• IEC 60191-2U:1997

    Current The latest, up-to-date edition.

    Nineteenth supplement

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French

    Published date:  09-05-1997

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    Foreword
    Preface
    Chapter 00
    Philosophy of Mechanical Standardization
    Chapter 0
    Recommended Values for Certain Dimensions of Drawings of
    Semiconductor Devices
    Chapter I
    Device Outline Drawings
    Types of Semiconductor Devices Generally Mounted in the
    Packages of Chapter I
    Chapter II
    Base Drawings
    Chapter III
    Case Outline Drawings
    Chapter IV
    Gauge Drawings
    Chapter V
    Tables Showing Associations Between Case Outlines and Bases
    Obsolete Drawings
    Additions to the Lists of National Codes Appearing on the Standard
    Sheets of IEC Publication 60191-2
    Deletions to the Lists of National Sheets of IEC Publication 60191-2NO CONTENTS SECTION

    Abstract - (Show below) - (Hide below)

    Incorporated into main document IEC 60191 PT2.

    General Product Information - (Show below) - (Hide below)

    Development Note This standard is part of the Consolidated edition of IEC 60191 PT2 1966 but can be purchased separately. Stability Date: 2020. (07/2015)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    IEC 61747-1:1998+AMD1:2003 CSV Liquid crystal and solid-state display devices - Part 1: Generic specification
    IEC 60191-6-6:2001 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
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