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  • IEC 60747-12-2:1995

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    Semiconductor devices - Part 12: Optoelectronic devices - Section 2: Blank detail specification for laser diode modules with pigtail for fibre optic systems and sub-systems

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Withdrawn date:  15-02-2005

    Language(s):  English - French

    Published date:  18-07-1995

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Mechanical description
    2 Short description
    3 Categories of assessed quality
    4 Limiting values (absolute maximum rating system)
       common to all applications
    5 Electrical characteristics
    6 Marking
    7 Ordering information
    8 Test conditions and inspection requirements
    9 Group D - Qualification approval tests
    10 Additional information (not for inspection purposes)

    Abstract - (Show below) - (Hide below)

    Specifies quality assessment methods in a way that electronic components released by one participating country as complying with the requirements of an applicable specification are equally accepted in all other participating countries without further testing being necessary.

    General Product Information - (Show below) - (Hide below)

    Development Note Also numbered as BS QC720102(1997) (08/2005)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Withdrawn

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 61751:1998 Laser modules used for telecommunication. Reliability assessment
    BS EN 61709:2017 Electric components. Reliability. Reference conditions for failure rates and stress models for conversion
    I.S. EN 61751:1999 LASER MODULES USED FOR TELECOMMUNICATION - RELIABILITY ASSESSMENT
    UTEC 80 810 : 2005 RELIABILITY DATA HANDBOOK - UNIVERSAL MODEL FOR RELIABILITY PREDICTION OF ELECTRONICS COMPONENTS, PCBS AND EQUIPMENT
    IEC 61709:2017 RLV Electric components - Reliability - Reference conditions for failure rates and stress models for conversion
    EN 61709:2017 Electric components - Reliability - Reference conditions for failure rates and stress models for conversion
    IEC 61709 : 3.0 ELECTRIC COMPONENTS - RELIABILITY - REFERENCE CONDITIONS FOR FAILURE RATES AND STRESS MODELS FOR CONVERSION
    PD IEC TR 62380:2004 Reliability data handbook. Universal model for reliability prediction of electronics components, PCBs and equipment
    I.S. EN 61709:2017 ELECTRIC COMPONENTS - RELIABILITY - REFERENCE CONDITIONS FOR FAILURE RATES AND STRESS MODELS FOR CONVERSION
    IEC 61751:1998 Laser modules used for telecommunication - Reliability assessment
    IEC 61747-1:1998+AMD1:2003 CSV Liquid crystal and solid-state display devices - Part 1: Generic specification
    EN 61751:1998 Laser modules used for telecommunication - Reliability assessment
    IEC TR 62380:2004 Reliability data handbook - Universal model for reliability prediction of electronics components, PCBs and equipment
    IEC 61709:2017 Electric components - Reliability - Reference conditions for failure rates and stress models for conversion

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60747-12:1991 Semiconductor devices - Part 12: Sectional specification foroptoelectronic devices
    IEC 60747-10:1991 Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits
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