Skip to content
Please enter a keyword to search

  • IPC J STD 035 : 0

    View superseded by
    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
    View superseded by

    ACOUSTIC MICROSCOPY FOR NON-HERMETIC ENCAPSULATED ELECTRONIC COMPONENTS

    Available format(s):  Hardcopy

    Superseded date:  11-03-2023

    Language(s):  English

    Published date: 

    Publisher:  Institute of Printed Circuits

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
    2 DEFINITIONS
      2.1 A-mode
      2.2 B-mode
      2.3 Back-Side Substrate View Area
      2.4 C-mode
      2.5 Through Transmission Mode
      2.6 Die Attach View Area
      2.7 Die Surface View Area
      2.8 Focal Length (FL)
      2.9 Focus Plane
      2.10 Leadframe (L/F) View Area
      2.11 Reflective Acoustic Microscope
      2.12 Through Transmission Acoustic Microscope
      2.13 Time-of-Flight (TOF)
      2.14 Top-Side Die Attach Substrate View Area
    3 APPARATUS
      3.1 Reflective Acoustic Microscope System
      3.2 Through Transmission Acoustic Microscope System
    4 PROCEDURE
      4.1 Equipment Setup
      4.2 Perform Acoustic Scans
    Appendix A Acoustic Microscopy Defect Check Sheet
    Appendix B Potential Image Pitfalls
    Appendix C Some Limitations of Acoustic Microscopy
    Appendix D Reference Procedure for Presenting Applicable
               Scanned Data

    Abstract - (Show below) - (Hide below)

    Specifies methods for performing acoustic microscopy on nonhermetic encapsulated electronic components. Gives to users with an acoustic microscopy process flow for detection of defects non-destructively in plastic packages, while achieving reproducibility.

    General Product Information - (Show below) - (Hide below)

    Committee TC 47
    Development Note Jointly published by IPC & JEDEC. (01/2018)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    SAE AS 6294/1 : 2017 REQUIREMENTS FOR PLASTIC ENCAPSULATED MICROCIRCUITS IN SPACE APPLICATIONS
    SAE AS 6294/2 : 2018 REQUIREMENTS FOR PLASTIC ENCAPSULATED MICROCIRCUITS IN MILITARY AND AVIONICS APPLICATIONS
    IEC PAS 62190:2000 Moisture/reflow sensivity classification for nonhermetic solid state surface mount devices
    SAE AS 6171/6 : 2016 TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY ACOUSTIC MICROSCOPY (AM) TEST METHODS
    IEC PAS 62686-1:2011 Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
    IEC TS 62686-1:2015 Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
    IPC J STD 020 CHINESE : D-1 MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES
    IPC M 109 : LATEST COMPONENTS HANDLING MANUAL
    DD IEC PAS 62686-1 : DRAFT JULY 2011 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS
    PD IEC/TS 62686-1:2015 Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors
    MIL-PRF-38534 Revision K:2017 HYBRID MICROCIRCUITS, GENERAL SPECIFICATION FOR

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC M 109 : LATEST COMPONENTS HANDLING MANUAL
    IPC J STD 033C-1:2014 HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
    IPC E 500 : LATEST IPC ELECTRONIC DOCUMENT COLLECTION
    View more information

    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective