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  • IPC J STD 033C-1:2014

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES

    Available format(s):  Hardcopy

    Superseded date:  21-09-2023

    Language(s):  English

    Published date:  01-08-2014

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 FOREWORD
    2 APPLICABLE DOCUMENTS (Normative)
    3 DRY PACKING
    4 DRYING
    5 USE
    6 BOARD REWORK
    7 DERATING DUE TO FACTORY
      ENVIRONMENTAL CONDITIONS
    APPENDIX A - Test Method for Reversible
                 (Type 1) RH Spots on a
                 Humidity Indictor Card (HIC)
                 used with Electronic Device
                 Packaging
    APPENDIX B - Derivation of Bake Tables
    APPENDIX C - Desiccant Unit Absorption
                 Capacity Test Method for
                 Verification
    APPENDIX D - Changes in J-STD-033D

    Abstract - (Show below) - (Hide below)

    Gives manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow and process sensitive devices that have been classified to the levels defined in J-STD-020 or J-STD-075.

    General Product Information - (Show below) - (Hide below)

    Committee JC-14.1
    Development Note Supersedes IPC SM 786 & EIA JEP 124. B.1 2007 Edition is still available in Russian and Italian Languages, See separate records. (02/2012) C2012 Edition is still available in Hungarian, German & Chinese Languages, See separate records. (10/2014) Jointly Published by IPC and JEDEC. (05/2016)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    PD IEC/TS 62239-2:2017 Process management for avionics. Management plan Preparation and maintenance of an electronic COTS assembly management plan
    BS EN 16602-60-14:2014 Space product assurance. Relifing procedure. EEE components
    IPC J STD 035 : 0 ACOUSTIC MICROSCOPY FOR NON-HERMETIC ENCAPSULATED ELECTRONIC COMPONENTS
    GEIA SSB 1.002 : 1999 ENVIRONMENTAL TESTS AND ASSOCIATED FAILURE MECHANISMS
    SAE AS 6294/2 : 2018 REQUIREMENTS FOR PLASTIC ENCAPSULATED MICROCIRCUITS IN MILITARY AND AVIONICS APPLICATIONS
    BS EN 62258-1:2010 Semiconductor die products Procurement and use
    SAE AS 6171/11 : 2016 TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY DESIGN RECOVERY TEST METHODS
    IPC 7801 : 0 REFLOW OVEN PROCESS CONTROL STANDARD
    IEC PAS 62050:2004 Board level drop test method of components for handheld electronic products
    I.S. EN 62258-1:2010 SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
    I.S. EN 16602-60-14:2014 SPACE PRODUCT ASSURANCE - RELIFING PROCEDURE - EEE COMPONENTS
    SAE AS 6171 : 2016 TEST METHODS STANDARD; GENERAL REQUIREMENTS, SUSPECT/COUNTERFEIT, ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL PARTS
    MIL-STD-883 Revision K:2016 TEST METHOD STANDARD - MICROCIRCUITS
    EN 60749-20-1 : 2009 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
    EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
    EN 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
    EN 62258-1:2010 Semiconductor die products - Part 1: Procurement and use
    IPC AJ 820 : A ASSEMBLY AND JOINING HANDBOOK
    IPC J STD 001 SWEDISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC A 610 DANISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC J STD 001 RUSSIAN : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC 9501 : 0 PWB ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF ELECTRONIC COMPONENTS (PRECONDITIONING IC COMPONENTS)
    IPC A 610 SPANISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC J STD 001 TURKISH : E2010 REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    JEDEC JESD 22-B113B:2018 Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of SMT ICs for Handheld Electronic Products
    IPC J STD 001 POLISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC A 610 ROMANIAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC 1601 GERMAN : - PRINTED BOARD HANDLING AND STORAGE GUIDELINES
    IPC 7092 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS
    IPC A 610 CZECH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC 7093 CHINESE : - DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
    IPC A 610 GERMAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC A 610 HINDI : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC 9592 : B REQUIREMENTS FOR POWER CONVERSION DEVICES FOR THE COMPUTER AND TELECOMMUNICATIONS INDUSTRIES
    IPC 9500 : 2003 ASSEMBLY PROCESS COMPONENT SIMULATIONS, GUIDELINES & CLASSIFICATIONS PACKAGE
    IPC 9504 : 0 ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF NON-IC COMPONENTS (PRECONDITIONING NON-IC COMPONENTS)
    IPC A 610 ESTONIAN : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC A 610 POLISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC A 610 DUTCH : F2014 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC 9502 : 0 PWB ASSEMBLY SOLDERING PROCESS GUIDELINE FOR ELECTRONIC COMPONENTS
    IPC A 610 ITALIAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC A 610 FRENCH : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC A 610 KOREAN : F2014 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC J STD 001 HUNGARIAN : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 GERMAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC A 610 SWEDISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC J STD 075 GERMAN : 0 CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES
    IPC A 610 HUNGARIAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC 7351 GERMAN : B Basic requirements for SMT design and SMD patch guideline
    IPC A 610 CHINESE : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC A 610 TURKISH : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC J STD 001 ROMANIAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    MIL STD 11991 : A GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES
    IPC A 610 JAPANESE : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC A 610 VIETNAMESE : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC J STD 075 CHINESE : - CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES
    IPC J STD 001 DANISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC A 610 RUSSIAN : D ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    I.S. EN 62435-2:2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS
    I.S. EN 62435-1:2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL
    IPC 7095 : C DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
    BS EN 62258-2:2011 Semiconductor die products Exchange data formats
    SAE AS 6171/8 : 2016 TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY RAMAN SPECTROSCOPY TEST METHODS
    SAE AS 6171/10 : 2016 TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY THERMOGRAVIMETRIC ANALYSIS (TGA) TEST METHODS
    PD IEC/TS 62647-1:2012 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan
    IEC PAS 62647-23:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
    IPC 7351 : B GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
    DD IEC PAS 62050 : DRAFT 2004 BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS
    IPC J STD 001 CHINESE : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 SPANISH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 FRENCH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC 7093 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
    DSCC 89115 : E CAPACITORS, FIXED, SURFACE MOUNT, METALLIZED POLYESTER FILM, NONHERMETICALLY SEALED
    IEC 62435-4:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage
    I.S. EN 62258-2:2011 SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS
    IEC TS 62239-2:2017 Process management for avionics - Management plan - Part 2: Preparation and maintenance of an electronic COTS assembly management plan
    IEC 61760-4:2015 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
    ARINC 669 : 2004 GUIDANCE FOR LEAD-BASED SOLDERING, REPAIR AND REWORK
    GEIA HB 0005-3 : 2008 REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
    GEIA HB 0005-2 : 2007 TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
    I.S. ES 59008-5-3:2002 DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 5-3: PARTICULAR REQUIREMENTS AND RECOMMENDATIONS FOR DIE TYPES - MINIMALLY-PACKAGED DIE
    EN 61760-4:2015/A1:2018 SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES (IEC 61760-4:2015/A1:2018)
    IEC PAS 62686-1:2011 Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
    GEIA STD 0003 : 2006 LONG TERM STORAGE OF ELECTRONIC DEVICES
    GEIA STD 0006 : 2008 REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS
    GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
    NASA JSC 66491 : 2013 STANDARD FOR JSC LEAD-FREE CONTROL PLANS (LFCP)
    IPC J STD 075 : 0 CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES
    EN 16602-60-14:2014 Space product assurance - Relifing procedure - EEE components
    IEC TS 62647-1:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
    IEC PAS 62168:2000 Symbols and labels for moisture-sensitive devices
    BS EN 62435-2:2017 Electronic components. Long-term storage of electronic semiconductor devices Deterioration mechanisms
    SAE AS 6294/1 : 2017 REQUIREMENTS FOR PLASTIC ENCAPSULATED MICROCIRCUITS IN SPACE APPLICATIONS
    BS EN 16602-60-13:2015 Space product assurance. Requirements for the use of COTS components
    IEC PAS 62686-2:2016 Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 2: General requirements for passive components
    ARINC 671 : 2006 GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR
    IEC TS 62686-1:2015 Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
    IPC J STD 020 CHINESE : D-1 MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES
    IPC M 109 : LATEST COMPONENTS HANDLING MANUAL
    PD IEC/PAS 62686-2:2016 Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for passive components
    IEC TS 62647-23:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
    PD IEC/TS 62647-23:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
    DD IEC PAS 62686-1 : DRAFT JULY 2011 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS
    IEC PAS 62647-1:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
    PD IEC/PAS 62647-1:2011 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management
    IEC 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
    IEC TS 62647-22:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    IEC PAS 62647-22:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    IEC 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
    IEC 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats
    BS EN 62435-5:2017 Electronic components. Long-term storage of electronic semiconductor devices Die and wafer devices
    PD IEC/TS 62668-2:2016 Process management for avionics. Counterfeit prevention Managing electronic components from non-franchised sources
    PD IEC/TS 62686-1:2015 Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors
    DD IEC PAS 62647-23 : DRAFT AUG 2011 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES
    ES 59008-5-3 : 2001 DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 5-3: PARTICULAR REQUIREMENTS AND RECOMMENDATIONS FOR DIE TYPES - MINIMALLY-PACKAGED DIE
    EN 16602-60-13:2015 Space product assurance - Requirements for the use of COTS components
    BS EN 62435-1:2017 Electronic components. Long-term storage of electronic semiconductor devices General
    MIL-PRF-23199-1 Revision B:2010 PACKAGING, PACKING AND MARKING (PP&M) REQUIREMENTS FOR INSTRUMENTATION AND CONTROL EQUIPMENT
    BS EN 60749-20-1:2009 Semiconductor devices. Mechanical and climatic test methods Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
    12/30261600 DC : DRAFT MAR 2012 BS EN 61760-4 - CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
    BS EN 61760-4 : 2015 SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
    I.S. EN 61760-4:2015 SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
    I.S. EN 60749-20-1:2009 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
    CEI EN 62258-2 : 2012 SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS
    IEC 60749-20-1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
    IEC 62258-1:2009 Semiconductor die products - Part 1: Procurement and use
    PD IEC/TS 62647-22:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines
    CEI EN 62258-1 : 2011 SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
    EN 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
    EN 62258-2:2011 SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS
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