J STD 033 : C-1

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Current The latest, up-to-date edition.

HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES

Publisher: Institute of Printed Circuits

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Available Formats: Hardcopy - English
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Table of Contents - (Show below) - (Hide below)

1 FOREWORD
2 APPLICABLE DOCUMENTS (Normative)
3 DRY PACKING
4 DRYING
5 USE
6 BOARD REWORK
7 DERATING DUE TO FACTORY
  ENVIRONMENTAL CONDITIONS
APPENDIX A - Test Method for Reversible
             (Type 1) RH Spots on a
             Humidity Indictor Card (HIC)
             used with Electronic Device
             Packaging
APPENDIX B - Derivation of Bake Tables
APPENDIX C - Desiccant Unit Absorption
             Capacity Test Method for
             Verification
APPENDIX D - Changes in J-STD-033D

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Gives manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow and process sensitive devices that have been classified to the levels defined in J-STD-020 or J-STD-075.

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Published
Document Type	Standard
Status	Current
Publisher	Institute of Printed Circuits
Pages
ISBN
Committee	JC-14.1
Supersedes	IPC SM 786 : A1995

Standards Referenced By This Book - (Show below) - (Hide below)

DSCC 89115 : E	CAPACITORS, FIXED, SURFACE MOUNT, METALLIZED POLYESTER FILM, NONHERMETICALLY SEALED
BS EN 62435-1 : 2017	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL (IEC 62435-1:2017)
I.S. EN 62435-2:2017	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS
IEC PAS 62168 : 1.0	SYMBOL AND LABELS FOR MOISTURE-SENSITIVE DEVICES
BS PD IEC/TS 62239-2 : 2017	PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 2: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COTS ASSEMBLY MANAGEMENT PLAN
BS EN 62435-2 : 2017	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS
MIL PRF 23199/1 : B	PACKAGING, PACKING AND MARKING (PP&M) REQUIREMENTS FOR INSTRUMENTATION AND CONTROL EQUIPMENT
SAE AS 6294/1 : 2017	REQUIREMENTS FOR PLASTIC ENCAPSULATED MICROCIRCUITS IN SPACE APPLICATIONS
BS EN 60749-20-1 : 2009	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
IEC 62435-4 : 1ED 2018	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 4: STORAGE
12/30261600 DC : DRAFT MAR 2012	BS EN 61760-4 - CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
I.S. EN 62435-1:2017	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL
IPC 7095 : C	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
BS EN 16602-60-14 : 2014	SPACE PRODUCT ASSURANCE - RELIFING PROCEDURE - EEE COMPONENTS
J STD 035 : 0	ACOUSTIC MICROSCOPY FOR NON-HERMETIC ENCAPSULATED ELECTRONIC COMPONENTS
GEIA SSB 1.002 : 1999	ENVIRONMENTAL TESTS AND ASSOCIATED FAILURE MECHANISMS
BS EN 16602-60-13 : 2015	SPACE PRODUCT ASSURANCE - REQUIREMENTS FOR THE USE OF COTS COMPONENTS
BS EN 62258-2 : 2011	SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS
SAE AS 6294/2 : 2018	REQUIREMENTS FOR PLASTIC ENCAPSULATED MICROCIRCUITS IN MILITARY AND AVIONICS APPLICATIONS
BS EN 62258-1 : 2010	SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
SAE AS 6171/8 : 2016	TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY RAMAN SPECTROSCOPY TEST METHODS
BS EN 61760-4 : 2015	SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
IEC PAS 62686-2 : 1.0	PROCESS MANAGEMENT FOR AVIONICS - ELECTRONIC COMPONENTS FOR AEROSPACE, DEFENCE AND HIGH PERFORMANCE (ADHP) APPLICATIONS - PART 2: GENERAL REQUIREMENTS FOR PASSIVE COMPONENTS
I.S. EN 62258-2:2011	SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS
SAE AS 6171/11 : 2016	TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY DESIGN RECOVERY TEST METHODS
SAE AS 6171/10 : 2016	TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY THERMOGRAVIMETRIC ANALYSIS (TGA) TEST METHODS
IPC 7801 : 0	REFLOW OVEN PROCESS CONTROL STANDARD
IEC PAS 62050 : 1.0	BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS
IEC TS 62239-2 : 1ED 2017	PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 2: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COTS ASSEMBLY MANAGEMENT PLAN
IEC 61760-4 : 1ED 2015	SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
I.S. EN 62258-1:2010	SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
I.S. EN 16602-60-14:2014	SPACE PRODUCT ASSURANCE - RELIFING PROCEDURE - EEE COMPONENTS
ARINC 669 : 2004	GUIDANCE FOR LEAD-BASED SOLDERING, REPAIR AND REWORK
SAE AS 6171 : 2016	TEST METHODS STANDARD; GENERAL REQUIREMENTS, SUSPECT/COUNTERFEIT, ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL PARTS
I.S. EN 61760-4:2015	SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
ARINC 671 : 2006	GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR
IEC TS 62686-1 : 2.0	PROCESS MANAGEMENT FOR AVIONICS - ELECTRONIC COMPONENTS FOR AEROSPACE, DEFENCE AND HIGH PERFORMANCE (ADHP) APPLICATIONS - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS
I.S. EN 60749-20-1:2009	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
J STD 020 : D-1	MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES
CEI EN 62258-2 : 2012	SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS
J STD 020 CHINESE : D-1	MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES
IPC M 109 : LATEST	COMPONENTS HANDLING MANUAL
SAE AS 6171/2 : 0	TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY EXTERNAL VISUAL INSPECTION, REMARKING AND RESURFACING, AND SURFACE TEXTURE ANALYSIS TEST METHODS
GEIA HB 0005-3 : 2008	REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
GEIA HB 0005-2 : 2007	TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
I.S. ES 59008-5-3:2002	DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 5-3: PARTICULAR REQUIREMENTS AND RECOMMENDATIONS FOR DIE TYPES - MINIMALLY-PACKAGED DIE
EN 61760-4 : 2015 AMD 1 2018	SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES (IEC 61760-4:2015/A1:2018)
MIL STD 883 : K	TEST METHOD STANDARD - MICROCIRCUITS
BS PD IEC TS 62647-1 : 2012	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: PREPARATION FOR A LEAD-FREE CONTROL PLAN
IEC 60749-20-1 : 1.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
IEC 62258-1 : 2.0	SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
BS PD IEC/PAS 62686-2 : 2016	PROCESS MANAGEMENT FOR AVIONICS - ELECTRONIC COMPONENTS FOR AEROSPACE, DEFENCE AND HIGH PERFORMANCE (ADHP) APPLICATIONS - PART 2: GENERAL REQUIREMENTS FOR PASSIVE COMPONENTS
IEC TS 62647-23 : 1ED 2013	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES
BS PD IEC TS 62647-23 : 2013	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES
DD IEC PAS 62686-1 : DRAFT JULY 2011	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS
IEC PAS 62686-1 : 1.0	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS
IEC PAS 62647-23 : 1.0	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES
IPC 7351 : B	GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
DD IEC PAS 62050 : DRAFT 2004	BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS
BS PD IEC TS 62647-22 : 2013	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 22: TECHNICAL GUIDELINES
IEC PAS 62647-1 : 1.0	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: LEAD-FREE MANAGEMENT
BS PD IEC/PAS 62647-1 : 2011	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: LEAD-FREE MANAGEMENT
IEC 62435-5 : 1ED 2017	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES
(INACTIVE RECORD)IEC 62435-1 : 1ED 2017	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL
IEC TS 62647-22 : 1ED 2013	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 22: TECHNICAL GUIDELINES
IEC PAS 62647-22 : 1.0	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 22: TECHNICAL GUIDELINES
IEC 62435-2 : 1ED 2017	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS
IEC 62258-2 : 2.0	SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS
BS EN 62435-5 : 2017	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES
BS PD IEC TS 62668-2 : 2016	PROCESS MANAGEMENT FOR AVIONICS - COUNTERFEIT PREVENTION - PART 2: MANAGING ELECTRONIC COMPONENTS FROM NON-FRANCHISED SOURCES
BS PD IEC TS 62686-1 : 2015	PROCESS MANAGEMENT FOR AVIONICS - ELECTRONIC COMPONENTS FOR AEROSPACE, DEFENCE AND HIGH PERFORMANCE (ADHP) APPLICATIONS - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS
DD IEC PAS 62647-23 : DRAFT AUG 2011	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES
GEIA STD 0003 : 2006	LONG TERM STORAGE OF ELECTRONIC DEVICES
GEIA STD 0006 : 2008	REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS
GEIA STD 0005-1 : 2012	PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
NASA JSC 66491 : 2013	STANDARD FOR JSC LEAD-FREE CONTROL PLANS (LFCP)
J STD 075 : 0	CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES
EN 16602-60-14 : 2014	SPACE PRODUCT ASSURANCE - RELIFING PROCEDURE - EEE COMPONENTS
J STD 001 CHINESE : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
J STD 001 SPANISH : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
J STD 001 FRENCH : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC 7093 : 0	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS

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J STD 033 : C-1

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