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  • NF EN 61249 8-8 : 1998

    Current The latest, up-to-date edition.

    MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 8: TEMPORARY POLYMER COATINGS

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    Published date:  12-01-2013

    Publisher:  Association Francaise de Normalisation

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    Table of Contents - (Show below) - (Hide below)

    AVANT-PROPOS
    INTRODUCTION
    1 Domaine d'application
    2 Référence normative
    3 Propriétés
    4 Conteneurs et leur marquage
    A Tableau de conversion
    ANNEXE ZA - Autres publications internationales citées dans
                la présente norme avec les références des
                publications européennes correspondantes

    Abstract - (Show below) - (Hide below)

    La présente spécification détaille à l'intérieur de la série CEI 61249 les exigences concernant l'homologation des revêtements amovibles de réserve de brasure. Dans cette spécification ceux-ci sont désignés par le terme masque, du fait qu'ils peuvent être aisément enlevés. Les exigences pour l'homologation des revêtements permanents de réserve de brasure en polymère sont données dans la CEI 61249-8-5 qui a été utilisée, autant que possible, comme modèle dans l'élaboration de la présente spécification.

    General Product Information - (Show below) - (Hide below)

    Development Note Indice de classement: C93-748 (03/2007)
    Document Type Standard
    Publisher Association Francaise de Normalisation
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    HD 323.2.20 : 200S3 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    EN 62326-4-1:1997 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability Detail Specification - Performance levels A, B and C
    IEC 61189-1:1997+AMD1:2001 CSV Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
    EN 61189-3:2008 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
    IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
    NFC 20 720 : 87 AMD 1 1988 BASIC ENVIRONMENTAL TESTING PROCEDURES - TEST METHODS - TEST T - SOLDERING
    IEC 62326-4-1:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C
    EN 61189-1 : 97 AMD 1 2001 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 1: GENERAL TEST METHODS AND METHODOLOGY
    IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
    EN 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
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