• I.S. EN IEC 61189-2-807:2021

    Current The latest, up-to-date edition.

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA (IEC 61189-2-807:2021)

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  03-11-2021

    Publisher:  National Standards Authority of Ireland

    For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Test specimens
    5 Test apparatus
    6 Test procedure
    7 Report
    Bibliography

    Abstract - (Show below) - (Hide below)

    This part of IEC 61189 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).

    General Product Information - (Show below) - (Hide below)

    Committee TC 91
    Document Type Test Method
    Product Note The date of any NSAI previous adoption may not match the date of its original CEN/CENELEC document.
    Publisher National Standards Authority of Ireland
    Status Current
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