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  • IEC 60191-1C:1974

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    Mechanical standardization of semiconductor devices - Part 1: Preparation of drawings of semiconductor devices - Third supplement

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Superseded date:  24-04-2007

    Language(s):  English - French

    Published date:  01-01-1974

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    PREFACE
    Clause
    1 Example of dimensioning for a circular base
      outline with no tab and having four terminals
      located symmetrically on a pitch circle
      1.1 Interpretation of the principle of dimensioning
      1.2 Checking
    2 Example of dimensioning for a circular base outline
      with a tab and having four terminals located
      symmetrically on a pitch circle
      2.1 Interpretation of the principle of dimensioning
      2.2 Checking
    FIGURES

    Abstract - (Show below) - (Hide below)

    Deals with new rules to be used for specifying lead dimensions and positions on a circular base drawing.

    General Product Information - (Show below) - (Hide below)

    Committee TC 47/SC 47D
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    IEC 61747-1:1998+AMD1:2003 CSV Liquid crystal and solid-state display devices - Part 1: Generic specification
    IEC 60191-6-6:2001 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
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