• DOD-STD-2000-2 Revision A:1986

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    PART AND COMPONENT MOUNTING FOR HIGH QUALITY/HIGH RELIABILITY SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES

    Available format(s):  PDF

    Superseded date:  17-10-1994

    Language(s): 

    Published date: 

    Publisher:  US Military Specs/Standards/Handbooks

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    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
      1.1 Applicability
    2 REFERENCED DOCUMENTS
      2.1 Government documents
           2.1.1 Specifications, standards and handbooks
      2.2 Other publications
    3 DEFINITIONS
      3.1 Terms and definitions
    4 GENERAL REQUIREMENTS
      4.1 Conflict
      4.2 Design
           4.2.1 Design requirements information
      4.3 Solder processes and processing
      4.4 Soldered connections
      4.5 Hybrid microelectronic modules and assemblies
      4.6 Electrostatic discharge
      4.7 Component positioning
      4.8 Visibility of markings
      4.9 Part marking and reference designations
      4.10 Interference spacing
      4.11 Part clearance spacing
      4.12 Piggybacking
      4.13 Lead forming
           4.13.1 Lead malforming limits
           4.13.2 Tempered leads
      4.14 Jumper wires
      4.15 Insulation clearance
      4.16 Eyelets
      4.17 Resins and other adhesives
    5 DETAIL REQUIREMENTS
      5.1 Mounting of parts and components
           5.1.1 Parts and components mounted to printed wiring
                  boards
           5.1.2 Terminal board mountings
           5.1.3 Mounting to terminals
    6 NOTES
      6.1 Supersession note
      6.2 Changes from previous issue
      6.3 Subject term (key word listing)
      6.4 Use of metric units
    INDEX
    INDEX OF REFERENCED DOCUMENTS

    Abstract - (Show below) - (Hide below)

    Specifies mounting for electrical and electronic components and wiring in aircraft, guided missiles, satellites, ammunition and weapon systems, shipboard weapon systems, ground vehicle equipment, and program critical ground support equipment.

    General Product Information - (Show below) - (Hide below)

    Committee AREA SOLD
    Development Note A NOTICE 1 - Notice of Cancellation/Superseded by MIL STD 2000 (11/2003)
    Document Type Standard
    Publisher US Military Specs/Standards/Handbooks
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    DOD-STD-2000-1 Revision B:1986 SOLDERING TECHNOLOGY, HIGH QUALITY/HIGH RELIABILITY
    DOD STD 2000/3 : A NOTICE 1 CRITERIA FOR HIGH QUALITY/HIGH RELIABILITY SOLDERING TECHNOLOGY
    MIL-C-28809 Revision B:1988 CIRCUIT CARD ASSEMBLIES, RIGID, FLEXIBLE & RIGID FLEX
    MIL-STD-1547 Revision B:1992 ELECTRONIC PARTS, MATERIALS, AND PROCESSES FOR SPACE VEHICLES

    Standards Referencing This Book - (Show below) - (Hide below)

    DOD STD 2000/3 : A NOTICE 1 CRITERIA FOR HIGH QUALITY/HIGH RELIABILITY SOLDERING TECHNOLOGY
    MIL-STD-2118 Base Document:1984 FLEXIBLE AND RIGID FLEX PRINTED WIRING FOR ELECTRONIC EQUIPMENT DESIGN REQUIREMENTS FOR
    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
    MIL C 55365/4 : D CAPACITORS, CHIP, FIXED, TANTALUM, ESTABLISHED RELIABILITY, STYLES CWR06 AND CWR09
    MIL-STD-275 Revision E:1984 PRINTED WIRING - ELECTRONIC EQUIPMENT
    DOD STD 1686 : 0 ELECTROSTATIC DISCHARGE CONTROL PROGRAM FOR PROTECTION OF ELECTRICAL AND ELECTRONIC PARTS ASSEMBLIES AND EQUIPMENT (EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES)(METRIC)
    DOD-STD-2000-1 Revision B:1986 SOLDERING TECHNOLOGY, HIGH QUALITY/HIGH RELIABILITY
    MIL-M-38510 Revision J:1991 MICROCIRCUITS, SPECIFICATION FOR
    MS21266 Revision E:1981 GROMMET PLASTIC EDGING
    DOD HDBK 263 : LATEST ELECTROSTATIC DISCHARGE CONTROL HANDBOOK FOR PROTECTION OF ELECTRICAL AND ELECTRONIC PARTS, ASSEMBLIES AND EQUIPMENT (EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES)METRIC
    MIL-STD-1389 Revision D:1989 DESIGN REQUIREMENTS FOR STANDARD ELECTRONIC MODULES
    MIL R 55342 : C RESISTORS, FIXED, FILM, CHIP, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
    MIL P 50884 : E PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX, GENERAL SPECIFICATION FOR
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