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    I.S. EN IEC 61189-5-601:2021

    Current The latest, up-to-date edition.

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards (IEC 61189-5-601:2021)

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  30-03-2021

    Publisher:  National Standards Authority of Ireland

    For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
    Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

    Dates of withdrawal of national standards are available from NSAI.

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Grouping of soldering processes and related test severities
    5 Specimens
    6 Apparatus and equipment
    7 Tg1 Solder joint initial quality after reflow
    8 Tg2 warpage of component and printed boards in reflow process
    9 Tg3 Resistance to soldering heat of printed boards
    10 Tg4 Wetting and dewetting of a printed-board land
    11 Tg5 Resistance to dissolution of a printed-board land
    12 Tg6 Pull strength of the test substrate land
    Annex A (informative) Test process items and meaning of processing contents and condition
    Bibliography

    Abstract - (Show below) - (Hide below)

    This part of IEC 61189 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed boards, and the reflow soldering ability test method for the lands of organic rigid printed boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or lead-free alloys.

    General Product Information - (Show below) - (Hide below)

    Committee TC 91
    Document Type Test Method
    Product Note The date of any NSAIprevious adoption may not matchthe date of its original CEN/CENELEC document<br>
    Publisher National Standards Authority of Ireland
    Status Current
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