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  • IPC J STD 005 : A

    Current The latest, up-to-date edition.

    REQUIREMENTS FOR SOLDERING PASTES

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    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 GENERAL
    2 APPLICABLE DOCUMENTS
    3 REQUIREMENTS
    4 QUALITY ASSURANCE PROVISIONS
    5 PREPARATION FOR DELIVERY
    6 NOTES
    APPENDIX A - Test Report on Solder Paste

    Abstract - (Show below) - (Hide below)

    Specifies requirements for qualification and characterization of solder paste. It references test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes.

    General Product Information - (Show below) - (Hide below)

    Development Note Supersedes QQ S 571, IPC SP 819, QPL 14256 and QPL QQ S 571. Included in IPC C 103 & IPC C 1000. (07/2009) 1995 Edition is still available in Japanese Language, See J STD 005 JAPANESE. (02/2012) Also available in Russian Language, See J STD 005 RUSSIAN. (11/2012) Also available in Chinese Language, See J STD 005 CHINESE. (03/2013) Also available in Hardcopy format. (01/2018)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

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    Standards Referencing This Book - (Show below) - (Hide below)

    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
    IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 006 : C REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
    IPC J STD 004 : B REQUIREMENTS FOR SOLDERING FLUXES
    IPC TM 650 : 0 TEST METHODS MANUAL
    IPC A 20/21 : 1996 STANDARD PITCH STENCIL PATTERN FOR SLUMP - GERBER FORMAT
    ISO 9001:2015 Quality management systems — Requirements
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