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Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) (Endorsed by AENOR in July of 2008.)
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Available format(s): Hardcopy, PDF
Language(s): English
Published date: 01-07-2008
Publisher: Asociacion Espanola de Normalizacion
This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands.
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