• IEC 60512-12-3:2006

    Current The latest, up-to-date edition.

    Connectors for electronic equipment - Tests and measurements - Part 12-3: Soldering tests - Test 12c: Solderability, de-wetting

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French, Spanish, Castilian

    Published date:  13-02-2006

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope and object
    2 Normative references
    3 Applicability
    4 Preparations
    5 Method
    6 Details to be specified

    Abstract - (Show below) - (Hide below)

    Defines a standard test method to assess the ability of the terminations of a connector to remain covered with solder when being brought into contact with molten solder under specified conditions.

    General Product Information - (Show below) - (Hide below)

    Committee TC 48/SC 48B
    Development Note To be read in conjunction with IEC 60512-1 and IEC 60512-1-100. (02/2006) Stability Date: 2017. (10/2012)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60512-12-1:2006 Connectors for electronic equipment - Tests and measurements - Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method
    IEC 60512-12-2:2006 Connectors for electronic equipment - Tests and measurements - Part 12-2: Soldering tests - Test 12b: Solderability, wetting, soldering iron method
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    IEC 60512-1-1:2002 Connectors for electronic equipment - Tests and measurements - Part 1-1: General examination - Test 1a: Visual examination
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