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ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN
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Superseded date: 13-03-2015
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Published date: 12-01-2013
Publisher: Netherlands Standards
Describes the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of re-flow solder mounted area array type packages and peripheral terminal type packages.
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