• IEC 60068-2-58:2015+AMD1:2017 CSV

    Current The latest, up-to-date edition.

    Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English

    Published date:  28-07-2017

    Publisher:  International Electrotechnical Committee

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