NF EN 62326 4-1 : 1998

Current

Current The latest, up-to-date edition.

PRINTED BOARDS - PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION - SECTION 1: CAPABILITY DETAIL SPECIFICATION PERFORMANCE LEVELS A, B AND C

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Published date: 12-01-2013

Publisher: Association Francaise de Normalisation

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AVANT-PROPOS
1 Domaine d'application
2 Références normatives
3 Composant pour l'agrément de savoir-faire (CQC)
4 Agrément de savoir-faire
5 Démonstration du savoir-faire
6 Carte de démonstration du savoir-faire (CTB)
Figures
Annexes
A Acronymes relatifs à l'IECQ et leur explication
B Tableau de conversion
C Bibliographie
ANNEXE ZA Autres publications internationales citées dans la
présente norme avec les références des publications
européennes correspondantes

Abstract - (Show below) - (Hide below)

La présente spécification particulière d'agrément (Cap DS) est basée sur la CEI 2326-4. Elle concerne les cartes imprimées multicouches rigides avec connexions transversales.

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Development Note	Indice de classement: C93-708-1. (11/2003)
Document Type	Standard
ISBN
Pages
Published
Publisher	Association Francaise de Normalisation
Status	Current

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
EN 62326-4-1:1997	Identical
IEC 62326-4-1:1996	Identical

Standards Referencing This Book - (Show below) - (Hide below)

HD 323.2.20 : 200S3	BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING
IEC 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
NFC 20 723 : LATEST
IEC 60249-3-3:1991	Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
IEC 62326-1:2002	Printed boards - Part 1: Generic specification
IEC 62326-4:1996	Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
IEC 60068-2-38:2009	Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test
HD 323.2.3 : 200S2	BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST CA - DAMP HEAT, STEADY STATE
IEC 60068-2-3:1969	Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state
IEC 61189-3:2007	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
NFC 20 720 : 87 AMD 1 1988	BASIC ENVIRONMENTAL TESTING PROCEDURES - TEST METHODS - TEST T - SOLDERING
HD 323.2.38 : 200S1	BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TESTS Z/AD: COMPOSITE TEMPERATURE/HUMIDITY CYCLIC TEST

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