IPC J STD 032 : 0

Withdrawn

Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

PERFORMANCE STANDARD FOR BALL GRID ARRAY BALLS

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Withdrawn date: 14-09-2023

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Publisher: Institute of Printed Circuits

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1 SCOPE
  1.1 Purpose
  1.2 Intent
  1.3 Terms and Definitions
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
  3.1 General Performance Requirements
  3.2 Classes of Ball Grid Array Joints
  3.3 Mechanical Requirements
  3.4 Electrical Parameters
  3.5 Metallurgical/Chemical Requirements
4 CONSTRUCTION OF BGA BALLS
  4.1 Physical Characteristics
Appendix A NORMATIVE TERMINOLOGY
Appendix B ACRONYMS

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Defines the construction detail requirements for balls and other terminal structures on Ball Grid Array (BGA) packages.

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Development Note	Jointly published by IPC & EIA. (01/2018)
Document Type	Standard
ISBN
Pages
Published
Publisher	Institute of Printed Circuits
Status	Withdrawn

Standards Referencing This Book - (Show below) - (Hide below)

IPC A 610 : F	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC E 500 : LATEST	IPC ELECTRONIC DOCUMENT COLLECTION
IPC J STD 013 : 0	IMPLEMENTATION OF BALL GRID ARRAY AND OTHER HIGH DENSITY TECHNOLOGY
IPC 7095 : C	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS

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