• NEN EN IEC 61189-3 : 2008

    Current The latest, up-to-date edition.

    TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS)

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    Published date:  12-01-2013

    Publisher:  Netherlands Standards

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    Abstract - (Show below) - (Hide below)

    Defines methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

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    Document Type Standard
    Publisher Netherlands Standards
    Status Current
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