DIN EN 61191-3:2018-05

Current

Current The latest, up-to-date edition.

PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES

Available format(s): Hardcopy, PDF

Language(s): German

Published date: 14-07-2018

Publisher: German Institute for Standardisation (Deutsches Institut für Normung)

Table of Contents - (Show below) - (Hide below)

1 Allgemeines
  1.1 Anwendungsbereich
  1.2 Klassifizierung
2 Normative Verweisungen
3 Durchsteck-Montagetechnik (THT)
4 Durchsteckmontage von Bauelementen
  4.1 Genauigkeit der Positionierung
  4.2 Anforderungen an Durchsteck-Bauelemente
5 Annahmeanforderungen
  5.1 Regelung und Korrekturmassnahmen
  5.2 Löten von Bauelementeanschlussdrähten für die
      Durchsteckmontage
6 Nacharbeit von unzureichenden Lötverbindungen
Anhang A (normativ) Anforderungen an die Bestückung
         mit durchsteckmontierbaren Bauelementen
Anhang ZA (normativ) Normative Verweisungen auf
          Internationale Publikationen mit ihren
          entsprechenden Europäischen Publikationen

Abstract - (Show below) - (Hide below)

Gives requirements for lead and hole solder assembly. These pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that also include other relating technologies (i.e. chip mounting, surface mount, terminal mounting)

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Document Type	Standard
ISBN
Pages
Published
Publisher	German Institute for Standardisation (Deutsches Institut für Normung)
Status	Current

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
EN 61191-3:2017	Identical

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