MIL-STD-202-211 Base Document:2015
|
METHOD 211, TERMINAL STRENGTH |
MIL-STD-202-302 Base Document:2015
|
METHOD 302, INSULATION RESISTANCE |
MIL-PRF-49470-1 Revision E:2012
|
CAPACITOR, FIXED, CERAMIC DIELECTRIC, SWITCH MODE POWER SUPPLY (GENERAL PURPOSE AND TEMPERATURE STABLE), STANDARD RELIABILITY AND HIGH RELIABILITY, UNENCAPSULATED, HORIZONTALLY STACKED, STYLE PS01 |
MIL-STD-202-210 Base Document:2015
|
METHOD 210, RESISTANCE TO SOLDERING HEAT |
MIL-STD-1276 Revision H:2013
|
Leads for Electronic Component Parts |
MIL-STD-202-305 Base Document:2015
|
METHOD 305, CAPACITANCE |
MIL-I-46058 Revision C:1972
|
Insulating Compound, Electrical (for Coating Printed Circuit Assemblies) |
MIL-STD-202-107 Base Document:2015
|
METHOD 107, THERMAL SHOCK |
MIL-STD-202-106 Base Document:2015
|
METHOD 106, MOISTURE RESISTANCE |
MIL-STD-202-301 Base Document:2015
|
METHOD 301, DIELECTRIC WITHSTANDING VOLTAGE |
MIL-STD-202-215 Base Document:2015
|
METHOD 215, RESISTANCE TO SOLVENTS |
MIL-STD-790 Revision G:2011
|
ESTABLISHED RELIABILITY AND HIGH RELIABILITY QUALIFIED PRODUCTS LIST (QPL) SYSTEMS FOR ELECTRICAL, ELECTRONIC, AND FIBER OPTIC PARTS SPECIFICATIONS |
MIL-STD-202-104 Base Document:2015
|
METHOD 104, IMMERSION |
MIL-STD-202-103 Base Document:2015
|
METHOD 103, HUMIDITY (STEADY STATE) |
MIL-STD-202-108 Base Document:2015
|
METHOD 108, LIFE (AT ELEVATED AMBIENT TEMPERATURE) |
MIL-STD-202-105 Base Document:2015
|
METHOD 105, BAROMETRIC PRESSURE (REDUCED) |
MIL-STD-202-208 Base Document:2015
|
METHOD 208, SOLDERABILITY |
MIL-STD-202 Revision H:2015
|
ELECTRONIC AND ELECTRICAL COMPONENT PARTS |
MIL-PRF-49470-2 Revision E:2013
|
CAPACITOR, FIXED, CERAMIC DIELECTRIC, SWITCH MODE POWER SUPPLY (GENERAL PURPOSE AND TEMPERATURE STABLE), STANDARD RELIABILITY AND HIGH RELIABILITY, ENCAPSULATED, HORIZONTALLY STACKED, STYLE PS02 |
MIL-STD-202-204 Base Document:2015
|
METHOD 204, VIBRATION, HIGH FREQUENCY |
MIL-STD-202-213 Base Document:2015
|
METHOD 213, SHOCK (SPECIFIED PULSE) |