Development Note
|
Indice de classement: C93-707-20. (07/2016) |
Document Type
|
Standard |
ISBN
|
|
Pages
|
|
Published
|
|
Publisher
|
Association Francaise de Normalisation
|
Status
|
Current |
IEC 61189-3:2007
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
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