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  • IEC 60748-21-1:1997

    Current The latest, up-to-date edition.

    Semiconductor devices - Integrated circuits - Part 21-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approva lprocedures

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French

    Published date:  10-04-1997

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    INTRODUCTION
    Clause
    1. Characteristics and conditions of use
    2. Recommended methods of mounting
    3. Marking
    4. Ordering information
    5. Certified records of released lots
    6. Additional information
    7. Additional or increased severities or requirements
        to those specified in the generic and/or sectional
        specification
    8. Inspection requirements (see tables 2 and 3 or 4
        and 5)
    9. Supplement - Tables of method B
    Tables
    1. Where a range of circuits
    2. Method A - Groups A and B - Lot-by-Lot
    3a. Method A - Group C - Periodic tests
    3b. Method A - Group D - Periodic tests
    4a. Method B - Group A - Lot-by-Lot
    4b. Method B - Group B - Lot-by-Lot
    5a. Method B - Group C - Periodic tests
    5b. Method B - Group D - Periodic tests

    General Product Information - (Show below) - (Hide below)

    Committee TC 47/SC 47A
    Development Note Also numbered as BS QC 760101(1997). (09/2003) Supersedes IEC 60186B. (07/2004) Stability Date: 2020. (09/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    IEC 61747-1:1998+AMD1:2003 CSV Liquid crystal and solid-state display devices - Part 1: Generic specification
    View more information

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