• BS 5772-6(1984) : 1984

    Current The latest, up-to-date edition.

    SPECIFICATION FOR ELECTROMECHANICAL COMPONENTS FOR ELECTRONIC EQUIPMENT: BASIC TESTING PROCEDURES AND MEASURING METHODS - CLIMATIC TESTS AND SOLDERING TESTS

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-1984

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    National foreword
    Committees responsible
    Scope
    Section one - Climatic tests
    1 Test 11a: Climatic sequence
    2 Test 11b: Combined/sequential cold, low air
                   pressure and damp heat
    3 Test 11c: Damp heat, steady state
    4 Test 11d: Rapid change of temperature
    5 Test 11e: Mould growth
    6 Test 11f: Corrosion, salt mist
    7 Test 11g: Corrosion, industrial atmosphere (under
                   consideration)
    8 Test 11h: Sand and dust (under consideration)
    9 Test 11i: Dry heat
    10 Test 11j: Cold
    11 Test 11k: Low air pressure
    12 Test 11m: Damp heat, cyclic
    13 Test 11n: Gas tightness, solderless wrapped
                   connections
    Section two - Soldering tests
    14 Test 12a: Solderability, wetting, solder bath
                   method
    15 Test 12b: Solderability, wetting, iron method
    16 Test 12c: Solderability, dewetting
    17 Test 12d: Resistance to soldering heat, solder bath
                   method
    18 Test 12e: Resistance to soldering heat, iron method

    Abstract - (Show below) - (Hide below)

    Gives climatic tests and soldering tests to be carried out when called for by the detail specification, for electromechanical components. Applicable to similar devices when specified in a detail specification. Includes sections on climatic sequence, combined sequential cold, low air pressure and damp heat, damp heat, steady state, rapid change of temperature, mould growth, corrosion, salt mist, corrosion, industrial atmosphere, sand and dust, dry heat, cold, low air pressure, damp heat, cyclic, gas tightness, solderless wrapped connections, solderability, wetting, solder bath method, solderability, wetting, iron method, solderability, dewetting, resistance to soldering heat, solder bath method and resistance to soldering heat, iron method.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/48
    Development Note Also numbered as IEC 60512-6 Supersedes 78/27031 DC, BS 5772-6(1979) and BS 5772-6:SUPP1(1981) (08/2005) Reviewed and confirmed by BSI, June 2007. (05/2007)
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS 6516-1(1984) : 1984 AMD 9506 SOLDERLESS CONNECTIONS - SPECIFICATION FOR SOLDERLESS WRAPPED CONNECTIONS (INCLUDING TEST METHODS AND PRACTICAL GUIDANCE)
    BS CECC75101(1984) : 1984 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - EXAMPLE DETAIL SPECIFICATION/BLANK DETAIL SPECIFICATION - TWO-PART AND EDGE SOCKET CONNECTORS FOR PRINTED BOARD APPLICATION
    BS QC960300(1992) : 1992 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRONIC EQUIPMENT - SECTIONAL SPECIFICATION FOR SENSITIVE SWITCHES
    BS 6516-2(1990) : 1990 SOLDERLESS CONNECTIONS - SPECIFICATION FOR SOLDERLESS CRIMPED CONNECTIONS (INCLUDING TEST METHODS AND PRACTICAL GUIDANCE)
    BS QC960400(1992) : 1992 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRONIC EQUIPMENT - SECTIONAL SPECIFICATION FOR PUSHBUTTON SWITCHES
    BS EN 175100 : 1993 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SECTIONAL SPECIFICATION: TWO PART AND EDGE SOCKET CONNECTORS FOR PRINTED BOARD APPLICATIONS
    BS 5772-1(1985) : 1985 BASIC TESTING PROCEDURES AND MEASURING METHODS FOR ELECTROMECHANICAL COMPONENTS FOR ELECTRONIC EQUIPMENT - GENERAL
    BS QC960000(1992) : 1992 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRONIC EQUIPMENT - GENERIC SPECIFICATION

    Standards Referencing This Book - (Show below) - (Hide below)

    BS 2011-2.1T(1981) : 1981 ENVIRONMENTAL TESTING - TESTS - TEST T - SOLDERING
    BS 2011-2.1A(1977) : AMD 4574 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TESTS A. COLD
    BS 2011-2.1B(1977) : 1977 ENVIRONMENTAL TESTING - TESTS - TEST B. DRY HEAT
    BS 2011-2.1DB(1981) : 1981 ENVIRONMENTAL TESTING - TESTS - TEST DB AND GUIDANCE: DAMP HEAT, CYCLIC (12 + 12 HOUR CYCLE)
    BS 5772-1(1979) : LATEST
    BS 2011-2.1CA(1977) : 1977 ENVIRONMENTAL TESTING - TESTS - TEST CA - DAMP HEAT, STEADY STATE
    BS 2011-2.1J(1977) : LATEST
    BS 5772-2:1979 BASIC TESTING PROCEDURES AND MEASURING METHODS FOR ELECTROMECHANICAL COMPONENTS FOR ELECTRONIC EQUIPMENT - GENERAL EXAMINATION AND CONTACT RESISTANCE TESTS, INSULATION TESTS AND VOLTAGE STRESS TESTS
    BS 5772-5(1979) : 1979 BASIC TESTING PROCEDURES AND MEASURING METHODS FOR ELECTROMECHANICAL COMPONENTS FOR ELECTRONIC EQUIPMENT - IMPACT TESTS, STATIC LOAD TESTS, ENDURANCE TESTS AND OVERLOAD TESTS
    BS 2011-2.1Z/AMD(1977) : 1977 ENVIRONMENTAL TESTING - TESTS - TEST Z/AMD. COMBINED SEQUENTIAL COLD, LOW AIR PRESSURE AND DAMP HEAT TEST
    BS 2011-2.1M(1984) : 1984 ENVIRONMENTAL TESTING - TESTS - TEST M: LOW AIR PRESSURE
    BS 2011-2.1KA(1982) : 1982 BASIC ENVIRONMENTAL TESTING PROCEDURES - PART 2.1: TESTS - TEST KA: SALT MIST
    BS 6516-1(1984) : 1984 AMD 9506 SOLDERLESS CONNECTIONS - SPECIFICATION FOR SOLDERLESS WRAPPED CONNECTIONS (INCLUDING TEST METHODS AND PRACTICAL GUIDANCE)
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