J STD 002 : D

Superseded View Superseded By

Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES

Publisher: Institute of Printed Circuits

Published:

Available Formats: Hardcopy - English
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Table of Contents - (Show below) - (Hide below)

1 PREFACE
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
4 TEST PROCEDURES
5 NOTES
APPENDIX A - Critical Component Surfaces
APPENDIX B - Evaluation Aids
APPENDIX C - Calculation of Maximum
             Theoretical Force
APPENDIX D - Calculation of Integrated Value
             of Area of the Wetting Curve
APPENDIX E - Informative Annex
APPENDIX F - J-STD-002/J-STD-003 Activated
             Solderability Test Flux Rationale
             Committee Letter
APPENDIX G - Graphical Representations:
             Progression of Solder Wetting
             Curve Parameters As Measured
             By Wetting Balance Testing
APPENDIX H - Test Protocol for Wetting

Abstract - (Show below) - (Hide below)

Describes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs.

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Published
Document Type	Standard
Status	Superseded
Publisher	Institute of Printed Circuits
Pages
ISBN
Committee	5-20
Supersedes	EIA 638 : 1995 EIA 364-52 : B2009
Superseded By	IPC J-STD-002E : 2017

Standards Referenced By This Book - (Show below) - (Hide below)

I.S. EN IEC 60810:2018	LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS
DSCC 06012 : A	RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (2.0 WATT), STYLE 2816
DSCC 04006 : A	CAPACITORS, TANTALUM, HYBRID, HERMETICALLY SEALED
DSCC 04003 : E	CAPACITOR, TANTALUM, HYBRID, HERMETICALLY SEALED
SAE J 2685 : 2014	POSITIVE TEMPERATURE COEFFICIENT OVERCURRENT PROTECTION DEVICES (PTCS)
DSCC 06008 : A	RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (.125 WATT), STYLE 0805
ASTM B 965 : 2009	Standard Specification for High Performance Tin-Coated Annealed Copper Wire Intended for Electrical and Electronic Application for Solderability
BS EN 60068-2-69 : 2017	ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)
SAE AS 22759 : 2014	WIRE, ELECTRICAL, FLUOROPOLYMER-INSULATED, COPPER OR COPPER ALLOY
ASTM B 965 :	SPECIFICATION FOR HIGH PERFORMANCE TIN-COATED ANNEALED COPPER WIRE INTENDED FOR ELECTRICAL AND ELECTRONIC APPLICATION FOR SOLDERABILITY
IEC PAS 62686-2 : 1.0	PROCESS MANAGEMENT FOR AVIONICS - ELECTRONIC COMPONENTS FOR AEROSPACE, DEFENCE AND HIGH PERFORMANCE (ADHP) APPLICATIONS - PART 2: GENERAL REQUIREMENTS FOR PASSIVE COMPONENTS
SAE AS 29606 : 2014	WIRE, ELECTRICAL, STRANDED, UNINSULATED COPPER, COPPER ALLOY, OR ALUMINUM, OR THERMOCOUPLE EXTENSION, GENERAL SPECIFICATION FOR
EN 60068-2-69 : 2017 COR 2018	ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017/COR1:2018)
I.S. EN 60810:2015	LAMPS FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS
DSCC 06009 : A	RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (.25 WATT), STYLE 1206
DSCC 06010 : B	RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (.5 WATT), STYLE 2010
DSCC 15010 : A	CAPACITOR, TANTALUM, HYBRID, HERMETICALLY SEALED
BS EN 60810 : 2015	LAMPS FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS
DSCC 06007 : A	RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (.1 WATT), STYLE 0603
DSCC 06011 : C	RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (1.0 WATT), STYLE 2512
I.S. EN 60068-2-69:2017	ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
EN IEC 60810 : 2018	LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS (IEC 60810:2017)
BS EN IEC 60810 : 2018	LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS (IEC 60810:2017)
IEC 60810 : 5.0	LAMPS FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS
DIN EN 60068-2-69 : 2007	ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)
ASTM B 965 : 2009 : R2014	Standard Specification for High Performance Tin-Coated Annealed Copper Wire Intended for Electrical and Electronic Application for Solderability
VDE 0468-2-69 : 2018	ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)
IEC 60068-2-69 : 3.0	ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
IEC TS 62668-2 : 2ED 2016	PROCESS MANAGEMENT FOR AVIONICS - COUNTERFEIT PREVENTION - PART 2: MANAGING ELECTRONIC COMPONENTS FROM NON-FRANCHISED SOURCES
IEC 61191-1 : 2.0	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
GEIA HB 0005-2 : 2007	TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
I.S. EN 61191-2:2017	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
EN 61191-2 : 2017	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017)
BS PD IEC TS 62647-1 : 2012	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: PREPARATION FOR A LEAD-FREE CONTROL PLAN
BS PD IEC TS 62861 : 2017	GUIDELINES FOR PRINCIPAL COMPONENT RELIABILITY TESTING FOR LED LIGHT SOURCES AND LED LUMINAIRES
BS EN 61191-3 : 2017	PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES (IEC 61191-3:2017)
16/30350012 DC : 0	BS EN 60810 - LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS
BS PD IEC/PAS 62686-2 : 2016	PROCESS MANAGEMENT FOR AVIONICS - ELECTRONIC COMPONENTS FOR AEROSPACE, DEFENCE AND HIGH PERFORMANCE (ADHP) APPLICATIONS - PART 2: GENERAL REQUIREMENTS FOR PASSIVE COMPONENTS
BS EN 61191-4 : 2017	PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES (IEC 61191-4:2017)
IEC 61191-2 : 3.0	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
IPC 7351 : B	GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
14/30309696 DC : 0	BS EN 60068-2-69 ED 3.0 - ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
IEC 61191-4 : 2.0	PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
BS EN 61191-1 : 2013	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
BS PD IEC TS 62647-22 : 2013	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 22: TECHNICAL GUIDELINES
IEC TS 62861 : 1ED 2017	GUIDELINES FOR PRINCIPAL COMPONENT RELIABILITY TESTING FOR LED LIGHT SOURCES AND LED LUMINAIRES
IEC PAS 62647-1 : 1.0	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: LEAD-FREE MANAGEMENT
15/30327712 DC : 0	BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
BS EN 61191-2 : 2017	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017)
BS PD IEC/PAS 62647-1 : 2011	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: LEAD-FREE MANAGEMENT
IEC 62435-5 : 1ED 2017	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES
11/30255124 DC : 0	BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
IEC TS 62647-22 : 1ED 2013	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 22: TECHNICAL GUIDELINES
IEC PAS 62647-22 : 1.0	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 22: TECHNICAL GUIDELINES
BS EN 62435-5 : 2017	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES
BS PD IEC TS 62668-2 : 2016	PROCESS MANAGEMENT FOR AVIONICS - COUNTERFEIT PREVENTION - PART 2: MANAGING ELECTRONIC COMPONENTS FROM NON-FRANCHISED SOURCES
IEC 61191-3 : 2.0	PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
GEIA STD 0006 : 2008	REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS
GEIA STD 0005-1 : 2012	PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
J STD 075 : 0	CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES

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J STD 002 : D

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