• SN EN 61191-1 : 1998

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION: REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES

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    Withdrawn date:  25-06-2016

    Language(s): 

    Published date:  12-01-2013

    Publisher:  Swiss Standards

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    Table of Contents - (Show below) - (Hide below)

    Contents
    Clause
    1. Scope
    2. Normative references
    3. Terms and definitions
    4. General requirements
        4.1 Order of precedence
        4.2 Interpretation of requirements
        4.3 Classification
        4.4 Defects and process deviation indicators (PDIs)
        4.5 Process control requirements
        4.6 Requirements flowdown
        4.7 Physical designs
        4.8 Visual aids
        4.9 Proficiency of personnel
        4.10 Electrostatic discharge (ESD)
        4.11 Facilities
        4.12 Assembly tools and equipment
    5. Materials requirements
        5.1 Solder
        5.2 Flux
        5.3 Solder paste
        5.4 Preform solder
        5.5 Adhesives
        5.6 Cleaning agents
        5.7 Polymeric coatings
        5.8 Chemical strippers
        5.9 Heat shrinkable soldering devices
    6. Components and printed board requirements
        6.1 Solderability
        6.2 Solderability maintenance
        6.3 Solder purity maintenance
        6.4 Lead preparation
    7. Assembly process requirements
        7.1 Cleanliness
        7.2 Part markings and reference designations
        7.3 Solder connection contours
        7.4 Moisture traps
        7.5 Thermal dissipation
    8. Assembly soldering requirements
        8.1 General
        8.2 Reflow soldering
        8.3 Mechanized immersion soldering (non-reflow)
        8.4 Manual/hand soldering
    9. Cleanliness requirements
        9.1 Equipment and material compatibility
        9.2 Pre-soldering cleaning
        9.3 Post-soldering cleaning
        9.4 Cleanliness verification
        9.5 Cleanliness criteria
    10. Assembly requirements
        10.1 Acceptance requirements
        10.2 General assembly requirements
    11. Coating and encapsulation
        11.1 Conformal coating
        11.2 Encapsulation
    12. Rework and repair
        12.1 Rework of unsatisfactory soldered electrical and
             electronic assemblies
        12.2 Repair
        12.3 Post rework/repair cleaning
    13. Product quality assurance
        13.1 Inspection methodology
        13.2 Process control
    14. Other requirements
        14.1 Health and safety
        14.2 Special manufacturing requirements
        14.3 Guidance on requirement flowdown
    Annexes
    A Requirements for soldering tools and equipment
    B Qualification of fluxes
    C Quality assessment
    D Bibliography
    ZA Normative references to international publications with
    their corresponding European publications

    Abstract - (Show below) - (Hide below)

    Gives requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies that use surface mounted and relating assembly technologies. Included also, are recommendations for good manufacturing processes.

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    Document Type Standard
    Publisher Swiss Standards
    Status Withdrawn
    Superseded By
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