IPC J STD 006 : C

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Current The latest, up-to-date edition.

REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS

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Published date: 12-08-2013

Publisher: Institute of Printed Circuits

Table of Contents - (Show below) - (Hide below)

1 PREFACE
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
4 QUALITY ASSURANCE PROVISIONS
5 PREPARATION FOR DELIVERY
6 NOTES
Appendix A - Solder Alloys
Appendix B - Examples of Inspection
             Report Format
Appendix B-1 - Test Report for Solder Alloy Composition
               and Impurity Level
Appendix B-2 - Inspection Report for Fluxed
               Wire/Ribbon Solder Individual
               Inspection and Test Results
Appendix B-3 - Inspection Report for Non-Fluxed Solder
               Individual Inspection and Test Results
Appendix B-4 - Inspection Report for
               Solder Powder

Abstract - (Show below) - (Hide below)

Describes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, wire, and powder solders, for electronic soldering applications; and for 'special form' electronic grade solders.

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Committee	5-20
Development Note	Supersedes MIL F 14256, QQ S 571, QPL 14256 & QPL QQ S 571. (07/2004) Also available in CD-ROM format. Included in IPC C 103 & IPC C 1000. B2006 + A1 2008 Edition is still available in Japanese Language, See J STD 006 JAPANESE. (10/2009) B2006 + A2 2009 Edition is still available in Russian Language, See separate record (12/2011) Also available in Chinese Language, See J STD 006 CHINESE. (04/2014)
Document Type	Standard
ISBN
Pages
Product Note	NEW CHILD AMD 1 2017 IS NOW ADDED
Published
Publisher	Institute of Printed Circuits
Status	Current
Supersedes	QPL-QQ-S-571 Revision 110:1985 QQ-S-571 Revision F:1994 MIL-F-14256 Revision F:1993

Standards Referenced By This Book - (Show below) - (Hide below)

MIL-DTL-15514 Revision G:2016	TELEPHONE EQUIPMENT, SOUND POWERED TELEPHONE HANDSET, HEADSET - CHEST SET, AND HEADSET - CHEST SET, NOISE ATTENUATING
MIL-DTL-83513-30 Revision B:2009	CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, PIN CONTACTS, 4 ROW, SOLDER TYPE, STANDARD PROFILE, 100 CONTACTS, PRINTED CIRCUIT BOARD
MIL-DTL-32025 Base Document:1998	CARTRIDGE, IMPULSE, CCU-96/B
MIL-PRF-31032 Revision C:2016	Printed Circuit Board/Printed Wiring Board, General Specification for
MIL-PRF-94 Revision G:2006	Resistor, Variable, Composition, General Specification for
MIL-DTL-4339 Revision E:2009	CORROSION PREVENTIVE, SOLUBLE OIL FOR WATER INJECTION SYSTEMS (NATO CODE NUMBER C-630)
MIL-DTL-4510 Revision F:2009	SPOTLIGHTS, INCANDESCENT, ROOF-MOUNTED, AUTOMOTIVE
MS27145 Revision C:2003	CONNECTOR, PLUG, ELECTRICAL, NO. 14 AWG DOUBLE CONTACT, WATERPROOF
MIL-DTL-83513-32 Revision B:2009	Connectors, Electrical, Rectangular, Receptacle, Microminiature, Polarized Shell, Straight, Socket Contacts, 3 Row, Solder Type, Standard Profile, 51 Contacts, Printed Circuit Board
MIL-DTL-13623 Revision E:2010	SWITCH, ROTARY: 28 VOLT DC
MIL-DTL-83513-13 Revision D:2009	CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, SOCKET CONTACTS, 2 ROW, SOLDER TYPE, NARROW PROFILE, 9 THROUGH 37 CONTACTS, PRINTED CIRCUIT BOARD
MIL R 23285 : B	RESISTOR, VARIABLE, NONWIRE WOUND GENERAL SPECIFICATION FOR
MIL-DTL-28748-19 Base Document:2005	CONNECTORS, ELECTRICAL, RECTANGULAR, RACK AND PANEL, PRINTED WIRING BOARD (PWB) MOUNT, STRAIGHT THROUGH, SOCKET CONTACTS, SIZE 22
MIL-DTL-83513-27 Revision D:2009	CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, SOCKET CONTACTS, 4 ROW, SOLDER TYPE, 100 CONTACTS, PRINTED CIRCUIT BOARD
MIL-DTL-83513-23 Revision D:2009	CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, PIN CONTACTS, 3 ROW, SOLDER TYPE, 51 CONTACTS, PRINTED CIRCUIT BOARD
MIL-DTL-83513-33 Revision B:2008	Connectors, Electrical, Rectangular, Receptacle, Microminiature, Polarized Shell, Straight, Socket Contacts, 4 Row, Solder Type, Standard Profile, 100 Contacts, Printed Circuit Board
MIL-PRF-27208 Revision F:2006	RESISTOR, VARIABLE, WIREWOUND, NONPRECISION, GENERAL SPECIFICATION FOR
SAE AS 83519 : 2015	SHIELD TERMINATION, SOLDER STYLE, INSULATED, HEAT-SHRINKABLE, ENVIRONMENT RESISTANT GENERAL SPECIFICATION FOR
I.S. EN 61191-2:2017	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
MIL-STD-883 Revision K:2016	TEST METHOD STANDARD - MICROCIRCUITS
BS EN 61191-3:2017	Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
SAE AS 95234A : 2020	CONNECTORS, ELECTRICAL, REVERSE BAYONET, GENERAL SPECIFICATION FOR
IEC PAS 62250:2001	Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1)
IEC 61191-4:2017	Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
BS EN 61191-1:2013	Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
I.S. EN 61191-1:2013	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
EN 61191-3:2017	Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
IPC J STD 002 CHINESE : C	SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
MIL-DTL-83513 Revision G:2008	Connectors, Electrical, Rectangular, Microminiature, Polarized Shell, General Specification for
MIL-C-11272 Revision E:2008	CAPACITORS, FIXED, GLASS DIELECTRIC, GENERAL SPECIFICATION FOR
MIL-PRF-914 Revision C:2008	RESISTOR NETWORK, FIXED, FILM, SURFACE MOUNT, NONESTABLISHED RELIABILITY, AND ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
IPC AJ 820 : A	ASSEMBLY AND JOINING HANDBOOK
IPC 6012 RUSSIAN : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
MIL C 5 : G	CAPACITOR, FIXED, MICA DIELECTRIC, GENERAL SPECIFICATION FOR
MIL C 39019 : C	CIRCUIT BREAKERS, MAGNETIC, LOW-POWER, SEALED, TRIP-FREE, GENERAL SPECIFICATION FOR
IPC J STD 001 SWEDISH : E	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
MIL-DTL-3607 Revision C:2009	Connectors, Coaxial, Radiofrequency, Series for Pulse, General Specification for
MIL-STD-202-208 Base Document:2015	METHOD 208, SOLDERABILITY
MIL-DTL-28778 Revision A:2005	TRANSFORMER, POWER, STEPUP, 3 PHASE
MIL-PRF-31031 Revision C:2014	CONNECTORS, ELECTRICAL, PLUGS AND RECEPTACLES, COAXIAL, RADIO FREQUENCY, HIGH RELIABILITY, FOR FLEXIBLE AND SEMIRIGID CABLES, GENERAL SPECIFICATION FOR
MIL-DTL-12109-21 Revision B:2011	SOLENOID, ELECTRICAL; CLASS 2 (MACHINE GUN) 7.62 MM, 24 VOLT DC, 8 AMP MAX
IPC J STD 003 CHINESE : B	SOLDERABILITY TESTS FOR PRINTED BOARDS
MIL-DTL-22641 Revision G:2016	ADAPTERS, COAXIAL TO WAVEGUIDE, GENERAL SPECIFICATION FOR
IPC J STD 001 RUSSIAN : E	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
MIL-DTL-7879 Revision E:2013	Antenna AT-141A/ARC
IPC LDFR0805-CD : 2005	IPC/JEDEC 9TH INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES AUGUST 2005
IPC SPVC-LAT1 : 2010	ANALYTICAL PROCEDURES FOR PORTABLE LEAD-FREE ALLOY TEST DATA
IPC J STD 005 RUSSIAN : A	REQUIREMENTS FOR SOLDERING FLUXES
IPC J STD 001 TURKISH : E2010	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC WHMA A 620 HUNGARIAN : B	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC J STD 001 POLISH : E	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
MIL-DTL-13253 Revision E:2007	HANDSETS, GENERAL SPECIFICATION FOR
IPC LDFR1006-CD : 2006	IPC/JEDEC INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES "ROHS COMPLIANCE AND BEYOND"
MIL-DTL-14072 Revision F:2013	FINISHES FOR GROUND BASED ELECTRONIC EQUIPMENT
MIL PRF 83513 : D	CONNECTORS, ELECTRICAL, RECTANGULAR, MICROMINIATURE, POLARIZED SHELL, GENERAL SPECIFICATION FOR
IPC WHMA A 620 TURKISH : B2012 AMD 1 2013	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC 2221 GERMAN : B	GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 6012 POLISH : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC WHMA A 620 HEBREW : B2012 AMD 1 2013	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
MIL-DTL-15743 Revision F:2017	SWITCHES, ROTARY, ENCLOSED
IPC TP 1090 : 1996	THE LAYMAN'S GUIDE TO QUALIFYING NEW FLUXES FOR MIL-STD-2000A OR MT-0002
MIL-STD-2003-1 Revision A:2009	ELECTRIC PLANT INSTALLATION STANDARD METHODS FOR SURFACE SHIPS AND SUBMARINES (CABLE)
IPC LDFR0806-CD : 2006	IPC/JEDEC INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES "ROHS COMPLIANCE AND BEYOND"
IPC LDFR0605-CD : 2005	IPC/SOLDERTEC 3RD INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONICS "TOWARDS IMPLEMENTATION OF THE ROHS DIRECTIVE"
IPC LDFR1005-CD : 2005	IPC/JEDEC 11TH INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES
IPC LDFR1106-CD : 2006	IPC/JEDEC INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES "ROHS COMPLIANCE AND BEYOND"
IPC WHMA A 620 SPANISH : B	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC WHMA A 620 CHINESE : B	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC WHMA A 620 VIETNAMESE : B2012	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
MIL-DTL-32106 Base Document:2003	INITIATORS, ELECTRICAL, FOR ROCKET MOTOR IGNITERS
MIL B 18 : F	BATTERIES, NON-RECHARGEABLE, DRY
MIL-PRF-39003 Revision N:2016	Capacitor, Fixed, Electrolytic (Solid Electrolyte), Tantalum, Established Reliability, General Specification for
MIL-DTL-28754-62 Revision A:2016	CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, CONNECTOR, 100 PIN, CENTER, CROSSOVER, CONTACT TAILS ON .050 CENTERS
MIL-STD-2003-5 Revision A:2009	ELECTRIC PLANT INSTALLATION STANDARD METHODS FOR SURFACE SHIPS AND SUBMARINES (CONNECTORS)
MIL-DTL-28748 Revision D:2001	CONNECTOR, PLUG AND RECEPTACLE, RECTANGULAR, RACK AND PANEL SOLDER TYPE AND CRIMP TYPE CONTACTS - GENERAL SPECIFICATION FOR
MIL-PRF-55681 Revision G:2016	CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
IPC CH 65 : B	GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
IPC LDFR0306-CD : 2006	IPC/JEDEC INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES
IPC SPVC2005-CD : 2005	ROUND ROBIN TESTING AND ANALYSIS OF LEAD FREE SOLDER PASTES WITH ALLOYS OF TIN, SILVER AND COPPER
IPC CH 65 CHINESE : B	GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
IPC LDFR1205-CD : 2006	IPC/JEDEC 12TH INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES - DECEMBER 2005
MIL-DTL-917 Revision F:2014	ELECTRIC POWER EQUIPMENT, BASIC REQUIREMENTS FOR
MIL-DTL-3786 Revision J:2013	SWITCHES, ROTARY (CIRCUIT SELECTOR, LOW-CURRENT CAPACITY), GENERAL SPECIFICATION FOR
MIL-STD-1353 Revision C:2014	ELECTRICAL CONNECTORS, PLUG-IN SOCKETS AND ASSOCIATED HARDWARE, SELECTION AND USE OF
MIL-DTL-87104 Revision C:2014	COAXIAL ASSEMBLIES, GENERAL SPECIFICATION FOR
MIL STD 750-2 : A	MECHANICAL TEST METHODS FOR SEMICONDUCTOR DEVICES - PART 2: TEST METHODS 2001 THROUGH 2999
MIL-PRF-49467 Revision C:2005	Capacitor, Fixed, Ceramic, Multilayer, High Voltage (General Purpose), General Specification For
MIL-DTL-28827 Revision C:2011	SWITCHES, THERMOSTATIC, (VOLATILE LIQUID), HERMETICALLY SEALED, GENERAL SPECIFICATION FOR
IPC SM 840 : E	QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
MIL PRF 24308 : D	CONNECTORS, ELECTRIC, RECTANGULAR, NONENVIRONMENTAL, MINIATURE, POLARIZED SHELL, RACK AND PANEL, GENERAL SPECIFICATION FOR
IPC J STD 001 HUNGARIAN : E	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 GERMAN : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC HDBK 005 : 0	GUIDE TO SOLDER PASTE ASSESSMENT
IPC J STD 003 : C	SOLDERABILITY TESTS FOR PRINTED BOARDS
IPC SM 840 CHINESE : E	QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
IPC WHMA A 620 POLISH : B	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC 6012 FRENCH : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
MIL-DTL-28754-6 Revision D:2014	CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, 40 PIN, STRAIGHT THROUGH
MIL-DTL-1716 Revision J:1997	POLE, TENT, TELESCOPIC, ADJUSTABLE 5 FEET TO 9 FEET, MAGNESIUM
IPC MI 660 : 1984	INCOMING INSPECTION OF RAW MATERIALS MANUAL
MIL-DTL-28754-97 Revision A:2015	CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, CONNECTOR, 150 CONTACT, RIGHT ANGLE, CONTACT TAILS ON 0.100 CENTERS
MIL-DTL-9395 Revision K:2016	Switches, Pressure (Absolute, Gage and Differential) General Specification for
IPC 6013 GERMAN : B	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS
IPC LDFR0406-CD : 2006	IPC/SOLDERTEC GLOBAL 4TH INTERNATIONAL ELECTRONICS CONFERENCE AND EXHIBITION "ROHS COMPLIANCE AND BEYOND"
IPC J STD 001 ROMANIAN : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 005 : A	REQUIREMENTS FOR SOLDERING PASTES
MIL-PRF-27 Revision G:2014	TRANSFORMERS AND INDUCTORS (AUDIO, POWER, AND HIGH-POWER PULSE), GENERAL SPECIFICATION FOR
MIL STD 11991 : A	GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES
IPC J STD 005 CHINESE : A	REQUIREMENTS FOR SOLDERING PASTES
IPC J STD 001 DANISH : E	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
MIL DTL 28754/60 : A	CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, CONNECTOR, 100 PIN, CENTER CONTACT TAILS ON .100 CENTERS
MIL-DTL-16225 Revision C:2010	LOUDSPEAKER, PERMANENT MAGNET, BLASTPROOF AND SUBMERSIBLE, NAVY TYPE 49546()
MIL-DTL-11996 Revision C:2015	HANDSETS, GENERAL SPECIFICATION FOR
PPP-B-1672 Revision E:2013	BOXES, SHIPPING, REUSABLE WITH CUSHIONING
MIL-DTL-12606 Revision E:2000	LOUDSPEAKER, PERMANENT MAGNET (UNENCASED, 3-INCH AND 4-INCH DIAMETER CONE, 2-WATT; FUNGUS-, AND IMMERSION-RESISTANT), TYPE LS-445/U, M12606-01, AND M12606-02
IPC 6018 CHINESE : B	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD
MIL-DTL-12632 Revision E:2016	LOUDSPEAKERS, PERMANENT MAGNET (ENCASED, 2-WATT, FUNGUS-, GUNBLAST-, AND IMMERSION-RESISTANT), GENERAL SPECIFICATION FOR
IPC WHMA A 620 ESTONIAN : B2012 AMD 1 2013	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
IPC TP 1115 : 1998	SELECTION AND IMPLEMENTATION STRATEGY FOR A LOW-RESIDUE, NO-CLEAN PROCESS
IPC WHMA A 620 KOREAN : B2012 AMD 1 2013	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
MIL-DTL-18793 Revision B:2011	ANTENNA AS-333/AP
MIL-DTL-28754-8 Revision D:2014	Connectors, Electrical, Modular, Type IV, 40 Contact, Right Angle (for Die Cast Frame)
MIL-DTL-28754-11 Revision F:2014	CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, 40 CONTACT, RIGHT ANGLE (FOR SOLID OR DIP FRAME)
MIL-DTL-28754-59 Revision A:2016	CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, CONNECTOR, 100 PIN, CENTER CONTACT TAILS ON .100 CENTERS (CERAMIC COMPATIBLE)
MIL-DTL-83513-29 Revision B:2009	CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, PIN CONTACTS, 3 ROW, SOLDER TYPE, STANDARD PROFILE, 51 CONTACTS, PRINTED CIRCUIT BOARD
MIL-DTL-28748-18 Base Document:2005	CONNECTORS, ELECTRICAL, RECTANGULAR, RACK AND PANEL, PRINTED WIRING BOARD (PWB) MOUNT, STRAIGHT THROUGH, PIN CONTACTS, SIZE 22
MIL-DTL-83513-25 Revision D:2009	CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, SOCKET CONTACTS, 2 ROW, SOLDER TYPE, 9 THROUGH 37 CONTACTS, PRINTED CIRCUIT BOARD
MIL-DTL-83513-22 Revision D:2009	CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, PIN CONTACTS, 2 ROW, SOLDER TYPE, 9 THROUGH 37 CONTACTS, PRINTED CIRCUIT BOARD
MIL-DTL-13625 Revision G:2017	SWITCHES, PULL; SWITCHES, PUSH; SWITCHES, BEAM SELECTING, HEADLIGHT: ELECTRICAL (28 VOLTS DC MAXIMUM, FOR MILITARY VEHICLES)
MIL-DTL-83513-17 Revision D:2009	Connectors, Electrical, Rectangular, Plug, Microminiature, Polarized Shell, Right Angle, Pin Contacts, 3 Row, Solder Type, Standard Profile, 51 Contacts, Printed Circuit Board
MIL-DTL-83513-19 Revision D:2009	Connectors, Electrical, Rectangular, Receptacle, Microminiature, Polarized Shell, Right Angle, Socket Contacts, 2 Row, Solder Type, Standard Profile, 9 Through 37 Contacts, Printed Circuit Board
MIL-DTL-83513-21 Revision D:2009	CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, SOCKET CONTACTS, 4 ROW, SOLDER TYPE, STANDARD PROFILE, 100 CONTACTS, PRINTED CIRCUIT BOARD
MIL-DTL-83513-24 Revision D:2009	CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, PIN CONTACTS, 4 ROW, SOLDER TYPE, 100 CONTACTS, PRINTED CIRCUIT BOARD
MIL-DTL-16878 Revision H:2012	WIRE, ELECTRICAL, INSULATED, GENERAL SPECIFICATION FOR
MIL-DTL-25516 Revision F:2004	CONNECTORS, ELECTRICAL, MINIATURE, COAXIAL, ENVIRONMENT RESISTANT TYPE, GENERAL SPECIFICATION FOR
MIL-DTL-83513-18 Revision D:2009	Connectors, Electrical, Rectangular, Plug, Microminiature, Polarized Shell, Right Angle, Pin Contacts, 4 Row, Solder Type, Standard Profile, 100 Contacts, Printed Circuit Board
MIL-PRF-15733 Revision J:2010	FILTERS AND CAPACITORS, RADIO FREQUENCY INTERFERENCE, GENERAL SPECIFICATION FOR
MIL R 27208 : D	RESISTOR, VARIABLE, WIRE-WOUND, NONPRECISION, GENERAL SPECIFICATION FOR
MIL F 28861 : B	FILTER AND CAPACITOR, RADIO FREQUENCY/ELECTROMAGNETIC INTERFERENCE SUPPRESSION, GENERAL SPECIFICATION FOR
MS27144 Revision D:2016	CONNECTOR, PLUG, ELECTRICAL, SOCKET CONTACT, NO. 14 AND 16 AWG, WATERPROOF
AWS WHC2.13 : 0	WELDING PROCESSES - PART 1, WELDING HANDBOOK, 9TH EDITION, VOL. 2 - CHAPTER 13: SOLDERING
MIL-DTL-83513-26 Revision D:2009	CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, SOCKET CONTACTS, 3 ROW, SOLDER TYPE, 51 CONTACTS, PRINTED CIRCUIT BOARD
MIL-DTL-3976 Revision F:2013	Lights, Marker, Clearance (Service and Blackout) General Specification for
MIL-DTL-83513-10 Revision D:2008	CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, PIN CONTACTS, 2 ROW, SOLDER TYPE, NARROW PROFILE, 9 THROUGH 37 CONTACTS, PRINTED CIRCUIT BOARD
MIL-PRF-28861 Revision E:2016	FILTERS AND CAPACITORS, RADIO FREQUENCY/ELECTROMAGNETIC INTERFERENCE SUPPRESSION, GENERAL SPECIFICATION FOR
MIL-DTL-21567 Revision B:2009	COMPOUND, SILICONE, SOFT FILM
MIL R 94 : E	RESISTORS, VARIABLE, COMPOSITION, GENERAL SPECIFICATION FOR
MIL-PRF-81705 Revision E:2009	Barrier Materials, Flexible, Electrostatic Discharge Protective, Heat-Sealable
MS90908 Revision C:2011	FILLER TUBE, FUEL TANK - MILITARY VEHICLES
PD IEC/TS 62647-1:2012	Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan
IEC PAS 62647-23:2011	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
IEC 61191-2:2017	Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
13/30295427 DC : 0	BS IEC/PAS 61249-8-5 ED.1 - QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
I.S. EN 61191-4:2017	PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
IPC J STD 001 CHINESE : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
I.S. EN 61191-3:2017	PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
MIL-DTL-5015 Revision H:2000	CONNECTORS, ELECTRICAL, CIRCULAR THREADED, AN TYPE - GENERAL SPECIFICATION FOR
IPC J STD 001 SPANISH : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 FRENCH : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC WHMA A 620 DANISH : B	REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
MIL-DTL-28754-14 Revision D:2014	Connectors, Electrical, Modular, Connector, Type IV, 20 Contact, Right Angle (for Die Cast Frame)
MIL-DTL-26482 Revision H:2007	Connectors, Electrical, Circular, Miniature, Quick Disconnect, Environment Resisting, Receptacles and Plugs, General Specification for
MIL-DTL-28748-21 Base Document:2005	Connectors, Electrical, Rectangular, Rack and Panel, Printed Wiring Board (PWB) Mount, Right Angle, Socket Contacts, Size 22
MIL-PRF-6864 Revision F:2010	CLEANING COMPOUND, SOLVENT, OIL COOLER
MIL-DTL-32234 Base Document:2007	CONNECTORS, ELECTRICAL, ULTRA HIGH DENSITY, MODULAR, BLADE AND FORK, EIGHT ROW, GENERAL SPECIFICATION FOR
MIL-DTL-83513-31 Revision B:2009	CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATUREE, POLARIZED SHELL, STRAIGHT, SOCKET CONTACTS, 2 ROW, SOLDER TYPE, STANDARD PROFILE, 9 THROUGH 37 CONTACTS, PRINTED CIRCUIT BOARD
MIL-DTL-83513-16 Revision D:2009	Connectors, Electrical, Rectangular, Plug, Microminiature, Polarized Shell, Right Angle, Pin Contacts, 2 Row, Solder Type, Standard Profile, 9 Through 37 Contacts, Printed Circuit Board
MIL-DTL-83513-14 Revision D:2009	CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, SOCKET CONTACTS, 3 ROW, SOLDER TYPE, NARROW PROFILE, 51 CONTACTS, PRINTED CIRCUIT BOARD
MIL-PRF-22097 Revision J:2007	RESISTOR, VARIABLE, NONWIREWOUND, ADJUSTMENT TYPE, GENERAL SPECIFICATION FOR
IPC TR 582 : 0	CLEANING AND CLEANLINESS TESTING PROGRAM FOR PHASE 3 - LOW SOLIDS, FLUXES AND PASTES PROCESSED IN AMBIENT AIR
MIL-PRF-32560 Base Document:2016	COIL, RADIO FREQUENCY, SURFACE MOUNT, FIXED ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
SAE AMS P 81728 : 2015	PLATING, TIN-LEAD (ELECTRODEPOSITED)
GEIA HB 0005-3 : 2008	REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
GEIA HB 0005-2 : 2007	TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
BS EN 61191-4:2017	Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies
MIL-DTL-39024 Revision C:2014	JACK, TIP (TEST POINT, PANEL OR PRINTED WIRING TYPE), GENERAL SPECIFICATION FOR
NASA STD 8739.3 : 1998	SOLDERED ELECTRICAL CONNECTIONS
MIL-STD-981 Revision C:2010	DESIGN, MANUFACTURING AND QUALITY STANDARDS FOR CUSTOM ELECTROMAGNETIC DEVICES FOR SPACE APPLICATIONS
NASA MSFC STD 2907 : 2006	WORKMANSHIP STANDARD FOR PRINTED WIRING BOARDS
MIL-B-49030 Revision A:2010	BATTERIES, DRY (ALKALINE)
NASA KSC SPEC E 0031 : 2008	CABLES, ELECTRICAL, SPECIFICATION FOR
GEIA STD 0006 : 2008	REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS
MIL-DTL-28754-47 Revision C:2015	CONNECTORS, ELECTRICAL MODULAR, TYPE 4, CONNECTOR, 100 PIN, RIGHT ANGLE CONTACT TAILS ON .100 CENTERS
GEIA STD 0005-1 : 2012	PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
NASA MSFC STD 3012 : 2012	ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS MANAGEMENT AND CONTROL REQUIREMENTS FOR MSFC SPACE FLIGHT HARDWARE
NASA KSC SPEC E 0024 : 2008	CABLE, ELECTRICAL, SHIELDED, JACKETED, FOR HARNESS ASSEMBLIES, GENERAL SPECIFICATION FOR
NASA STD 8739.2 : 1999	WORKMANSHIP STANDARD FOR SURFACE MOUNT TECHNOLOGY
IEC TS 62647-1:2012	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
MIL-STD-186 Revision F:2002	PROTECTIVE FINISHING SYSTEMS FOR ROCKETS, GUIDED MISSILES, SUPPORT EQUIPMENT AND RELATED MATERIALS
MIL-DTL-28754-10 Revision D:2014	CONNECTORS, ELECTRICAL, MODULAR, CONNECTOR, TYPE 4, 40 PIN, CONTACT TAILS ON 0.050 CENTERS
MIL-DTL-28754-101 Revision A:2015	CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, CONNECTOR, 0.6 PITCH, 250 CONTACT, CENTER
MIL-DTL-24308 Revision G:2009	Connectors, Electric, Rectangular, Nonenvironmental, Miniature, Polarized Shell, Rack and Panel, General Specification for
MIL-PRF-31033 Revision B:2011	Capacitor, Fixed, Ceramic Dielectric, High Reliability, Discoidal, General Specification for
MIL-DTL-83513-12 Revision D:2009	CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, PIN CONTACTS, 4 ROW, SOLDER TYPE, NARROW PROFILE, 100 CONTACTS, PRINTED CIRCUIT BOARD
MIL-DTL-8416 Revision C:2005	ADAPTER, HEADSET-MICROPHONE MX-1646()/AIC
MIL-DTL-83513-11 Revision D:2009	CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, PIN CONTACTS, 3 ROW, SOLDER TYPE, NARROW PROFILE, 51 CONTACTS, PRINTED CIRCUIT BOARD
MIL-DTL-5794 Revision C:2006	MICROPHONE UNIT M-6A/UR AND MICROPHONE, CARBON M-51/UR (CARBON NOISE CANCELING)
MIL L 12632 : D	LOUDSPEAKER, PERMANENT MAGNET (ENCASED, 2 WATT, FUNGUS, GUNBLAST, AND IMMERSION RESISTANT), GENERAL SPECIFICATION FOR
MIL-DTL-27434 Revision B:2003	ADAPTERS, CONNECTOR, COAXIAL, RADIO FREQUENCY, BETWEEN SERIES, GENERAL SPECIFICATION FOR
MIL-STD-1276 Revision H:2013	Leads for Electronic Component Parts
MIL-DTL-76 Revision E:2016	WIRE AND CABLE, HOOKUP, ELECTRICAL, INSULATED, GENERAL SPECIFICATION FOR
AWS C3.11M/C3.11:2011	SPECIFICATION FOR TORCH SOLDERING
MIL-DTL-10986 Revision G:2007	INDICATORS AND TRANSMITTERS: LIQUID, TEMPERATURE AND PRESSURE
MIL-PRF-29607 Base Document:1996	CLEANING COMPOUND, AVIONICS COMPONENTS, NON-OZONE DEPLETING
MIL-DTL-83513-15 Revision E:2009	CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, SOCKETS CONTACTS, 4 ROW, SOLDER TYPE, NARROW PROFILE, 100 CONTACTS, PRINTED CIRCUIT BOARD
SAE AS 39029 : 2017	CONTACTS, ELECTRICAL CONNECTOR, GENERAL SPECIFICATION FOR
SAE AS 50151 : 2015	CONNECTORS, ELECTRICAL, CIRCULAR THREADED, AN TYPE, GENERAL SPECIFICATION FOR
SAE AS 4461 : 2016	ASSEMBLY AND SOLDERING CRITERIA FOR HIGH QUALITY/HIGH RELIABILITY SOLDERING WIRE AND CABLE TERMINATION IN AEROSPACE VEHICLES
IEC 61191-1:2013	Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
MIL-STD-202-210 Base Document:2015	METHOD 210, RESISTANCE TO SOLDERING HEAT
IEC TS 62647-23:2013	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
PD IEC/TS 62647-23:2013	Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
IEC PAS 61249-8-5:2014	Qualification and performance specification of permanent solder mask and flexible cover materials
IEC PAS 62647-1:2011	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
15/30327712 DC : 0	BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
PD IEC/PAS 62647-1:2011	Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management
11/30255124 DC : 0	BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
IEC TS 62647-22:2013	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
IEC PAS 62647-22:2011	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
IEC PAS 62249:2001	Qualification and performance specification for flexible printed boards
DD IEC PAS 62647-23 : DRAFT AUG 2011	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES
IEC 61191-3:2017	Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
PD IEC/PAS 61249-8-5:2014	Qualification and performance specification of permanent solder mask and flexible cover materials
MIL-DTL-28754-100 Revision A:2015	CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, CONNECTOR, 200 CONTACT, CENTER
MIL-DTL-28754-61 Revision A:2016	CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, CONNECTOR, 100 PIN, CENTER, CROSSOVER, CONTACT TAILS ON .100 CENTERS (CERAMIC COMPATIBLE)
MIL-DTL-83513-28 Revision B:2009	CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, PIN CONTACTS, 2 ROW, SOLDER TYPE, STANDARD PROFILE, 9 THROUGH 37 CONTACTS, PRINTED CIRCUIT BOARD
MIL-DTL-55235 Revision A:2003	CONNECTORS, COAXIAL, RADIO FREQUENCY, SERIES TPS, GENERAL SPECIFICATION
MIL-DTL-21617 Revision B:2012	CONNECTORS, PLUG AND RECEPTACLE, ELECTRICAL, RECTANGULAR, POLARIZED SHELL, MINIATURE TYPE, GENERAL SPECIFICATION FOR
MIL-DTL-83502 Revision E:2007	Sockets, Plug-in Electronic Components, Round Style, General Specification for
MIL-DTL-28748-20 Base Document:2005	Connectors, Electrical, Rectangular, Rack and Panel, Printed Wiring Board (PWB) Mount, Right Angle, Pin Contacts, Size 22
MIL-DTL-3655 Revision D:2004	Connector, Plug and Receptacle, Electrical (Coaxial, Series Twin), and Associated Fittings, General Specification for
MIL-DTL-55302-83 Revision C:2004	CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: PLUG, PIN CONTACTS, 41, 66, 114 CONTACT POSITIONS: FOR PRINTED WIRING BOARDS (.100 X .050 OFFSET GRID)
SAE AS 95234 : 2014	CONNECTORS, ELECTRICAL, REVERSE BAYONET, GENERAL SPECIFICATION FOR
SAE AS 29600 : 2017	CONNECTORS, ELECTRICAL, CIRCULAR, MINIATURE, COMPOSITE, HIGH DENSITY, QUICK COUPLING, ENVIRONMENT RESISTANT, REMOVABLE CRIMP CONTACTS ASSOCIATED HARDWARE, GENERAL SPECIFICATION FOR
MIL-DTL-83513-20 Revision D:2009	Connectors, Electrical, Rectangular, Receptacle, Microminiature, Polarized Shell, Right Angle, Socket Contacts, 3 Row, Solder Type, Standard Profile, 51 Contacts, Printed Circuit Board
MIL-DTL-3643 Revision B:2003	Connectors, Coaxial, Radio Frequency, Series HN, and Associated Fittings, General Specification for
MIL-DTL-3650 Revision B:2003	Connectors, Coaxial, Radio Frequency, Series LC
EN 61191-2:2017	Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
MS35644 Revision G:2011	FILLER NECK: FUEL TANK - MILITARY VEHICLES
PD IEC/TS 62647-22:2013	Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines
DSCC 99002 : A	TRANSFORMER, SWITCHING
IPC 2221B:2012	GENERIC STANDARD ON PRINTED BOARD DESIGN
EN 61191-1:2013	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
IPC 2221 FRENCH : B2012	GENERIC STANDARD ON PRINTED BOARD DESIGN
MIL-DTL-18714 Revision F:2012	PRIMER, ELECTRIC, MARK 45 MOD 1
EN 61191-4:2017	Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

Standards Referencing This Book - (Show below) - (Hide below)

IPC J STD 609 : A	MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
IPC T 50 : M	TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC J STD 004 : B	REQUIREMENTS FOR SOLDERING FLUXES
IPC TM 650 : 0	TEST METHODS MANUAL
IPC J STD 005 : A	REQUIREMENTS FOR SOLDERING PASTES
ISO 9001:2015	Quality management systems — Requirements
ISO 9453:2014	Soft solder alloys Chemical compositions and forms
ISO 10012-1:1992	Quality assurance requirements for measuring equipment Part 1: Metrological confirmation system for measuring equipment

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