BS IEC 60191-1:2007
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Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of discrete devices |
EN IEC 60191-1:2018
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Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices |
BS EN 60191-3:2000
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Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of integrated circuits |
07/30169763 DC : 0
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BS EN 62515 - EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA |
BS EN 62258-1:2010
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Semiconductor die products Procurement and use |
I.S. EN 60191-6:2009
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MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES |
OVE/ONORM EN 60191-1 : 2007
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MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES |
I.S. EN 62258-1:2010
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SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
I.S. EN 61360-4:2005
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STANDARD DATA ELEMENT TYPES WITH ASSOCIATED CLASSIFICATION SCHEME FOR ELECTRIC COMPONENTS - PART 4: IEC REFERENCE COLLECTION OF STANDARD DATA ELEMENT TYPES AND COMPONENT CLASSES |
EN 60191-6-20:2010
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Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) |
EN 61360-4:2005/corrigendum:2005
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STANDARD DATA ELEMENT TYPES WITH ASSOCIATED CLASSIFICATION SCHEME FOR ELECTRIC COMPONENTS - PART 4: IEC REFERENCE COLLECTION OF STANDARD DATA ELEMENT TYPES AND COMPONENT CLASSES |
EN 61360-1:2017
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Standard data element types with associated classification scheme - Part 1: Definitions - Principles and methods |
EN 62258-1:2010
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Semiconductor die products - Part 1: Procurement and use |
09/30206176 DC : DRAFT JUNE 2009
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BS EN 62137-3 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS |
BS EN 60191-6:2009
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Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
05/30132033 DC : DRAFT APR 2005
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IEC 60191-6-13 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP TYPE SOCKET FOR FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY (FBGA/FLGA) |
BS EN 60191-6-21:2010
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Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP) |
BS EN 61360-4:2005
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Standard data element types with associated classification scheme for electric components IEC reference collection of standard data element types and component classes |
01/206130 DC : DRAFT AUG 2001
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IEC 62258 - SEMICONDUCTOR DIE PRODUCTS - MINIMUM REQUIREMENTS FOR PROCUREMENT AND USE - PART 1: GENERAL REQUIREMENTS - MECHANICAL, MATERIAL AND CONNECTIVITY |
I.S. EN 60191-1:2007
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MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES |
I.S. EN 61360-1:2017
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STANDARD DATA ELEMENT TYPES WITH ASSOCIATED CLASSIFICATION SCHEME - PART 1: DEFINITIONS - PRINCIPLES AND METHODS |
08/30190026 DC : 0
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I.S. EN 60191-6-20:2010
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MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-20: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE J-LEAD PACKAGES (SOJ) |
CEI EN 60191-1 : 2008
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MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES |
NF EN 60191-6-21 : 2011
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MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-21: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE PACKAGES (SOP) |
BS EN 60191-6-2:2002
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Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages |
NF EN 60191-6-20 : 2011
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MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-20: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE J-LEAD PACKAGES (SOJ) |
CEI EN 60191-6-21 : 2011
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MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-21: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE PACKAGES (SOP) |
BS IEC 60748-11:2000
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Semiconductor devices. Integrated circuits Sectional specification for semiconductor integrated circuits excluding hybrid circuits |
05/30132036 DC : DRAFT APR 2005
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IEC 60191-6-16 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TEST AND BURN-IN SOCKET FOR BGA, LGA, FBGA AND FLGA |
14/30294564 DC : 0
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BS EN 61360-1 - STANDARD DATA ELEMENTS TYPES WITH ASSOCIATED CLASSIFICATION SCHEME FOR ELECTRIC ITEMS - PART 1: DEFINITIONS - PRINCIPLES AND METHODS |
BS QC790100(1991) : 1991 AMD 10586
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HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SEMICONDUCTOR DEVICES - SECTIONAL SPECIFICATION FOR SEMICONDUCTOR INTEGRATED CIRCUITS EXCLUDING HYBRID CIRCUITS |
IEC 60191-1:2018
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Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices |
I.S. EN 60191-6-16:2007
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MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TESTS AND BURN-IN SOCKETS FOR BGA, LGA, FBGA AND FLGA |
IEC 60748-11:1990
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Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits |
IEC 60191-6-16:2007
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Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA |
CEI EN 60191-6-20 : 2011
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MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-20: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE J-LEAD PACKAGES (SOJ) |
BS EN 60191-6-20:2010
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Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ) |
BS EN 60191-6-16:2007
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Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA |
I.S. EN 60191-6-21:2010
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MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-21: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE PACKAGES (SOP) |
05/30129010 DC : DRAFT FEB 2005
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IEC 60191-1 ED.2 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES |
CEI EN 61360-1 : 2013
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STANDARD DATA ELEMENT TYPES WITH ASSOCIATED CLASSIFICATION SCHEME FOR ELECTRIC ITEMS - PART 1: DEFINITIONS - PRINCIPLES AND METHODS |
I.S. EN IEC 60191-1:2018
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MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES |
CEI EN 60191-6 : 2011
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MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES |
IEC 61360-1:2017
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Standard data element types with associated classification scheme - Part 1: Definitions - Principles and methods |
IEC 60191-6:2009
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Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
IEC 60191-3:1999
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Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits |
IEC 60191-6-21:2010
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Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) |
IEC 61747-1:1998+AMD1:2003 CSV
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Liquid crystal and solid-state display devices - Part 1: Generic specification |
IEC 60191-6-20:2010
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Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) |
BS EN 61360-1:2017
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Standard data element types with associated classification scheme Definitions. Principles and methods |
IEC 60191-6-6:2001
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Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA) |
IEC 61360-4:2005
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Standard data element types with associated classification scheme for electric components - Part 4: IEC reference collection of standard data element types and component classes |
EN 60191-3:1999
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Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits |
13/30284029 DC : 0
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BS EN 60191-6-16 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TESTS AND BURN-IN SOCKETS FOR BGA, LGA, FBGA AND FLGA |
CEI EN 60191-6-16 : 2008
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MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TESTS AND BURN-IN SOCKETS FOR BGA, LGA, FBGA AND FLGA |
BS 3934-6:1992
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Mechanical standardization of semiconductor devices Specification for the preparation of outline drawings of surface mounted semiconductor device packages |
08/30190030 DC : 0
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BS EN 60191-6-21 ED.1 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-21: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE PACKAGES (SOP) |
07/30167960 DC : 0
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BS EN 60191-6 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES |
IEC 62258-1:2009
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Semiconductor die products - Part 1: Procurement and use |
CEI EN 62258-1 : 2011
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SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
EN 60191-6:2009
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Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
EN 60191-6-16:2007
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Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA |
EN 60191-1:2007
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Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices |
EN 60191-6-21 : 2010
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MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-21: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE PACKAGES (SOP) |