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  • IEC 60191-5:1997

    Current The latest, up-to-date edition.

    Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French

    Published date:  23-04-1997

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Terms and definitions
    3 Description of tape automated bonding (TAB)
    4 Dimensional requirements
        4.1 Film format
        4.2 Alignment holes
        4.3 Body size
        4.4 Test pad patterns
        4.5 Outer lead patterns
        4.6 Maximum lead count
    5 Variation codes
    6 Requirements for inner and outer lead bonding (ILB and
        OLB)
    Figures
    Tables
    Notes to figures and tables
    Annexes
    A Summary of recommended TAB package configurations
        (super format)
    B Summary of recommended TAB package configurations
        (wide format)
    C Outer lead numbering
    D Test pad numbering

    Abstract - (Show below) - (Hide below)

    Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.

    General Product Information - (Show below) - (Hide below)

    Committee TC 47/SC 47D
    Development Note Also numbered as BS 3934-5(1997) (07/2005) Stability Date: 2020. (09/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 60191-6-2:2002 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
    IEC 61747-1:1998+AMD1:2003 CSV Liquid crystal and solid-state display devices - Part 1: Generic specification
    IEC 60191-6-6:2001 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
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