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  • NF EN ISO 9455-17 : 2006

    Current The latest, up-to-date edition.

    SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES

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    Published date:  12-01-2013

    Publisher:  Association Francaise de Normalisation

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    Table of Contents - (Show below) - (Hide below)

    Avant-propos
    1 Domaine d'application
    2 Références normatives
    3 Principe
    4 Réactifs
    5 Appareillage
    6 Controle des coupons d'essai
    7 Préparation des échantillons
    8 Mode opératoire
    9 Évaluation
    10 Précision
    11 Rapport d'essai
    Annexe A (informative) Lignes directrices sur l'essai
             de RIS
    Annexe B (informative) Essai au peigne et essai de
             migration électrochimique de résistance
             d'isolement de surface des résidus de
             flux - Rapport d'essai de qualification
    Bibliographie

    Abstract - (Show below) - (Hide below)

    Describes a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) solders.

    General Product Information - (Show below) - (Hide below)

    Development Note Indice de classement: A81-365-17 PR NF EN ISO 9455-17 March 2006 (03/2006)
    Document Type Standard
    Publisher Association Francaise de Normalisation
    Status Current
    View more information

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