J STD 001 : F

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Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES

Publisher: Institute of Printed Circuits

Published:

Available Formats: Hardcopy - English
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Table of Contents - (Show below) - (Hide below)

1 GENERAL
2 APPLICABLE DOCUMENTS
3 MATERIALS, COMPONENTS AND EQUIPMENT REQUIREMENTS
4 GENERAL SOLDERING AND ASSEMBLY REQUIREMENTS
5 WIRES AND TERMINAL CONNECTIONS
6 THROUGH-HOLE MOUNTING AND TERMINATIONS
7 SURFACE MOUNTING OF COMPONENTS
8 CLEANING PROCESS REQUIREMENTS
9 PCB REQUIREMENTS
10 COATING, ENCAPSULATION AND STAKING (ADHESIVE)
11 WITNESS (TORQUE/ANTI-TAMPERING) STRIPE
12 PRODUCT ASSURANCE
13 REWORK AND REPAIR
Appendix A - Guidelines for Soldering Tools and Equipment
Appendix B - Minimum Electrical Clearance - Electrical
Conductor Spacing
APPENDIX C - J-STD-001 Guidance on Objective Evidence of
Material Compatibility

Abstract - (Show below) - (Hide below)

Specifies materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies.

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Published
Document Type	Standard
Status	Superseded
Publisher	Institute of Printed Circuits
Pages
ISBN
Committee	5-20
Supersedes	EIA IS 49 : A1990
Superseded By	J STD 001 : G

Standards Referenced By This Book - (Show below) - (Hide below)

SAE AS 95234 : 2014	CONNECTORS, ELECTRICAL, REVERSE BAYONET, GENERAL SPECIFICATION FOR
SAE AS 81582 : 2017	CONNECTORS, ELECTRICAL, BAYONET COUPLING, ENVIRONMENT RESISTING, UMBILICAL, GENERAL SPECIFICATION FOR
SAE AS 50151 : 2015	CONNECTORS, ELECTRICAL, CIRCULAR THREADED, AN TYPE, GENERAL SPECIFICATION FOR
NASA MSFC SPEC 3635 : 2012	PYROTECHNIC SYSTEM SPECIFICATION
AWS WHC2.13 : 0	WELDING PROCESSES - PART 1, WELDING HANDBOOK, 9TH EDITION, VOL. 2 - CHAPTER 13: SOLDERING
IPC 7095 : C	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
I.S. EN 61188-5-2:2003	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
SAE AS 81703 : 2012	CONNECTORS, ELECTRIC, CIRCULAR, MINIATURE, RACK AND PANEL OR PUSH-PULL COUPLING, ENVIRONMENT RESISTING
I.S. EN 61188-5-6:2003	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE ATTACHMENT (LAND/JOINT) CONSIDERATIONS - CHIP CARRIERS WITH J-LEADS ON FOUR SIDES
AWS SHB : 3	SOLDERING HANDBOOK
ARINC 669 : 2004	GUIDANCE FOR LEAD-BASED SOLDERING, REPAIR AND REWORK
SAE AS 12500 : 2018	CORROSION PREVENTION AND DETERIORATION CONTROL IN ELECTRONIC COMPONENTS AND ASSEMBLIES
ARINC 671 : 2006	GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR
IEC 61188-5-6 : 1.0	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-6: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - CHIP CARRIERS WITH J-LEADS ON FOUR SIDES
IEC 61191-1 : 2.0	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
GEIA HB 0005-3 : 2008	REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
GEIA HB 0005-2 : 2007	TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
I.S. EN 61191-2:2017	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
EN 61191-2 : 2017	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017)
BS EN 61189-5-1 : 2016	TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - GUIDANCE FOR PRINTED BOARD ASSEMBLIES
BS PD IEC TS 62647-1 : 2012	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: PREPARATION FOR A LEAD-FREE CONTROL PLAN
BS EN 61191-3 : 2017	PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES (IEC 61191-3:2017)
SAE AS 95234A : 2020	CONNECTORS, ELECTRICAL, REVERSE BAYONET, GENERAL SPECIFICATION FOR
IEC TS 62647-23 : 1ED 2013	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES
BS PD IEC TS 62647-2 : 2012	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 2: MITIGATION OF DELETERIOUS EFFECTS OF TIN
BS EN 61188-5-6 : 2003	PRINTED BOARDS AND ASSEMBLIES - DESIGN AND USE - PART 5-6: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - CHIP CARRIERS WITH J-LEADS ON FOUR SIDES
BS PD IEC TS 62647-23 : 2013	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES
BS EN 61191-4 : 2017	PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES (IEC 61191-4:2017)
IEC PAS 62647-23 : 1.0	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES
IEC 61191-2 : 3.0	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
IPC 7351 : B	GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
IEC 61191-4 : 2.0	PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
BS EN 61191-1 : 2013	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
BS PD IEC TS 62647-22 : 2013	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 22: TECHNICAL GUIDELINES
BS EN 61188-5-2 : 2003	PRINTED BOARDS AND ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
IEC PAS 62647-1 : 1.0	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: LEAD-FREE MANAGEMENT
15/30327712 DC : 0	BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
BS EN 61191-2 : 2017	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017)
BS PD IEC/PAS 62647-1 : 2011	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: LEAD-FREE MANAGEMENT
IEC 61189-5-1 : 1ED 2016	TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - GUIDANCE FOR PRINTED BOARD ASSEMBLIES
IEC TS 62647-22 : 1ED 2013	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 22: TECHNICAL GUIDELINES
IEC PAS 62647-22 : 1.0	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 22: TECHNICAL GUIDELINES
IEC 61188-5-2 : 1.0	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
IEC TS 62647-2 : 1ED 2012	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 2: MITIGATION OF DELETERIOUS EFFECTS OF TIN
DD IEC PAS 62647-23 : DRAFT AUG 2011	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES
IEC 61191-3 : 2.0	PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
NASA KSC E 165 : 2009	ELECTRICAL GROUND SUPPORT EQUIPMENT FABRICATION, SPECIFICATION FOR
NASA GSFC STD 6001 : 2016	CERAMIC COLUMN GRID ARRAY DESIGN AND MANUFACTURING RULES FOR FLIGHT HARDWARE
NASA STD 8739.6 : 2016	IMPLEMENTATION REQUIREMENTS FOR NASA WORKMANSHIP STANDARDS
NASA STD 5005 : 2013	STANDARD FOR THE DESIGN AND FABRICATION OF GROUND SUPPORT EQUIPMENT
MIL DTL 53078 : A	MOUNTING KIT: M1 TANK CLEARED LANE MARKING SYSTEM (CLAMS)
NASA KSC DE 512-SM : 2012	FACILITY SYSTEMS, GROUND SUPPORT SYSTEMS, AND GROUND SUPPORT EQUIPMENT GENERAL DESIGN REQUIREMENTS
GEIA STD 0006 : 2008	REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS
GEIA STD 0005-1 : 2012	PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
NASA MSFC STD 3012 : 2012	ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS MANAGEMENT AND CONTROL REQUIREMENTS FOR MSFC SPACE FLIGHT HARDWARE
NASA KSC STD E 0010 : 1994	SOLDERING OF ELECTRICAL CONNECTIONS (HAND OR MACHINE), STANDARD FOR
NASA JSC 20793 : 2017	CREWED SPACE VEHICLE BATTERY SAFETY REQUIREMENTS
NASA GSFC STD 8002 : 2015	STANDARD QUALITY ASSURANCE REQUIREMENTS FOR THE USE OF WATER SOLUBLE FLUX
NASA JSC 66491 : 2013	STANDARD FOR JSC LEAD-FREE CONTROL PLANS (LFCP)
NASA STD 8739.4 : 2016	WORKMANSHIP STANDARD FOR CRIMPING, INTERCONNECTING CABLES, HARNESSES, AND WIRING
MIL HDBK 454 : B	GENERAL GUIDELINES FOR ELECTRONIC EQUIPMENT

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J STD 001 : F

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