• DIN EN ISO 9453 E : 2014

    Current The latest, up-to-date edition.

    SOFT SOLDER ALLOYS - CHEMICAL COMPOSITIONS AND FORMS (ISO 9453:2014)

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2014

    Publisher:  German Institute for Standardisation (Deutsches Institut für Normung)

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    Table of Contents - (Show below) - (Hide below)

    National foreword
    Foreword
    Introduction
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Chemical composition
    5 Forms of delivery
    6 Sampling and analysis
    7 Marking, labelling and packaging
    Annex A (informative) - Comparison between alloy
            numbers in ISO 9453 and short names and
            chemical compositions according to
            IEC 61190-1-3
    Annex B (informative) - Patented alloys and patent
            holder list
    Bibliography

    Abstract - (Show below) - (Hide below)

    Defines the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.

    General Product Information - (Show below) - (Hide below)

    Development Note Supersedes DIN EN 29453 E. (05/2007)
    Document Type Standard
    Publisher German Institute for Standardisation (Deutsches Institut für Normung)
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    DIN 50930-6 E : 2013 CORROSION OF METALS - CORROSION OF METALLIC MATERIALS UNDER CORROSION LOAD BY WATER INSIDE OF PIPES, TANKS AND APPARATUS - PART 6: EVALUATION PROCESS AND REQUIREMENTS REGARDING THE HYGIENIC SUITABILITY IN CONTACT WITH DRINKING WATER

    Standards Referencing This Book - (Show below) - (Hide below)

    ISO 3677:2016 Filler metal for soldering and brazing — Designation
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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