I.S. EN 62435-2:2017
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ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS |
IEC PAS 62168 : 1.0
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SYMBOL AND LABELS FOR MOISTURE-SENSITIVE DEVICES |
BS EN 60068-2-58 : 2015
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ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
BS EN 62435-2 : 2017
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ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS |
SAE AS 6294/1 : 2017
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REQUIREMENTS FOR PLASTIC ENCAPSULATED MICROCIRCUITS IN SPACE APPLICATIONS |
17/30357139 DC : 0
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BS EN 61760-4 + A1 - SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
12/30261600 DC : DRAFT MAR 2012
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BS EN 61760-4 - CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
BS EN 60068-3-13 : 2016
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ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING |
DD IEC TS 62239 : 2003
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PROCESS MANAGEMENT FOR AVIONICS - PREPARATION OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
AEC Q005 : 2010
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PB-FREE TEST REQUIREMENTS |
DSCC 13031 : A
|
FUSE, INSTRUMENT, SUBMINIATURE |
IEC PAS 62239 : 1.0
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ELECTRONIC COMPONENT MANAGEMENT PLANS |
IPC 7095 : C
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DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
11/30243259 DC : 0
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BS EN 60068-2-58 ED.4 - ENVIRONMENTAL TESTING - PART 2-58: TESTS TD- TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
VDA 4992-1 : 2015
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VDA MAT LABEL |
J STD 035 : 0
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ACOUSTIC MICROSCOPY FOR NON-HERMETIC ENCAPSULATED ELECTRONIC COMPONENTS |
GEIA SSB 1.002 : 1999
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ENVIRONMENTAL TESTS AND ASSOCIATED FAILURE MECHANISMS |
DSCC 14001 : 0
|
FUSE, INSTRUMENT, SUBMINIATURE |
12/30256751 DC : 0
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BS EN 62047-20 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 20: GYROSCOPES |
BS EN 62258-1 : 2010
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SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
MIL PRF 38534 : K
|
HYBRID MICROCIRCUITS, GENERAL SPECIFICATION FOR |
BS EN 62047-20 : 2014
|
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 20: GYROSCOPES |
ANSI C78.374 : 2015
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AMERICAN NATIONAL STANDARD FOR ELECTRIC LAMPS - LIGHT-EMITTING DIODE PACKAGE SPECIFICATION SHEET FOR GENERAL ILLUMINATION APPLICATIONS |
MIL PRF 19500/672 : 0
|
SEMICONDUCTOR DEVICE, TRANSISTOR, PLASTIC, NPN, SILICON, SWITCHING, TYPE 2N2222AUE1 JAN, JANTX, JANJ |
SAE AS 6171/8 : 2016
|
TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY RAMAN SPECTROSCOPY TEST METHODS |
I.S. EN 62047-20:2014
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SEMICONDUCTOR DEVICES - MICROELECTROMECHANICAL DEVICES - PART 20: GYROSCOPES |
IPC 9631 GERMAN : -
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RICHTLINIE FUER DIE ANWENDUNG DER IPC-TM-650, METHODE 2.6.27, THERMISCHER STRESS, SIMULATION DES KONVEKTIONS-REFLOW-LOETENS |
MIL PRF 19500/686 : 0
|
SEMICONDUCTOR DEVICE, TRANSISTOR, PLASTIC, PNP, SILICON, SWITCHING, TYPE 2N2907AUE1 JAN, JANTX, JANJ |
MIL PRF 19500/695 : 0
|
SEMICONDUCTOR DEVICE, TRANSISTOR, PLASTIC, PNP, SILICON, SWITCHING, TYPE 2N4033UE1 JAN, JANTX, JANJ |
BS EN 61760-4 : 2015
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
IEC PAS 62686-2 : 1.0
|
PROCESS MANAGEMENT FOR AVIONICS - ELECTRONIC COMPONENTS FOR AEROSPACE, DEFENCE AND HIGH PERFORMANCE (ADHP) APPLICATIONS - PART 2: GENERAL REQUIREMENTS FOR PASSIVE COMPONENTS |
SAE AS 6171/11 : 2016
|
TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY DESIGN RECOVERY TEST METHODS |
IEC 62047-20 : 1ED 2014
|
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 20: GYROSCOPES |
BS EN 16602-60-13 : 2015
|
SPACE PRODUCT ASSURANCE - REQUIREMENTS FOR THE USE OF COTS COMPONENTS |
IEC PAS 62050 : 1.0
|
BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS |
SAE AS 6171/10 : 2016
|
TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY THERMOGRAVIMETRIC ANALYSIS (TGA) TEST METHODS |
SAE J 1211 : 2012
|
HANDBOOK FOR ROBUSTNESS VALIDATION OF AUTOMOTIVE ELECTRICAL/ELECTRONIC MODULES |
AEC Q006 : 2016
|
QUALIFICATION REQUIREMENTS FOR COMPONENTS USING COPPER (CU) WIRE INTERCONNECTIONS |
IEC 61760-4 : 1ED 2015
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
SAE AS 6171/6 : 2016
|
TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY ACOUSTIC MICROSCOPY (AM) TEST METHODS |
I.S. EN 62258-1:2010
|
SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
AEC Q100 : 2014
|
FAILURE MECHANISM BASED STRESS TEST QUALIFICATION FOR INTEGRATED CIRCUITS |
SAE AS 6294/2 : 2018
|
REQUIREMENTS FOR PLASTIC ENCAPSULATED MICROCIRCUITS IN MILITARY AND AVIONICS APPLICATIONS |
IEC 62090 : 2.0
|
PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO-DIMENSIONAL SYMBOLOGIES |
CEI EN 61760-4 : 2016
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
I.S. EN 61760-4:2015
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
IEC TS 62686-1 : 2.0
|
PROCESS MANAGEMENT FOR AVIONICS - ELECTRONIC COMPONENTS FOR AEROSPACE, DEFENCE AND HIGH PERFORMANCE (ADHP) APPLICATIONS - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS |
IPC 1756 : 2010
|
MANUFACTURING PROCESS DATA MANAGEMENT |
IEEE 2700 : 2014
|
SENSOR PERFORMANCE PARAMETER DEFINITIONS |
IPC M 109 : LATEST
|
COMPONENTS HANDLING MANUAL |
TS 102 671 : 9.2.0
|
SMART CARDS; MACHINE TO MACHINE UICC; PHYSICAL AND LOGICAL CHARACTERISTICS (RELEASE 9) |
IPC 9631 : 0
|
USER GUIDE FOR IPC-TM-650 - METHOD 2.6.27: THERMAL STRESS, CONVECTION REFLOW ASSEMBLY SIMULATION |
I.S. EN 60068-3-13:2016
|
ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING |
SAE J 1879 : 2014
|
HANDBOOK FOR ROBUSTNESS VALIDATION OF SEMICONDUCTOR DEVICES IN AUTOMOTIVE APPLICATIONS |
SAE AS 6171/2 : 0
|
TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY EXTERNAL VISUAL INSPECTION, REMARKING AND RESURFACING, AND SURFACE TEXTURE ANALYSIS TEST METHODS |
IEC 60068-2-58 : 4.1
|
ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
I.S. EN 60068-2-58:2015
|
ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
IEC 61191-1 : 2.0
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
IEC TS 62239-1 : 2.0
|
PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
GEIA HB 0005-3 : 2008
|
REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
GEIA HB 0005-2 : 2007
|
TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
EN 61760-4 : 2015 AMD 1 2018
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES (IEC 61760-4:2015/A1:2018) |
IEC PAS 60191-6-19 : 1.0
|
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-19: MEASUREMENT METHODS OF PACKAGE WARPAGE AT ELEVATED TEMPERATURE AND THE MAXIMUM PERMISSIBLE WARPAGE |
IEC TS 62239 : 2.0
|
PROCESS MANAGEMENT FOR AVIONICS - PREPARATION OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
I.S. EN 61191-2:2017
|
PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
EN 61191-2 : 2017
|
PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017) |
BS PD IEC TS 62647-1 : 2012
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: PREPARATION FOR A LEAD-FREE CONTROL PLAN |
BS PD IEC TS 62861 : 2017
|
GUIDELINES FOR PRINCIPAL COMPONENT RELIABILITY TESTING FOR LED LIGHT SOURCES AND LED LUMINAIRES |
BS EN 61191-3 : 2017
|
PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES (IEC 61191-3:2017) |
BS EN 61189-5-1 : 2016
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - GUIDANCE FOR PRINTED BOARD ASSEMBLIES |
IEC 62258-1 : 2.0
|
SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
17/30365636 DC : 0
|
BS EN 62239-1 ED.1.0 - PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
BS PD IEC TS 62239-1 : 2015
|
PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
BS PD IEC/PAS 62686-2 : 2016
|
PROCESS MANAGEMENT FOR AVIONICS - ELECTRONIC COMPONENTS FOR AEROSPACE, DEFENCE AND HIGH PERFORMANCE (ADHP) APPLICATIONS - PART 2: GENERAL REQUIREMENTS FOR PASSIVE COMPONENTS |
IEC TS 62647-23 : 1ED 2013
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES |
BS PD IEC TS 62647-23 : 2013
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES |
DD IEC PAS 62686-1 : DRAFT JULY 2011
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS |
BS EN 61191-4 : 2017
|
PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES (IEC 61191-4:2017) |
IEC PAS 62686-1 : 1.0
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS |
IEC PAS 62647-23 : 1.0
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES |
IEC 61191-2 : 3.0
|
PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
DD IEC PAS 62050 : DRAFT 2004
|
BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS |
IEC 61191-4 : 2.0
|
PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
BS EN 61191-1 : 2013
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
BS PD IEC TS 62647-22 : 2013
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 22: TECHNICAL GUIDELINES |
IEC TS 62861 : 1ED 2017
|
GUIDELINES FOR PRINCIPAL COMPONENT RELIABILITY TESTING FOR LED LIGHT SOURCES AND LED LUMINAIRES |
IEC PAS 62647-1 : 1.0
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: LEAD-FREE MANAGEMENT |
15/30327712 DC : 0
|
BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
BS EN 61191-2 : 2017
|
PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017) |
BS PD IEC/PAS 62647-1 : 2011
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: LEAD-FREE MANAGEMENT |
IEC 61189-5-1 : 1ED 2016
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - GUIDANCE FOR PRINTED BOARD ASSEMBLIES |
11/30255124 DC : 0
|
BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
IEC TS 62647-22 : 1ED 2013
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 22: TECHNICAL GUIDELINES |
IEC PAS 62647-22 : 1.0
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 22: TECHNICAL GUIDELINES |
IEC 62435-2 : 1ED 2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS |
IEC 60068-3-13 : 1ED 2016
|
ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING |
BS PD IEC TS 62686-1 : 2015
|
PROCESS MANAGEMENT FOR AVIONICS - ELECTRONIC COMPONENTS FOR AEROSPACE, DEFENCE AND HIGH PERFORMANCE (ADHP) APPLICATIONS - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS |
DD IEC PAS 62647-23 : DRAFT AUG 2011
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES |
IEC 61191-3 : 2.0
|
PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES |
GEIA STD 0006 : 2008
|
REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS |
GEIA STD 0005-1 : 2012
|
PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
EIA STD 4899 : 2017-05
|
REQUIREMENTS FOR AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
GEIA SSB 1.001 : 1999
|
QUALIFICATION AND RELIABILITY MONITORS |
NASA MSFC STD 3012 : 2012
|
ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS MANAGEMENT AND CONTROL REQUIREMENTS FOR MSFC SPACE FLIGHT HARDWARE |
NASA JSC 66491 : 2013
|
STANDARD FOR JSC LEAD-FREE CONTROL PLANS (LFCP) |
J STD 075 : 0
|
CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES |
EIA 4899 : 2001
|
STANDARD FOR PREPARING AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |