SN EN ISO 9455-17 : 2006

Current

Current The latest, up-to-date edition.

SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES

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Published date: 12-01-2013

Publisher: Swiss Standards

Table of Contents - (Show below) - (Hide below)

Foreword
1 Scope
2 Normative references
3 Principle
4 Reagents
5 Apparatus
6 Inspection of test coupons
7 Sample preparation
8 Procedure
9 Assessment
10 Precision
11 Test report
Annex A (informative) SIR testing guidance
Annex B (informative) Surface insulation resistance comb
test and electrochemical migration test of flux
residues - Qualification test report
Bibliography

Abstract - (Show below) - (Hide below)

Describes a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) solders.

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Document Type	Standard
ISBN
Pages
Published
Publisher	Swiss Standards
Status	Current

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
I.S. EN ISO 9455-17:2006	Identical
EN ISO 9455-17:2006	Identical
UNE-EN ISO 9455-17:2007	Identical
UNI EN ISO 9455-17 : 2007	Identical
ISO 9455-17:2002	Identical
DIN EN ISO 9455-17:2006-09	Identical
BS EN ISO 9455-17:2006	Identical

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