• BS CECC50000(1987) : 1987

    Current The latest, up-to-date edition.

    HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - GENERIC SPECIFICATION: DISCRETE SEMICONDUCTOR DEVICES

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-1987

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    Foreword
    Preface and implementation
    Section 1 - Scope
    Section 2 - General
    2.1 Order of precedence
    2.2 Related documents
    2.3 Units, symbols and terminology
    2.4 Preferred values of ratings and characteristics
    2.5 Marking
    2.5.1 Terminal identification
    2.5.2 Type designation
    2.5.3 Manufacturer's name or trade-mark
    2.5.4 Date code system
    2.6 Ordering information
    Section 3 - Quality assessment procedures
    3.1 Manufacturing stages and conditions for
            manufacturer's approval
    3.2 Definition of production lot
    3.3 Structurally similar devices
    3.4 Qualification and capability approval procedures
    3.4.1 Qualification approval procedure
    3.4.2 Capability approval procedure (App. VII)
    3.5 Quality conformance inspection
    3.5.1 Division into Groups and Sub-groups
    3.5.2 Inspection requirements
    3.5.3 Supplementary procedures for reduced inspection
    3.5.4 Sampling requirements for small lot or for
            expensive devices
    3.5.5 Certified test records
    3.5.6 Delivery of devices subjected to destructive or
            non-destructive tests
    3.5.7 Delayed deliveries
    3.5.8 Supplementary procedure for deliveries
    3.5.9 Unchecked parameters (additional information)
    3.5.10 Screening
    Section 4 - Test and measurement conditions
    4.1 Standard conditions for testing
    4.2 Visual examination
    4.2.1 Visual inspection
    4.2.2 Dimensions
    4.2.3 Permanence of marking (see 4.4.12)
    4.3 Electrical measurements
    4.3.1 Alternative methods
    4.3.2 Precision of measurement
    4.3.3 Measurements at high temperature
    4.3.4 Methods for electrical measurements
    4.4 Climatic and mechanical tests
    4.4.1 Storage at high temperature
    4.4.2 Damp heat, cyclic
    4.4.3 Damp heat, steady state
    4.4.4 Change of temperature
    4.4.5 Shock
    4.4.6 Vibration
    4.4.7 Solderability
    4.4.8 Resistance to soldering heat
    4.4.9 Robustness of terminations
    4.4.10 Sealing
    4.4.11 Acceleration, steady state
    4.4.12 Immersion in cleaning solvents
    4.5 Electrical endurance tests
    4.5.1 General
    4.5.2 Usual test procedures
    4.5.3 Accelerated test procedures
    Appendices
    I Structural similarity
    II-A General inspection requirements for transistors
            and diodes (excluding rectifier diodes)
    II-B General inspection requirements for rectifier
            diodes and transistors
    III Tables of dimensions to be checked in Group B
            and Group C inspection
    IV Directions of applied forces for mechanical
            tests
    V Description of non-IEC methods of electrical
            measurements
    VI Screening
    VII Capability approval procedure

    Abstract - (Show below) - (Hide below)

    Applies to discrete semiconductor devices, namely diodes, transistors, rectifier diodes and thyristors. Excludes stacks or assemblies made with these components, some devices of high power and devices when only small quantities are required.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/47
    Development Note Supersedes BS CECC50000(1981), 85/24275 DC, 87/27234 DC, 90/23185 DC, 91/26544 DC, 90/34421 DC, 91/26546 DC, 91/21095 DC, 91/21094 DC & BS 9300(1969). (01/2006)
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 117000:1997 Harmonized system of quality assessment for electronic components. Generic specification. Solid state all-or-nothing relays. Generic data and methods of test
    BS EN 150006:1993 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION - VARIABLE CAPACITANCE DIODE(S)
    BS EN 150001:1993 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION: GENERAL PURPOSE SEMICONDUCTOR DIODES
    BS EN 150004:1993 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. BLANK DETAIL SPECIFICATION: BIPOLAR TRANSISTORS FOR SWITCHING APPLICATIONS
    BS E9375:1975 SPECIFICATION - HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION: VOLTAGE REGULATOR DIODES AND VOLTAGE REFERENCE DIODES EXCLUDING PRECISION-VOLTAGE TEMPERATURE-COMPENSATED REFERENCE DIODES
    BS EN 150012:1993 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION - SINGLE GATE FIELD-EFFECT TRANSISTORS
    BS EN 150007:1993 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. BLANK DETAIL SPECIFICATION: CASE RATED BIPOLAR TRANSISTORS FOR HIGH FREQUENCY AMPLIFICATION
    BS CECC50000:SUPP1(1983) : 1983 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - GENERIC SPECIFICATION: DISCRETE SEMICONDUCTOR DEVICES - CECC ASSESSED PROCESS AVERAGE
    BS CECC 50009(1982) : 1982 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION: CASE-RATED RECTIFIER DIODES
    BS EN 150013:1993 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION: CURRENT REGULATOR AND CURRENT REFERENCE DIODES
    BS EN 150003:1993 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION: CASE-RATED BIPOLAR TRANSISTORS FOR LOW FREQUENCY AMPLIFICATION
    BS EN 116205-116206/116207 : 1996 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION - HERMETICALLY SEALED RELAYS - FOR SEVERE STATIC ENVIRONMENTAL CONDITIONS (116205) - FOR SEVERE MOBILE ENVIRONMENTAL CONDITIONS (116206) - FOR SEVERE AIRBORNE ENVIRONMENTAL CONDITIONS (116207)
    BS EN 150014:1997 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION: THYRISTOR DIODES, TRANSIENT OVERVOLTAGE SUPPRESSORS
    BS EN 116303:1996 Harmonized system of quality assessment for electronic components. Blank detail specification: electromechanical all-or-nothing heavy load relays of assessed quality (hermetically sealed, 5A to 25A)
    BS EN 150011:1993 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION: CASE-RATED THYRISTORS
    BS E9372:1976 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION: AMBIENT-RATED BIPOLAR TRANSISTORS FOR LOW AND HIGH FREQUENCY AMPLIFICATION
    BS EN 150010 : 1993 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION: AMBIENT RATED THYRISTORS
    BS CECC 50008(1982) : 1982 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - BLANK DETAIL SPECIFICATION: AMBIENT-RATED RECTIFIER DIODES
    EN 150012 : 1991 Blank Detail Specification: Single gate field-effect transistors

    Standards Referencing This Book - (Show below) - (Hide below)

    BS 9000-1(1971) : LATEST
    CECC 00109 : 1974 CECC RULES OF PROCEDURE: RP 9: CERTIFIED TESTS RECORDS
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    CECC 00112 : 82 AMD 4 CECC RULES OF PROCEDURE: RP 12: VOTING PROCEDURES
    BS 4760(1971) : 1971 SPECIFICATION FOR NUMBERING OF WEEKS
    IEC 60068-2-27:2008 Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock
    IEC 60134:1961 Rating systems for electronic tubes and valves and analogous semiconductor devices
    BS 9300(1969) : 1969 SPECIFICATION FOR SEMICONDUCTOR DEVICES OF ASSESSED QUALITY: GENERIC DATA AND METHODS OF TEST
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    CECC 00102 : 86 AMD 1 91 CECC RULES OF PROCEDURE: RP 2: ADMINISTRATION PROCEDURES - ORGANISATION OF THE CECC GENERAL SECRETARIAT - CECC FINANCIAL ADMINISTRATION
    BS E9007:1975 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: BASIC SPECIFICATION: SAMPLING PLANS AND PROCEDURES FOR INSPECTION BY ATTRIBUTES
    CECC 00103 : 1990 CECC RULES OF PROCEDURE: RP 3: THE ELECTRONIC COMPONENTS QUALITY ASSURANCE COMMITTEE (ECQAC)
    IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
    CECC 00104 : 89 AMD 3 93 CECC RULES OF PROCEDURE: RP 4: CECC WORKING GROUPS - GENERAL RULES - ADDITIONAL RULES
    CECC 00101 : 91 AMD 2 93 CECC RULES OF PROCEDURE: RP 1: THE CENELEC ELECTRONICS COMPONENTS COMMITTEE (CECC)
    BS 2045:1965 PREFERRED NUMBERS
    IEC 60068-2-38:2009 Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test
    IEC 60410:1973 Sampling plans and procedures for inspection by attributes
    BS 4727(1971) : LATEST
    IEC 60068-2-3:1969 Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state
    IEC 60068-2-17:1994 Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing
    IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
    BS 3363(1968) : LATEST
    IEC 60068-2-2a:1976 Supplement A - Basic environmental testing procedures - Part 2: Tests - Tests B: Dry heat
    CECC 00111 : 80 AMD 3 CECC RULES OF PROCEDURE: RP 11: SPECIFICATIONS AND THEIR HARMONIZATION - COMPONENTS FOR GENERAL AND PROFESSIONAL USAGE - COMPONENTS OF ENHANCED ASSESSMENT OF QUALITY
    CECC 00106 : 1991 CECC RULES OF PROCEDURE: RP 6: METHODS OF AMENDING THE RULES OF PROCEDURE OF THE SYSTEM
    BS 5555(1976) : LATEST SI UNITS AND RECOMMENDATIONS FOR THE USE OF THEIR MULTIPLES AND OF CERTAIN OTHER UNITS
    BS 3934(1965) : 1965 SPECIFICATION FOR DIMENSIONS OF SEMICONDUCTOR DEVICES AND INTEGRATED ELECTRONIC CIRCUITS
    BS 5775-1(1993) : 1993 SPECIFICATION FOR QUANTITIES, UNITS AND SYMBOLS - SPACE AND TIME
    IEC 60148:1969 Letter symbols for semiconductor devices and integrated microcircuits
    CECC 00108 : 94 AC 98 RULE OF PROCEDURE 8 (ATTESTATION OF CONFORMITY) - PART 1: THE CECC MARK AND CONDITIONS OF USE - PART 2: CERTIFICATES OF APPROVAL - PART 3: PROCEDURES FOR THE ATTESTATION OF CONFORMITY
    CECC 00105 : 1989 CECC RULE OF PROCEDURE: RP 5: CECC MEMBERSHIP REGISTER
    BS 3939(1966) : LATEST
    IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
    CECC 00007 : 1978 BASIC SPECIFICATION: SAMPLING PLANS AND PROCEDURES FOR INSPECTION BY ATTRIBUTES
    BS 2011(1967) : LATEST
    BS 6001(1972) : AMD 5054 SAMPLING PROCEDURES FOR INSPECTION BY ATTRIBUTES - SPECIFICATION FOR SAMPLING PLANS INDEXED BY ACCEPTABLE QUALITY LEVEL (AQL) FOR LOT - BY - LOT INSPECTION
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