1. SCOPE
2. REFERENCES
3. DESCRIPTION OF THE METHODOLOGY/PROCEDURE - MICROCIRCUITS,
HYBRIDS, DIODES, AND TRANSISTORS
4. DESCRIPTION OF THE PROCEDURE - RESISTORS, CAPACITORS,
INDUCTORS, FILTERS, CONNECTORS, CABLES, FUSES, TRANSFORMERS
(PASSIVE DEVICES)
5. TEST EQUIPMENT, TEST SAMPLES, AND CALIBRATION
6. DETAILED REQUIREMENTS
7. ALTERNATE PACKAGE/MATERIAL TYPES
8. NOTES
APPENDIX A - DECAPSULATION AND PHOTO-DOCUMENTATION EXAMPLES
APPENDIX B - VISUAL ANOMALY EXAMPLES
APPENDIX C - UNACCEPTABLE DECAPSULATION RESULTS
APPENDIX D - PROFICIENCY SAMPLE QUESTIONS (FOR INTERNAL USE ONLY)