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  • IEC 60068-2-44:1995

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Superseded date:  13-05-2016

    Language(s): 

    Published date:  30-01-1995

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    SECTION 1: GENERAL
    1 Scope
    2 Normative references
    SECTION 2: GENERAL PRINCIPLES
    3 Introduction
    4 Solderability of components and wettability of their
       terminations
    5 Place of solderability in environmental testing
    6 Solderability tests
    7 Wettability tests
    8 Explanations of the test conditions
    9 Requirements and the statistical character of results
    SECTION 3: GUIDE TO THE USE OF THE WETTING BALANCE FOR
               SOLDERABILITY TESTING
    10 General
    11 Characteristics of test apparatus
    12 Examples of representative force-time curves
    13 Parameters to be measured from the force-time trace
    Annex ZA (normative) Other international publications quoted
                         in this standard with the references of
                         the relevant European publications

    Abstract - (Show below) - (Hide below)

    Provides background information and recommendations for writers of specifications containing references to IEC 60068-2-20, IEC 60068-2-54 and IEC 60068-2-58.The contents of the corrigendum of August 1995 have been included in this copy.

    General Product Information - (Show below) - (Hide below)

    Committee TC 91
    Development Note Also numbered as BS EN 60068-2.44. (09/2005) Stability Date: 2017. (07/2015)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Superseded
    Superseded By
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    16/30353588 DC : 0 BS EN 61020-1 ED 3.0 - ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    BS EN 165000-1:1996 Film and hybrid integrated circuits Generic specification. Capability approval procedure
    14/30309696 DC : 0 BS EN 60068-2-69 ED 3.0 - ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
    EN 50461:2006 Solar cells - Datasheet information and product data for crystalline silicon solar cells
    EN 62137:2004/corrigendum:2005 ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN
    IEC 62137:2004 Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
    BS EN 62137:2004 Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
    05/30134155 DC : DRAFT MAY 2005 EN 50461 - SOLAR CELLS - DATASHEET INFORMATION AND PRODUCT DATA FOR CRYSTALLINE SILICON SOLAR CELLS
    BS IEC 60748-23-1:2002 Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification Generic specification
    UNE-EN 61020-1:2011 Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification
    IEC 60748-23-1:2002 Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification
    I.S. EN 60068-2-54:2006 ENVIRONMENTAL TESTING - PART 2-54: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD
    IEC 62137-4:2014 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
    BS 9752:1989 Blank detail specification for fixed insulated (unshielded) r.f. inductors suitable for surface mounting at the full assessment level
    11/30243259 DC : 0 BS EN 60068-2-58 ED.4 - ENVIRONMENTAL TESTING - PART 2-58: TESTS TD- TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
    PD 6521:1988 Summaries of test methods for environmental testing of electrotechnical products
    BS EN 60068-2-54:2006 Environmental testing Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
    I.S. EN 165000-1:1998 FILM AND HYBRID INTEGRATED CIRCUITS - PART 1: GENERIC SPECIFICATION CAPABILITY APPROVAL PROCEDURE
    CEI EN 60068-2-54 : 2007 ENVIRONMENTAL TESTING - PART 2: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD
    IEC 60300-3-5:2001 Dependability management - Part 3-5: Application guide - Reliability test conditions and statistical test principles
    I.S. EN 61020-1:2009 ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    I.S. EN 62137:2005 ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN
    IEC 61020-1:2009 Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification
    IEC 61747-1:1998+AMD1:2003 CSV Liquid crystal and solid-state display devices - Part 1: Generic specification
    12/30271778 DC : 0 BS EN 62137-4 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES
    BS EN 62137-4:2014 Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
    11/30243576 DC : DRAFT FEB 2011 BS EN 62643-1 - ELECTROSTATIC MICRO ELECTRO MECHANICAL SYSTEMS (MEMS) OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
    I.S. EN 62137-4:2014 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES
    BS EN 61020-1:2009 Electromechanical switches for use in electrical and electronic equipment Generic specification
    13/30264596 DC : 0 BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER
    13/30264600 DC : 0 BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID
    BS 2011-4.2:1984 Environmental testing. Miscellaneous Guidance on the application of the tests of BS 2011 to simulate the effects of storage
    BS EN 50461:2006 Solar cells. Datasheet information and product data for crystalline silicon solar cells
    NF EN 50461 : 2006 SOLAR CELLS - DATASHEET INFORMATION AND PRODUCT DATA FOR CRYSTALLINE SILICON SOLAR CELLS
    IEC 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
    EN 165000-1:1996 Film and hybrid integrated circuits - Part 1: Generic specification - Capability approval procedure
    EN 62137-4:2014/AC:2015 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES (IEC 62137-4:2014)
    EN 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
    EN 61020-1:2009 Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    IEC 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
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