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  • NF EN 61190-1-3 : 2008 AMD 1 2010

    Current The latest, up-to-date edition.

    Fastening materials for electronic assemblies - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solders for electronic soldering applications

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    Published date:  13-07-2018

    Publisher:  Association Francaise de Normalisation

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    Development Note Indice de classement: C90-700-1-3PR. (11/2002) PR NF EN 61190-1-3 February 2006. (02/2006) PR NF EN 61190-1-3 November 2017. (12/2017)
    Document Type Standard
    Publisher Association Francaise de Normalisation
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    NF EN 62025-2 : 2005 HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS
    NF EN 62137-1-5 : 2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-5: MECHANICAL SHEAR FATIGUE TEST
    NF EN 61189-5 : 2008 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
    NF EN 62137-1-4 : 2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-4: CYCLIC BENDING TEST

    Standards Referencing This Book - (Show below) - (Hide below)

    NF EN 61189-6 : 2008 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 6: TEST METHODS FOR MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES
    NF EN 61190-1-2 : 2014 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
    NF EN 60194 : 2006 PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY - TERMS AND DEFINITIONS
    IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    NF EN ISO 9454-2 : 2000 SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 2: PERFORMANCE REQUIREMENTS
    ISO 9454-2:1998 Soft soldering fluxes Classification and requirements Part 2: Performance requirements
    NF EN 61190-1-1 : 2002 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY
    ISO 9454-1:2016 Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
    IEC 61189-6:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
    IEC 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
    NF EN ISO 9453 : 2014 SOFT SOLDER ALLOYS - CHEMICAL COMPOSITIONS AND FORMS
    IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    ISO 9001:2015 Quality management systems — Requirements
    ISO 9453:2014 Soft solder alloys Chemical compositions and forms
    NF EN 2199454-1 : 1994 SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 1: CLASSIFICATION, LABELLING AND PACKAGING
    NF EN ISO 9001 : 2015 QUALITY MANAGEMENT SYSTEMS - REQUIREMENTS
    NF EN 61189-5 : 2008 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
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