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  • BS 123600-003:2001

    Current The latest, up-to-date edition.

    System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  17-12-2001

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    Foreword
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Capability qualifying component
    5 Range of capability approval
    6 Capability test program
    7 Additional capability
    8 Traceability
    Annex A (normative) Use of ANSI/IPC A-600F
    Bibliography

    Abstract - (Show below) - (Hide below)

    Describes capability qualifying components, its characteristics to tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic and additional capability in relation to flex-rigid multiplayer printed boards with through-connections.

    Scope - (Show below) - (Hide below)

    This British Standard specifies the capability qualifying component, its characteristics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic and additional capability, in relation to flex-rigid multilayer printed boards with through-connections. It is applicable for flex-rigid multilayer printed boards with through-connections made with the materials and surface finishes specified in clause 4.

    This British Standard is a capability detail specification intended for use with the IECQ system of quality assessment for electronic components.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/501
    Development Note To be read in conjunction with BS 123000(2001) and BS 123600(2001). Supersedes 01/204163 DC. (01/2002)
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS 123600:2001 System of quality assessment. Sectional specification. Flex-rigid multilayer printed boards with through-connections

    Standards Referencing This Book - (Show below) - (Hide below)

    BS EN ISO 3543:2001 Metallic and non-metallic coatings. Measurement of thickness. Beta backscatter method
    BS 123600:2001 System of quality assessment. Sectional specification. Flex-rigid multilayer printed boards with through-connections
    IEC 60249-2-11:1987 Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards
    BS 123000:2001 System of quality assessment. Generic specification. Printed boards
    BS EN 60249-2-13:1994 Base material for printed circuits. Specifications Flexible copper-clad polyimide film, general purpose grade
    IEC 60249-2-8:1987 Base materials for printed circuits. Part 2: Specifications. Specification No. 8: Flexible copper-clad polyester (PETP) film
    BS 2011-2.1Ca:1977 Environmental testing. Tests Test Ca. Damp heat, steady state
    BS 123200:2001 System of quality assessment. Sectional specification. Rigid double-sided printed boards with plated-through holes
    IEC 60068-2-3:1969 Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state
    BS 6221-2:1991 Printed wiring boards Methods of test
    BS 4584-103.1:1990 Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board
    IEC 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
    BS EN 60249-2-15:1994 Specifications Flexible copper-clad polyimide film, of defined flammability
    BS EN 60249-2-8:1995 Specifications Specification for flexible copper-clad polyester (PETP) film
    BS EN 123000:1992 Harmonized system of quality assessment for electronic components. Generic specification: printed boards
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    IEC 60249-2-15:1987 Base materials for printed circuits. Part 2: Specifications. Specification No. 15: Flexible copper-clad polyimide film, of defined flammability
    BS EN ISO 1463:2004 Metallic and oxide coatings. Measurement of coating thickness. Microscopical method
    BS 4727-1:GRP11(1991) : 1991 GLOSSARY OF ELECTROTECHNICAL, POWER, TELECOMMUNICATION, ELECTRONICS, LIGHTING AND COLOUR TERMS - TERMS COMMON TO POWER, TELECOMMUNICATIONS AND ELECTRONICS - PRINTED CIRCUITS
    IEC 60249-2-13:1987 Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade
    BS 123500-003:2001 System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections
    BS EN 60249-2-11:1994 Specifications Specification for thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards
    IEC 60249-2-12:1987 Base materials for printed circuits - Part 2: Specifications - Specification No 12: Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards
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