLDERTEC GLOBAL 4TH INTERNATIONAL ELECTRONICS CONFERENCE AND EXHIBITION "ROHS COMPLIANCE AND BEYOND"
IPC J STD 005 : A	REQUIREMENTS FOR SOLDERING PASTES
IPC A 610 JAPANESE : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 005 CHINESE : A	REQUIREMENTS FOR SOLDERING PASTES
IPC A 610 RUSSIAN : D	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 6018 CHINESE : B	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD
MIL-DTL-5589 Revision E:1999	EARPHONE, (EXTENDED RANGE), H-301/U
IPC A 610 VIETNAMESE : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC WHMA A 620 ESTONIAN : B2012 AMD 1 2013	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC 9199 : 0	STATISTICAL PROCESS CONTROL (SPC) QUALITY RATING
IPC TP 1115 : 1998	SELECTION AND IMPLEMENTATION STRATEGY FOR A LOW-RESIDUE, NO-CLEAN PROCESS
IPC WHMA A 620 KOREAN : B2012 AMD 1 2013	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
SAE AS 95234 : 2014	CONNECTORS, ELECTRICAL, REVERSE BAYONET, GENERAL SPECIFICATION FOR
IPC 7095 : C	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
IEC 61188-5-6:2003	Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
BS EN 61189-5-1:2016	Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
PD IEC/TS 62647-1:2012	Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan
IEC PAS 62647-23:2011	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
IEC 61191-2:2017	Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
IPC 7351 : B	GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
I.S. EN 61191-4:2017	PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
I.S. EN 61191-3:2017	PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
MIL-DTL-62741 Revision A:1998	PRINTED WIRING ASSEMBLY, MUX/ADCON
MIL-DTL-62740 Revision A:1998	PRINTED WIRING ASSEMBLY, SPECIAL CIRCUITS
MIL-DTL-5015 Revision H:2000	CONNECTORS, ELECTRICAL, CIRCULAR THREADED, AN TYPE - GENERAL SPECIFICATION FOR
IPC WHMA A 620 DANISH : B	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC 7093 : 0	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
MIL-STD-186 Revision F:2002	PROTECTIVE FINISHING SYSTEMS FOR ROCKETS, GUIDED MISSILES, SUPPORT EQUIPMENT AND RELATED MATERIALS
IPC 9202 : 0	MATERIAL AND PROCESS CHARACTERIZATION/QUALIFICATION TEST PROTOCOL FOR ASSESSING ELECTROCHEMICAL PERFORMANCE
MIL-DTL-32015 Base Document:1999	MICROPHONES, LINEAR, GENERAL SPECIFICATION FOR
MIL-DTL-22442 Revision G:2009	CABLE ASSEMBLIES, AIRCRAFT AUDIO, GENERAL SPECIFICATION FOR
MIL-DTL-62736 Revision A:1998	PRINTED WIRING ASSEMBLY, I/O
SAE AS 81703 : 2012	CONNECTORS, ELECTRIC, CIRCULAR, MINIATURE, RACK AND PANEL OR PUSH-PULL COUPLING, ENVIRONMENT RESISTING
I.S. EN 61188-5-6:2003	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE ATTACHMENT (LAND/JOINT) CONSIDERATIONS - CHIP CARRIERS WITH J-LEADS ON FOUR SIDES
ARINC 669 : 2004	GUIDANCE FOR LEAD-BASED SOLDERING, REPAIR AND REWORK
GEIA HB 0005-3 : 2008	REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
GEIA HB 0005-2 : 2007	TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
IEEE 1662-2008	IEEE Guide for the Design and Application of Power Electronics in Electrical Power Systems on Ships
BS EN 61191-4:2017	Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies
NASA KSC E 165 : 2009	ELECTRICAL GROUND SUPPORT EQUIPMENT FABRICATION, SPECIFICATION FOR
NASA GSFC STD 6001 : 2016	CERAMIC COLUMN GRID ARRAY DESIGN AND MANUFACTURING RULES FOR FLIGHT HARDWARE
NASA STD 8739.6 : 2016	IMPLEMENTATION REQUIREMENTS FOR NASA WORKMANSHIP STANDARDS
NASA STD 5005 : 2013	STANDARD FOR THE DESIGN AND FABRICATION OF GROUND SUPPORT EQUIPMENT
MIL-DTL-53078 Revision A:2011	MOUNTING KIT: M1 TANK CLEARED LANE MARKING SYSTEM (CLAMS)
NASA KSC DE 512-SM : 2012	FACILITY SYSTEMS, GROUND SUPPORT SYSTEMS, AND GROUND SUPPORT EQUIPMENT GENERAL DESIGN REQUIREMENTS
GEIA STD 0006 : 2008	REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS
GEIA STD 0005-1 : 2012	PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
NASA MSFC STD 3012 : 2012	ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS MANAGEMENT AND CONTROL REQUIREMENTS FOR MSFC SPACE FLIGHT HARDWARE
NASA KSC STD E 0010 : 1994	SOLDERING OF ELECTRICAL CONNECTIONS (HAND OR MACHINE), STANDARD FOR
NASA JSC 20793 : 2017	CREWED SPACE VEHICLE BATTERY SAFETY REQUIREMENTS
NASA GSFC STD 8002 : 2015	STANDARD QUALITY ASSURANCE REQUIREMENTS FOR THE USE OF WATER SOLUBLE FLUX
NASA JSC 66491 : 2013	STANDARD FOR JSC LEAD-FREE CONTROL PLANS (LFCP)
NASA STD 8739.4 : 2016	WORKMANSHIP STANDARD FOR CRIMPING, INTERCONNECTING CABLES, HARNESSES, AND WIRING
MIL-HDBK-454 Revision B:2007	GENERAL GUIDELINES FOR ELECTRONIC EQUIPMENT
IPC HDBK 630 : 0	GUIDELINES FOR DESIGN, MANUFACTURE, INSPECTION AND TESTING OF ELECTRONIC ENCLOSURES ASSEMBLY
IEC TS 62647-1:2012	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
IES RP 7 : 2017	RECOMMENDED PRACTICE FOR LIGHTING INDUSTRIAL FACILITIES
SAE AS 81582 : 2017	CONNECTORS, ELECTRICAL, BAYONET COUPLING, ENVIRONMENT RESISTING, UMBILICAL, GENERAL SPECIFICATION FOR
MIL-DTL-32086 Base Document:2004	Intercom, Portable
SAE AS 50151 : 2015	CONNECTORS, ELECTRICAL, CIRCULAR THREADED, AN TYPE, GENERAL SPECIFICATION FOR
NASA MSFC SPEC 3635 : 2012	PYROTECHNIC SYSTEM SPECIFICATION
ARINC 671 : 2006	GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR
IEC 61191-1:2013	Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC TS 62647-23:2013	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
PD IEC/TS 62647-2:2012	Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Mitigation of deleterious effects of tin
BS EN 61188-5-6:2003	Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides
PD IEC/TS 62647-23:2013	Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
IEC PAS 62647-1:2011	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
15/30327712 DC : 0	BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
PD IEC/PAS 62647-1:2011	Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management
IEC 61189-5-1:2016	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
IEC TS 62647-22:2013	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
IEC PAS 62647-22:2011	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
IEC 61188-5-2:2003	Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
IEC TS 62647-2:2012	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin
DD IEC PAS 62647-23 : DRAFT AUG 2011	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES
IEC 61191-3:2017	Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
IPC J STD 004 : B	REQUIREMENTS FOR SOLDERING FLUXES
AWS WHC2.13 : 0	WELDING PROCESSES - PART 1, WELDING HANDBOOK, 9TH EDITION, VOL. 2 - CHAPTER 13: SOLDERING
MIL-PRF-32070 Revision A:2012	TEST PROGRAM SETS
MIL-STD-1568 Revision D:2015	Materials and Processes for Corrosion Prevention and Control in Aerospace Weapons Systems
EN 61191-2:2017	Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
PD IEC/TS 62647-22:2013	Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines
BS EN 61188-5-2:2003	Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components
IPC 2221B:2012	GENERIC STANDARD ON PRINTED BOARD DESIGN
EN 61191-1:2013	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
IPC 2221 FRENCH : B2012	GENERIC STANDARD ON PRINTED BOARD DESIGN
MIL-DTL-18714 Revision F:2012	PRIMER, ELECTRIC, MARK 45 MOD 1
EN 61191-4:2017	Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

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