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Printed Board Assemblies - Part 6: Evaluation Criteria For Voids In Soldered Joints Of Bga And Lga And Measurement Method
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Available format(s): Hardcopy
Language(s): Japanese
Published date: 20-12-2011
Publisher: Japanese Standards Association
2011(R2016) [20/10/2016]2011 [20/12/2011]
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