• IEC 60747-4-2:2000

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    Semiconductor devices - Discrete devices - Part 4-2: Microwave diodes and transistors - Integrated-circuit microwave amplifiers - Blank detail specification

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Withdrawn date:  31-12-2021

    Language(s):  English

    Published date:  07-04-2000

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Marking and ordering information
       1.1 Marking
       1.2 Ordering information
    2 Application-related description
    3 Specification of the function
    4 Limiting values (absolute maximum rating system)
    5 Operating conditions (within the specified operating
       ambient or case temperature range)
       5.1 Power supply voltage
       5.2 Power supply current
       5.3 Input power (where appropriate)
       5.4 Voltage and/or current at another or other
            terminal(s) (where appropriate)
       5.5 External element(s) (where appropriate)
       5.6 Operating frequency range
       5.7 Operating temperature range
    6 Electrical characteristics
       6.1 Static characteristics
       6.2 AC characteristics
    7 Programming
    8 Mechanical and environmental ratings, characteristics
       and data
    9 Additional information
       9.1 Block diagram
       9.2 Recommendation for any associated device(s)
       9.3 Effects of temperature
       9.4 Handling precautions, or electrostatic-sensitive
            device(s)
       9.5 Internal protection
       9.6 Application data
    10 Screening
    11 Quality assessment procedures
       11.1 Qualification approval procedure
       11.2 Capability approval procedure
    12 Structural similarity procedures
    13 Test conditions and inspection requirements
       13.1 General
       13.2 Sampling requirements and formation of inspection
            lots
       13.3 Inspection tables
       13.4 Delayed delivery
    14 Additional measurement method

    Abstract - (Show below) - (Hide below)

    Aims to define quality assessment procedures in such a manner that electronic components released by one participating country as conforming to the requirements of an applicable specification are equally acceptable in all other participating countries without the need for further testing.

    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Withdrawn

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60747-4:2007+AMD1:2017 CSV Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors
    IEC 60747-10:1991 Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits
    IEC 60748-11:1990 Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
    IEC 60068-2-17:1994 Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing
    IEC 60747-1:2006+AMD1:2010 CSV Semiconductor devices - Part 1: General
    IEC 60749:1996+AMD1:2000+AMD2:2001 CSV Semiconductor devices - Mechanical and climatic test methods
    IEC 60748-2-10:1994 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 10: Blank detail specification for integrated circuit dynamic read/write memories
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