J STD 020 : D-1

Superseded View Superseded By

Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES

Available format(s): Hardcopy

Language(s): English

Published date: 01-03-2008

Publisher: Institute of Printed Circuits

Table of Contents - (Show below) - (Hide below)

1 PURPOSE
2 APPLICABLE DOCUMENTS
3 APPARATUS
4 CLASSIFICATION/RECLASSIFICATION
5 PROCEDURE
6 CRITERIA
7 MOISTURE/REFLOW SENSITIVITY
CLASSIFICATION
8 OPTIONAL WEIGHT GAIN/LOSS ANALYSIS
9 ADDITIONS AND EXCEPTIONS
ANNEX A
ANNEX B

Abstract - (Show below) - (Hide below)

Pertains to all nonhermetic SMDs in packages, which, because of absorbed moisture, could be sensitive to damage during solder reflow.

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Published
Document Type	Standard
Status	Superseded
Publisher	Institute of Printed Circuits
Development Note	Supersedes IPC SM 786 and EIA JESD 22 A112. Included in IPC C 103 & IPC C 1000. (10/2012) Jointly published by IPC & JEDEC. D.1 2008 Edition is still available in Russian Language See separate records. Also available in Chinese Language, See J STD 020 CHINESE. (05/2016) Also available in Hardcopy format. (01/2018)
Pages
ISBN
Supersedes	IPC SM 786 : A1995
Superseded By	J STD 020 : E

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
IEC PAS 62190 : 1.0	Identical

Standards Referenced By This Book - (Show below) - (Hide below)

I.S. EN 62435-2:2017	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS
IEC PAS 62168 : 1.0	SYMBOL AND LABELS FOR MOISTURE-SENSITIVE DEVICES
BS EN 60068-2-58 : 2015	ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
BS EN 62435-2 : 2017	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS
SAE AS 6294/1 : 2017	REQUIREMENTS FOR PLASTIC ENCAPSULATED MICROCIRCUITS IN SPACE APPLICATIONS
17/30357139 DC : 0	BS EN 61760-4 + A1 - SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
12/30261600 DC : DRAFT MAR 2012	BS EN 61760-4 - CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
BS EN 60068-3-13 : 2016	ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING
DD IEC TS 62239 : 2003	PROCESS MANAGEMENT FOR AVIONICS - PREPARATION OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
AEC Q005 : 2010	PB-FREE TEST REQUIREMENTS
DSCC 13031 : A	FUSE, INSTRUMENT, SUBMINIATURE
IEC PAS 62239 : 1.0	ELECTRONIC COMPONENT MANAGEMENT PLANS
IPC 7095 : C	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
11/30243259 DC : 0	BS EN 60068-2-58 ED.4 - ENVIRONMENTAL TESTING - PART 2-58: TESTS TD- TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
VDA 4992-1 : 2015	VDA MAT LABEL
J STD 035 : 0	ACOUSTIC MICROSCOPY FOR NON-HERMETIC ENCAPSULATED ELECTRONIC COMPONENTS
GEIA SSB 1.002 : 1999	ENVIRONMENTAL TESTS AND ASSOCIATED FAILURE MECHANISMS
DSCC 14001 : 0	FUSE, INSTRUMENT, SUBMINIATURE
12/30256751 DC : 0	BS EN 62047-20 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 20: GYROSCOPES
BS EN 62258-1 : 2010	SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
MIL PRF 38534 : K	HYBRID MICROCIRCUITS, GENERAL SPECIFICATION FOR
BS EN 62047-20 : 2014	SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 20: GYROSCOPES
ANSI C78.374 : 2015	AMERICAN NATIONAL STANDARD FOR ELECTRIC LAMPS - LIGHT-EMITTING DIODE PACKAGE SPECIFICATION SHEET FOR GENERAL ILLUMINATION APPLICATIONS
MIL PRF 19500/672 : 0	SEMICONDUCTOR DEVICE, TRANSISTOR, PLASTIC, NPN, SILICON, SWITCHING, TYPE 2N2222AUE1 JAN, JANTX, JANJ
SAE AS 6171/8 : 2016	TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY RAMAN SPECTROSCOPY TEST METHODS
I.S. EN 62047-20:2014	SEMICONDUCTOR DEVICES - MICROELECTROMECHANICAL DEVICES - PART 20: GYROSCOPES
IPC 9631 GERMAN : -	RICHTLINIE FUER DIE ANWENDUNG DER IPC-TM-650, METHODE 2.6.27, THERMISCHER STRESS, SIMULATION DES KONVEKTIONS-REFLOW-LOETENS
MIL PRF 19500/686 : 0	SEMICONDUCTOR DEVICE, TRANSISTOR, PLASTIC, PNP, SILICON, SWITCHING, TYPE 2N2907AUE1 JAN, JANTX, JANJ
MIL PRF 19500/695 : 0	SEMICONDUCTOR DEVICE, TRANSISTOR, PLASTIC, PNP, SILICON, SWITCHING, TYPE 2N4033UE1 JAN, JANTX, JANJ
BS EN 61760-4 : 2015	SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
IEC PAS 62686-2 : 1.0	PROCESS MANAGEMENT FOR AVIONICS - ELECTRONIC COMPONENTS FOR AEROSPACE, DEFENCE AND HIGH PERFORMANCE (ADHP) APPLICATIONS - PART 2: GENERAL REQUIREMENTS FOR PASSIVE COMPONENTS
SAE AS 6171/11 : 2016	TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY DESIGN RECOVERY TEST METHODS
IEC 62047-20 : 1ED 2014	SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 20: GYROSCOPES
BS EN 16602-60-13 : 2015	SPACE PRODUCT ASSURANCE - REQUIREMENTS FOR THE USE OF COTS COMPONENTS
IEC PAS 62050 : 1.0	BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS
SAE AS 6171/10 : 2016	TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY THERMOGRAVIMETRIC ANALYSIS (TGA) TEST METHODS
SAE J 1211 : 2012	HANDBOOK FOR ROBUSTNESS VALIDATION OF AUTOMOTIVE ELECTRICAL/ELECTRONIC MODULES
AEC Q006 : 2016	QUALIFICATION REQUIREMENTS FOR COMPONENTS USING COPPER (CU) WIRE INTERCONNECTIONS
IEC 61760-4 : 1ED 2015	SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
SAE AS 6171/6 : 2016	TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY ACOUSTIC MICROSCOPY (AM) TEST METHODS
I.S. EN 62258-1:2010	SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
AEC Q100 : 2014	FAILURE MECHANISM BASED STRESS TEST QUALIFICATION FOR INTEGRATED CIRCUITS
SAE AS 6294/2 : 2018	REQUIREMENTS FOR PLASTIC ENCAPSULATED MICROCIRCUITS IN MILITARY AND AVIONICS APPLICATIONS
IEC 62090 : 2.0	PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO-DIMENSIONAL SYMBOLOGIES
CEI EN 61760-4 : 2016	SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
I.S. EN 61760-4:2015	SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
IEC TS 62686-1 : 2.0	PROCESS MANAGEMENT FOR AVIONICS - ELECTRONIC COMPONENTS FOR AEROSPACE, DEFENCE AND HIGH PERFORMANCE (ADHP) APPLICATIONS - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS
IPC 1756 : 2010	MANUFACTURING PROCESS DATA MANAGEMENT
IEEE 2700 : 2014	SENSOR PERFORMANCE PARAMETER DEFINITIONS
IPC M 109 : LATEST	COMPONENTS HANDLING MANUAL
TS 102 671 : 9.2.0	SMART CARDS; MACHINE TO MACHINE UICC; PHYSICAL AND LOGICAL CHARACTERISTICS (RELEASE 9)
IPC 9631 : 0	USER GUIDE FOR IPC-TM-650 - METHOD 2.6.27: THERMAL STRESS, CONVECTION REFLOW ASSEMBLY SIMULATION
I.S. EN 60068-3-13:2016	ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING
SAE J 1879 : 2014	HANDBOOK FOR ROBUSTNESS VALIDATION OF SEMICONDUCTOR DEVICES IN AUTOMOTIVE APPLICATIONS
SAE AS 6171/2 : 0	TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY EXTERNAL VISUAL INSPECTION, REMARKING AND RESURFACING, AND SURFACE TEXTURE ANALYSIS TEST METHODS
IEC 60068-2-58 : 4.1	ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
I.S. EN 60068-2-58:2015	ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
IEC 61191-1 : 2.0	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
IEC TS 62239-1 : 2.0	PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
GEIA HB 0005-3 : 2008	REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
GEIA HB 0005-2 : 2007	TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
EN 61760-4 : 2015 AMD 1 2018	SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES (IEC 61760-4:2015/A1:2018)
IEC PAS 60191-6-19 : 1.0	MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-19: MEASUREMENT METHODS OF PACKAGE WARPAGE AT ELEVATED TEMPERATURE AND THE MAXIMUM PERMISSIBLE WARPAGE
IEC TS 62239 : 2.0	PROCESS MANAGEMENT FOR AVIONICS - PREPARATION OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
I.S. EN 61191-2:2017	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
EN 61191-2 : 2017	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017)
BS PD IEC TS 62647-1 : 2012	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: PREPARATION FOR A LEAD-FREE CONTROL PLAN
BS PD IEC TS 62861 : 2017	GUIDELINES FOR PRINCIPAL COMPONENT RELIABILITY TESTING FOR LED LIGHT SOURCES AND LED LUMINAIRES
BS EN 61191-3 : 2017	PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES (IEC 61191-3:2017)
BS EN 61189-5-1 : 2016	TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - GUIDANCE FOR PRINTED BOARD ASSEMBLIES
IEC 62258-1 : 2.0	SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
17/30365636 DC : 0	BS EN 62239-1 ED.1.0 - PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
BS PD IEC TS 62239-1 : 2015	PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
BS PD IEC/PAS 62686-2 : 2016	PROCESS MANAGEMENT FOR AVIONICS - ELECTRONIC COMPONENTS FOR AEROSPACE, DEFENCE AND HIGH PERFORMANCE (ADHP) APPLICATIONS - PART 2: GENERAL REQUIREMENTS FOR PASSIVE COMPONENTS
IEC TS 62647-23 : 1ED 2013	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES
BS PD IEC TS 62647-23 : 2013	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES
DD IEC PAS 62686-1 : DRAFT JULY 2011	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS
BS EN 61191-4 : 2017	PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES (IEC 61191-4:2017)
IEC PAS 62686-1 : 1.0	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS
IEC PAS 62647-23 : 1.0	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES
IEC 61191-2 : 3.0	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
DD IEC PAS 62050 : DRAFT 2004	BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS
IEC 61191-4 : 2.0	PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
BS EN 61191-1 : 2013	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
BS PD IEC TS 62647-22 : 2013	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 22: TECHNICAL GUIDELINES
IEC TS 62861 : 1ED 2017	GUIDELINES FOR PRINCIPAL COMPONENT RELIABILITY TESTING FOR LED LIGHT SOURCES AND LED LUMINAIRES
IEC PAS 62647-1 : 1.0	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: LEAD-FREE MANAGEMENT
15/30327712 DC : 0	BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
BS EN 61191-2 : 2017	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017)
BS PD IEC/PAS 62647-1 : 2011	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: LEAD-FREE MANAGEMENT
IEC 61189-5-1 : 1ED 2016	TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - GUIDANCE FOR PRINTED BOARD ASSEMBLIES
11/30255124 DC : 0	BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
IEC TS 62647-22 : 1ED 2013	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 22: TECHNICAL GUIDELINES
IEC PAS 62647-22 : 1.0	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 22: TECHNICAL GUIDELINES
IEC 62435-2 : 1ED 2017	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS
IEC 60068-3-13 : 1ED 2016	ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING
BS PD IEC TS 62686-1 : 2015	PROCESS MANAGEMENT FOR AVIONICS - ELECTRONIC COMPONENTS FOR AEROSPACE, DEFENCE AND HIGH PERFORMANCE (ADHP) APPLICATIONS - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS
DD IEC PAS 62647-23 : DRAFT AUG 2011	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES
IEC 61191-3 : 2.0	PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
GEIA STD 0006 : 2008	REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS
GEIA STD 0005-1 : 2012	PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
EIA STD 4899 : 2017-05	REQUIREMENTS FOR AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
GEIA SSB 1.001 : 1999	QUALIFICATION AND RELIABILITY MONITORS
NASA MSFC STD 3012 : 2012	ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS MANAGEMENT AND CONTROL REQUIREMENTS FOR MSFC SPACE FLIGHT HARDWARE
NASA JSC 66491 : 2013	STANDARD FOR JSC LEAD-FREE CONTROL PLANS (LFCP)
J STD 075 : 0	CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES
EIA 4899 : 2001	STANDARD FOR PREPARING AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
I.S. EN 61191-4:2017	PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
J STD 001 CHINESE : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
I.S. EN 61191-3:2017	PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
AEC Q102 : 2017	FAILURE MECHANISM BASED STRESS TEST QUALIFICATION FOR DISCRETE OPTOELECTRONIC SEMICONDUCTORS IN AUTOMOTIVE APPLICATIONS
J STD 001 SPANISH : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
J STD 001 FRENCH : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC 7093 : 0	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS

Standards Referencing This Book - (Show below) - (Hide below)

IPC TM 650 : 0	TEST METHODS MANUAL
J STD 033 : C-1	HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
J STD 035 : 0	ACOUSTIC MICROSCOPY FOR NON-HERMETIC ENCAPSULATED ELECTRONIC COMPONENTS
J STD 075 : 0	CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES

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J STD 020 : D-1

Table of Contents - (Show below) - (Hide below)

Abstract - (Show below) - (Hide below)

General Product Information - (Show below) - (Hide below)

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Standards Referenced By This Book - (Show below) - (Hide below)

Standards Referencing This Book - (Show below) - (Hide below)

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