• BS EN IEC 61190-1-3:2018

    Current The latest, up-to-date edition.

    Attachment materials for electronic assembly Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  28-03-2018

    Publisher:  British Standards Institution

    Add To Cart

    Scope - (Show below) - (Hide below)

    This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for \'special\' electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control document and is not intended to relate directly to the material\'s performance in the manufacturing process.

    Special electronic grade solders include all solders which do not fully comply with the requirements of standard solder alloys and solder materials listed herein. Examples of special solders include anodes, ingots, preforms, bars with hook and eye ends, and multiple-alloy solder powders.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/501
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes
    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective